Welcome to our dedicated page for Ceva news (Ticker: CEVA), a resource for investors and traders seeking the latest updates and insights on Ceva stock.
Company Overview
Ceva Inc (NASDAQ: CEVA) is a globally recognized licensor of silicon and software intellectual property (IP) that empowers a more connected, intelligent, and efficient smart edge. By partnering with semiconductor companies and original equipment manufacturers (OEMs), Ceva delivers advanced signal processing and wireless connectivity solutions that serve a diverse range of end markets including mobile, consumer electronics, automotive, industrial applications, and the Internet of Things (IoT).
Core Business Model and Value Proposition
At its core, Ceva specializes in developing and licensing state‑of‑the‑art IP for various signal processing applications. Their offerings encompass a wide spectrum of technologies from ultra‑low‑power digital and analog signal processing to sophisticated edge AI neural processing units (NPUs) and sensor fusion systems. Ceva’s business model is built upon licensing agreements and royalty arrangements. This means that instead of manufacturing end products themselves, they provide IP solutions that semiconductor companies integrate into chip designs, thereby enabling next‑generation devices to operate with greater efficiency and intelligence.
Advanced Wireless Connectivity Solutions
One of the hallmarks of Ceva's expertise is its comprehensive portfolio of wireless connectivity IP. The company’s innovations in Bluetooth, Wi‑Fi, Ultra‑Wideband (UWB), and IEEE 802.15.4 technologies are designed to meet the demanding requirements of low power consumption, high performance, and robust connectivity. These solutions are integral to enabling seamless communication in modern smart devices such as mobile phones, wearables, and IoT sensors. The integration of multi‑protocol connectivity into a single chip significantly reduces design time and cost for OEMs while providing reliable and secure communication across diverse platforms.
Edge AI and Sensor Fusion Capabilities
Ceva has extended its technological reach beyond connectivity to the rapidly evolving area of edge AI. With its Ceva‑NeuPro family of Edge AI NPUs, the company pushes the boundaries of on‑device intelligence. These NPUs are engineered to deliver an optimal balance of ultra‑low power consumption, high performance, and minimal silicon footprint. They are capable of executing complex machine learning tasks, including neural network computations and feature extraction, which are critical for applications ranging from smart audio processing and computer vision to predictive maintenance in industrial environments. Additionally, Ceva’s sensor fusion technologies integrate data from multiple sources to enhance device functionality, accuracy, and responsiveness, creating a more intelligent and autonomous product ecosystem.
Innovation Through Licensing and Partnerships
Ceva’s approach is built on strategic collaborations and deep technical expertise. By establishing long‑term licensing agreements with leading semiconductor companies and OEMs, Ceva ensures broad adoption of its IP across multiple markets. The company’s portfolio is distinguished by its consistent innovation—evident in its support for the latest connectivity standards and its development of integrated multi‑protocol solutions. With an emphasis on reducing time‑to‑market and lowering integration risks, Ceva has positioned itself as a valuable partner for companies looking to quickly evolve in the competitive semiconductor landscape.
Market Impact and Competitive Landscape
In the rapidly evolving world of semiconductor technology and smart edge devices, Ceva stands out as an authoritative provider of essential IP. Its offerings underpin the performance and efficiency of billions of smart devices worldwide. By focusing on a diverse array of applications, from consumer electronics to automotive systems, Ceva not only supports the current market demand but also establishes a foundation for long‑term growth in connectivity and AI integration. The company’s continuous innovation and strategic focus on ultra‑low‑power solutions make it a key competitor in a market where performance, integration, and cost‐effectiveness are of utmost importance.
Technical Excellence and Industry Expertise
Ceva’s products are developed using cutting‑edge design methodologies and are tailored to meet the specific needs of modern electronic design. Their IP solutions feature advanced digital signal processing (DSP) architectures, highly efficient wireless protocol stacks, and scalable AI processing capabilities. This technical excellence is supported by a team of experts who bring deep industry experience in solving complex design challenges. The company’s ability to integrate a wide range of functionalities—such as connectivity, audio/voice processing, vision, and edge AI—into a single IP offering is a testament to its technical prowess and innovative drive.
Comprehensive Portfolio and Ecosystem Integration
Ceva’s portfolio is perhaps its greatest strength. It encompasses a vast array of IP solutions that serve as the building blocks for modern smart edge devices. From integrated wireless connectivity subsystems that simplify the design process to AI NPUs that enable local processing of machine learning models, every component is engineered to deliver optimal balance between performance and power consumption. By focusing on modular, highly configurable architectures, Ceva allows its customers to tailor its IP to a wide range of applications—a critical factor in today’s fast‑paced technology market.
