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DuPont and Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End Printed Circuit Board Technology Development

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DuPont (NYSE: DD) and Zhen Ding Technology Group have signed a strategic cooperation agreement to advance printed circuit board (PCB) technology development. The partnership aims to enhance end-user applications, advance R&D, improve material performance, and promote sustainable development in the electronics sector. The companies will collaborate on smart manufacturing, corporate governance, and sustainability initiatives. DuPont, a leader in advanced interconnects and thermal management, will leverage its expertise in chip fabrication and packaging solutions, while Zhen Ding contributes its technical expertise in the global PCB industry.

DuPont (NYSE: DD) e Zhen Ding Technology Group hanno firmato un accordo di cooperazione strategica per avanzare nello sviluppo della tecnologia dei circuiti stampati (PCB). L’obiettivo della partnership è migliorare le applicazioni per gli utenti finali, promuovere la ricerca e sviluppo, migliorare le prestazioni dei materiali e favorire uno sviluppo sostenibile nel settore elettronico. Le aziende collaboreranno su iniziative di smart manufacturing, governance aziendale e sostenibilità. DuPont, leader negli interconnettori avanzati e nella gestione termica, sfrutterà la sua esperienza nella fabbricazione e nel confezionamento dei chip, mentre Zhen Ding contribuirà con la sua competenza tecnica nell'industria globale dei PCB.

DuPont (NYSE: DD) y Zhen Ding Technology Group han firmado un acuerdo de cooperación estratégica para avanzar en el desarrollo de la tecnología de placas de circuito impreso (PCB). La asociación tiene como objetivo mejorar las aplicaciones para los usuarios finales, impulsar la I+D, mejorar el rendimiento de los materiales y promover el desarrollo sostenible en el sector de la electrónica. Las empresas colaborarão en manufactura inteligente, gobernanza corporativa e iniciativas de sostenibilidad. DuPont, líder en interconexiones avanzadas y gestión térmica, aprovechará su experiencia en la fabricación de chips y soluciones de empaquetado, mientras que Zhen Ding aportará su experiencia técnica en la industria global de PCB.

듀폰 (NYSE: DD)젠딩 테크놀로지 그룹은 인쇄 회로 기판(PCB) 기술 개발을 촉진하기 위한 전략적 협력 계약을 체결했습니다. 파트너십의 목표는 최종 사용자 애플리케이션을 향상시키고, 연구 및 개발을 진행하며, 재료 성능을 개선하고, 전자 산업에서 지속 가능한 개발을 촉진하는 것입니다. 두 회사는 스마트 제조, 기업 거버넌스 및 지속 가능성 이니셔티브에 협력할 것입니다. 듀폰은 첨단 인터커넥트 및 열 관리 분야의 선두주자로서, 칩 제작 및 포장 솔루션에 대한 전문성을 활용할 것이고, 젠딩은 글로벌 PCB 산업에서의 기술 전문성을 기여할 것입니다.

DuPont (NYSE: DD) et Zhen Ding Technology Group ont signé un accord de coopération stratégique pour faire progresser le développement de la technologie des circuits imprimés (PCB). L'objectif du partenariat est d'améliorer les applications pour les utilisateurs finaux, de faire avancer la recherche et développement, d'améliorer la performance des matériaux et de promouvoir un développement durable dans le secteur de l'électronique. Les entreprises collaboreront sur la fabrication intelligente, la gouvernance d'entreprise et des initiatives de durabilité. DuPont, leader dans les interconnexions avancées et la gestion thermique, mettra à profit son expertise dans la fabrication et les solutions d'emballage de puces, tandis que Zhen Ding apportera son savoir-faire technique dans l'industrie mondiale des PCB.

DuPont (NYSE: DD) und Zhen Ding Technology Group haben eine strategische Kooperationsvereinbarung unterzeichnet, um die Entwicklung der Technologie von gedruckten Schaltungen (PCB) voranzutreiben. Das Ziel der Partnerschaft besteht darin, die Anwendungen für Endbenutzer zu verbessern, Forschung und Entwicklung voranzutreiben, die Materialleistung zu verbessern und nachhaltige Entwicklung im Elektroniksektor zu fördern. Die Unternehmen werden bei Smart Manufacturing, Unternehmensführung und Initiativen zur Nachhaltigkeit zusammenarbeiten. DuPont, ein führendes Unternehmen im Bereich fortschrittlicher Verbindungen und thermisches Management, wird sein Fachwissen in der Chipfertigung und Verpackungslösungen einbringen, während Zhen Ding sein technisches Know-how in der globalen PCB-Industrie beisteuert.

Positive
  • Strategic partnership with a leading PCB manufacturer strengthens DuPont's market position
  • Expansion of presence in the growing Asian electronics market
  • Enhanced capabilities in advanced computing and AI solutions development
Negative
  • None.

Insights

This strategic partnership positions DuPont strategically in the high-growth PCB market, particularly as demand surges for advanced computing and AI applications. The collaboration with Zhen Ding, a major PCB manufacturer, strengthens DuPont's competitive position in Asia and provides direct access to a significant customer base. The focus on smart manufacturing and R&D in advanced materials could accelerate product development cycles and improve market responsiveness. While specific financial terms aren't disclosed, this alliance has strong potential to drive growth in DuPont's Electronics & Industrial segment, especially in emerging technologies like AI and automotive electronics. The partnership's emphasis on sustainability also aligns with increasing ESG demands from investors and customers.

The partnership represents a significant strengthening of DuPont's supply chain positioning in Asia, particularly important given recent global supply chain disruptions. Zhen Ding's manufacturing expertise combined with DuPont's materials innovation creates a more resilient and integrated supply chain for advanced PCB production. This vertical integration approach could lead to improved margins through operational efficiencies and better inventory management. The focus on smart manufacturing suggests potential cost reductions and quality improvements in the production process. This strategic move helps DuPont secure its position in the critical Asian electronics manufacturing ecosystem while potentially reducing supply chain risks.

SHENZEN, China, Oct. 29, 2024 /PRNewswire/ -- DuPont (NYSE: DD) and Zhen Ding Technology Group (Zhen Ding) (4958-TW) announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology. The signing ceremony, held yesterday at the Shenzhen Avary Time Center, was attended by Charles Shen, Chairman, Zhen Ding; Yi Zhang, President of the Asia Pacific Region, DuPont; and Thean Ming Tan, Global Business Director for Laminates, DuPont.

Through this strategic partnership, DuPont and Zhen Ding will work to enhance end-user applications, advance cutting-edge research and development, improve material performance, and promote the sustainable development of the electronics sector. Furthermore, they intend to deepen their cooperation in advancing smart manufacturing, corporate governance, and sustainability initiatives.

"As a leader in the global PCB industry, Zhen Ding possesses significant technical expertise and is open to collaborations that drive industry development," said Yi Zhang, President, DuPont Asia Pacific Region. "DuPont is honored to partner with the best in the field to enhance customer service and unlock new innovative possibilities for the global electronics sector."

DuPont is an industry leader in advanced interconnects and thermal management, providing solutions for chip fabrication, packaging, PCBs, and assembly. These solutions are critical for fostering breakthrough innovations vital for advanced computing and artificial intelligence. DuPont is committed to being the partner of choice for its customers, addressing the evolving demands in sectors such as advanced packaging, high-end substrates, AI applications, automotive electronics, high-frequency communications, and data centers. Through materials innovation, DuPont delivers superior quality solutions that empower customers to succeed both now and in the future.

"As a global leader in the electronic materials industry, DuPont possesses robust R&D, reliable quality, manufacturing capabilities, and a stable global supply chain. These are core competencies that Zhen Ding highly values," said Charles Shen, Chairman, Zhen Ding Group. "In this partnership, both parties will integrate their respective resources, collaboratively explore growth opportunities, and exert a positive influence on the industry. Through comprehensive cooperation in the development of new materials and key technologies, we aim to address the industry's demand for the complex performance of advanced PCBs and foster future innovations."

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products, and technical services to enable next-generation technologies. http://electronics.dupont.com/

About DuPont 
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com

About Zhen Ding Technology Holding Limited
Zhen Ding Technology Holding Limited (Taiwan Stock Exchange: 4958) specializes in the research, development, production, and sales variety of products, including flexible printed circuit board (FPC) and surface mount assembly (SMA), substrate-likes PCBs (SLP), high-density interconnect (HDI) PCBs, ultra-thin Mini LED board, multilayer rigid printed circuit boards (RPCB) and IC substrates (ICS). These products are widely used in end products such as computer information, consumer electronics, communications networks, automotive electronics, AI server high-speed computing, optical module and medical applications. The company offers professional one-stop shopping, full-solution services to customer worldwide. For more detailed information, please visit the company website: www.zdtco.com.

DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, ℠ or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted. 

Cautionary Statement about Forward Looking Statements
This communication contains "forward-looking statements" within the meaning of the federal securities laws, including Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended. In this context, forward-looking statements often address expected future business and financial performance and financial condition, and often contain words such as "expect," "anticipate," "intend," "plan," "believe," "seek," "see," "will," "would," "target, "outlook," "stabilization," "confident," "preliminary," "initial," and similar expressions and variations or negatives of these words. All statements, other than statements of historical fact, are forward-looking statements, including statements regarding outlook, expectations and guidance. Forward-looking statements address matters that are, to varying degrees, uncertain and subject to risks, uncertainties, and assumptions, many of which that are beyond DuPont's control, that could cause actual results to differ materially from those expressed in any forward-looking statements.