Ensuring Reliability and Efficiency
The company’s deep engagement in the smart edge ecosystem ensures that its solutions are rigorously tested and continually refined to meet evolving industry standards. Ceva’s commitment to providing robust, scalable, and reliable IP is reflected in its longstanding relationships with multiple semiconductor giants worldwide. This trust is built on transparency, technical excellence, and a proven track record of delivering innovative products that facilitate the creation of more intelligent, interconnected devices.
Conclusion
In summary, Ceva Inc embodies technological innovation and operational excellence in the semiconductor IP market. Its extensive portfolio covering advanced wireless connectivity, cutting‑edge edge AI NPUs, and versatile sensor fusion solutions is instrumental in powering a vast range of smart edge devices. Through strategic partnerships, continuous innovation, and a focus on ultra‑low‑power designs, Ceva drives the evolution of modern electronics, establishing a powerful framework for secure, efficient, and high‑performance connectivity across multiple industries.
Additional Insights
- Industry Keywords: Wireless connectivity IP, edge AI, smart edge, IoT integration.
- Technical Focus: Ultra‑low‑power processing, DSP architectures, sensor fusion, multi‑protocol wireless solutions.
- Market Positioning: Strategic licensor, enabler of connectivity and on‑device intelligence, industry collaborator.
This detailed overview provides a comprehensive look at how Ceva leverages its technological expertise to create value in the semiconductor and smart edge industries, driving product innovation and operational efficiency without reliance on traditional manufacturing, thereby maintaining a unique and sustainable business model.
Ceva, Inc. (NASDAQ: CEVA), a leading licensor of silicon and software IP for Smart Edge devices, has announced its schedule for the third quarter 2024 earnings release and conference call. The company will release its Q3 2024 results on November 7, 2024, before the NASDAQ market opens. Following the release, Ceva management will host a conference call at 8:30 a.m. Eastern Time to discuss the quarter's operating performance.
The conference call will be accessible via phone for both U.S. and international participants, as well as through a live webcast. For those unable to attend the live broadcast, a replay will be available by phone and on Ceva's website until November 14, 2024.
Ceva and Edge Impulse have announced a collaboration to enhance Ceva-NeuPro-Nano NPUs with support for Edge Impulse Platform. This integration will enable AI developers to rapidly develop, train, and deploy advanced embedded ML applications for Ceva NPUs with cycle-accurate performance, before physical hardware is available.
The partnership aims to accelerate time-to-market for NeuPro-Nano based silicon targeting AIoT devices. Ceva-NeuPro-Nano NPU IP is designed for embedded ML applications, delivering ultra-low power and high performance in a small area. Edge Impulse Platform complements the hardware by providing 'no code' AI tools, simplifying the deployment and benchmarking of embedded ML applications.
This collaboration allows NeuPro-Nano customers to leverage Edge Impulse Platform to unlock the full potential of embedded ML in their AIoT products pre-silicon, facilitating rapid, scalable deployment of edge AI across industries with unprecedented performance.
Ceva (NASDAQ: CEVA) has won the Cabin-Driving Integrated Technology Breakthrough Award at the OFweek China Automotive Industry Awards 2024 for its Ceva-Waves UWB technology. This ultra-wideband IP offers low-power solutions for mobile, automotive, consumer, and IoT applications.
Key features of Ceva-Waves UWB include:
- Centimeter-level accuracy and robust location information
- Time-of-Flight ranging and Angle-of-Arrival processing
- Doppler Radar support for presence/gesture detection
- Compliance with 802.15.4 HRP, FiRa 2.0, and CCC DK3.0 requirements
The technology has been licensed by global automotive semiconductor leaders in China and Japan for automotive sensing applications. It's suitable for various uses, including secure digital key functionality, Child Presence Detection, indoor navigation, asset tracking, and tap-free payment systems.
Ceva Inc. (NASDAQ: CEVA) has maintained its #1 position in the wireless connectivity IP market, holding a 67% market share of IP revenues in 2023, according to IPNest's latest Design IP Report. The company's Ceva-Waves portfolio includes widely adopted wireless connectivity IPs for Bluetooth, Wi-Fi, UWB, and 802.15.4. Ceva's leadership in this space has led to over 1.3 billion devices sold worldwide in 2023 powered by their wireless connectivity IP.
Notably, Ceva estimates a 35% market share in Bluetooth IoT and 45% in TWS earbuds (excluding Apple) for 2023. The company also projects capturing 25-30% of the Wi-Fi IoT market share within two years. Ceva's success is attributed to its focus on low power innovation and being first to market with the latest standards, positioning it as a key player in the growing smart edge AI/IoT applications market.