Forward-looking statements are not guarantees of future results. Some of the important factors that could cause DuPont's actual results to differ materially from those projected in any such forward-looking statements include, but are not limited to: (i) the ability of DuPont to effect the separation transactions described above and to meet the conditions related thereto; (ii) the possibility that the separation transactions will not be completed within the anticipated time period or at all; (iii) the possibility that the separation transactions will not achieve their intended benefits; (iv) the impact of the separation transactions on DuPont's businesses and the risk that the separations may be more difficult, time-consuming or costly than expected, including the impact on DuPont's resources, systems, procedures and controls, diversion of management's attention and the impact and possible disruption of existing relationships with customers, suppliers, employees and other business counterparties; (v) the possibility of disruption, including disputes, litigation or unanticipated costs, in connection with the separation transactions; (vi) the uncertainty of the expected financial performance of DuPont or the separated companies following completion of the separation transactions; (vii) negative effects of the announcement or pendency of the separation transactions on the market price of DuPont's securities and/or on the financial performance of DuPont; (viii) the ability to achieve anticipated capital structures in connection with the separation transactions, including the future availability of credit and factors that may affect such availability; (ix) the ability to achieve anticipated credit ratings in connection with the separation transactions; (x) the ability to achieve anticipated tax treatments in connection with the separation transactions and completed and future, if any, divestitures, mergers, acquisitions and other portfolio changes and the impact of changes in relevant tax and other laws; (xi) risks and uncertainties related to the settlement agreement concerning PFAS liabilities reached June 2023 with plaintiff water utilities by Chemours, Corteva, EIDP and DuPont; (xii) risks and costs related to each of the parties respective performance under and the impact of the arrangement to share future eligible PFAS costs by and between DuPont, Corteva and Chemours, including the outcome of any pending or future litigation related to PFAS or PFOA, including personal injury claims and natural resource damages claims; the extent and cost of ongoing remediation obligations and potential future remediation obligations; changes in laws and regulations applicable to PFAS chemicals; (xiii) indemnification of certain legacy liabilities; (xiv) the failure to realize expected benefits and effectively manage and achieve anticipated synergies and operational efficiencies in connection with the separation transactions and completed and future, if any, divestitures, mergers, acquisitions, and other portfolio management, productivity and infrastructure actions; (xv) the risks and uncertainties, including increased costs and the ability to obtain raw materials and meet customer needs from, among other events, pandemics and responsive actions; (xvi) timing and recovery from demand declines in consumer-facing markets, including in China; (xvii) adverse changes in worldwide economic, political, regulatory, international trade, geopolitical, capital markets and other external conditions; and other factors beyond DuPont's control, including inflation, recession, military conflicts, natural and other disasters or weather-related events, that impact the operations of the company, its customers and/or its suppliers; (xviii) the ability to offset increases in cost of inputs, including raw materials, energy and logistics; (xix) the risks associated with demand and market conditions in the semiconductor industry and associated end markets, including from continuing or expanding trade disputes or restrictions, including on exports to China of U.S.-regulated products and technology; (xx) the risks, including ability to achieve, and costs associated with DuPont's sustainability strategy, including the actual conduct of the company's activities and results thereof, and the development, implementation, achievement or continuation of any goal, program, policy or initiative discussed or expected; (xxi) other risks to DuPont's business and operations, including the risk of impairment; (xxii) the possibility that the Company may fail to realize the anticipated benefits of the $1 billion share repurchase program announced on February 6, 2024 and that the program may be suspended, discontinued or not completed prior to its termination on June 30, 2025;  and (xxiii) other risk factors discussed in DuPont's most recent annual report and subsequent current and periodic reports filed with the U.S. Securities and Exchange Commission. Unlisted factors may present significant additional obstacles to the realization of forward-looking statements. Consequences of material differences in results as compared with those anticipated in the forward-looking statements could include, among other things, business or supply chain disruption, operational problems, financial loss, legal liability to third parties and similar risks, any of which could have a material adverse effect on DuPont's consolidated financial condition, results of operations, credit rating or liquidity. You should not place undue reliance on forward-looking statements, which speak only as of the date they are made. DuPont assumes no obligation to publicly provide revisions or updates to any forward-looking statements whether as a result of new information, future developments or otherwise, should circumstances change, except as otherwise required by securities and other applicable laws.

 

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SOURCE DuPont

FAQ

What is the purpose of DuPont's (DD) strategic agreement with Zhen Ding Technology?

The agreement aims to advance PCB technology development, enhance end-user applications, improve material performance, and promote sustainable development in the electronics sector through collaborative R&D efforts.

What markets will DuPont (DD) target through the Zhen Ding partnership?

The partnership will target advanced packaging, high-end substrates, AI applications, automotive electronics, high-frequency communications, and data centers markets.

How will the DuPont (DD) and Zhen Ding partnership affect PCB technology?

The partnership will combine DuPont's materials expertise with Zhen Ding's PCB manufacturing capabilities to develop advanced PCB technologies and address complex performance requirements.

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