Ceva, Inc. (NASDAQ: CEVA) reported strong Q2 2024 financial results, exceeding estimates. Total revenue reached $28.4 million, up 24% year-over-year. Licensing and related revenue grew 28% to $17.3 million, while royalty revenue increased 19% to $11.2 million. The company signed 11 IP licensing agreements, including strategic deals with infrastructure OEMs and a leading U.S. analog semiconductor company.
Ceva's growth is driven by increasing AI adoption across industries. The company launched new products, including Ceva-Waves-Links and Ceva-NeuPro-Nano, strengthening its Smart Edge IP leadership. GAAP gross margin improved to 90%, and non-GAAP operating income reached $4.4 million. Ceva's cash and equivalents stood at approximately $158 million, positioning the company for growth in edge AI and other high-growth markets.
Ceva, Inc. (NASDAQ: CEVA) announced that Alif Semiconductor has licensed and deployed Ceva's Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for connected IoT platforms, featuring:
- Integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem
- Dedicated network co-processor
- Up to 50x boost in machine learning performance and inference efficiency
- Support for Bluetooth LE Audio and Auracast broadcast audio
- Thread, Zigbee, and Matter support for smart home applications
This collaboration aims to meet the growing demand for AI/ML workloads in battery-powered devices, particularly in wireless audio and smart home use cases.
Ceva (NASDAQ: CEVA) has announced that STMicroelectronics has integrated the Ceva-Waves Dragonfly NB-IoT platform into its latest ST87M01 NB-IoT industrial module. This module offers ultra-reliable low-power wide-area network (LPWAN) connectivity and robust GNSS geo-location capability for IoT devices. The Ceva-Waves Dragonfly platform includes the Ceva-BX1 processor, optimized RF transceiver, baseband, and protocol stack, enabling a complete Release 15 Cat-NB2 modem IP solution. This integration aims to reduce time-to-market and lower entry barriers for a variety of IoT applications, including smart meters, smart grids, smart buildings, factory automation, and asset tracking.
The ST87M01 module is expected to capitalize on the projected growth in cellular IoT connections, which the Ericsson Mobility Report forecasts to increase from 3 billion in 2023 to 6.1 billion by 2029, at a CAGR of 12%. Ceva's Vice President, Tal Shalev, highlighted the collaboration's aim to enhance cellular IoT performance and power efficiency. Further details can be found on Ceva's official website.
Ceva, a leading licensor of silicon and software IP for Smart Edge devices, will release its second quarter 2024 financial results on August 7, 2024, before the NASDAQ market opens.
Following the release, Ceva's management will host a conference call at 8:30 a.m. Eastern Time to discuss the quarter's performance.
U.S. participants can join the call by dialing 1-844-435-0316, while international participants can dial +1-412-317-6365, both using the access code 'Ceva'.
A live webcast will be available at https://app.webinar.net/8mGNyBxXMLR, with a replay accessible by dialing +1-877-344-7529 or +1-412-317-0088 (access code: 2162644) until August 14, 2024. The replay will also be available on Ceva's website.
Ceva, a leader in silicon and software IP, has expanded its Ceva-NeuPro family of Edge AI NPUs with the introduction of Ceva-NeuPro-Nano NPUs. These NPUs are designed to execute TinyML workloads efficiently in consumer, industrial, and general-purpose AIoT products, offering low power consumption, optimal performance, and cost-efficiency. The Ceva-NeuPro-Nano NPUs come in two configurations, Ceva-NPN32 and Ceva-NPN64, providing tailored solutions for various AI applications. They boast enhanced capabilities like transformer computation and sparsity acceleration, significantly reducing memory footprints by up to 80% with Ceva-NetSqueeze technology. The launch includes Ceva-NeuPro Studio, an AI SDK supporting open frameworks like TensorFlow Lite for Microcontrollers. The Ceva-NeuPro-Nano NPUs are now available for licensing.
Ceva (NASDAQ: CEVA), the leading licensor of silicon and software IP for Smart Edge devices, announced participation in upcoming investor events. These include:
Oppenheimer 25th Annual Israeli Conference on May 26, 2024, in Tel Aviv;
Cowen 52nd Annual TMT Conference on May 29, 2024, in New York, with a live webcast of Ceva's presentation;
Mizuho Technology Conference 2024 on June 12, 2024, in New York;
Rosenblatt 4th Annual Technology Summit: The Age of AI on June 13, 2024, virtually, featuring a presentation by VP of Marketing, Moshe Sheier, on Edge AI developments;
Northland Growth Conference 2024 on June 25, 2024, virtually.
FAQ
What is the current stock price of Ceva (CEVA)?
What is the market cap of Ceva (CEVA)?
What is the core business of Ceva Inc?
How does Ceva generate its revenue?
What industries benefit from Ceva's IP solutions?
What distinguishes Ceva's wireless connectivity IP?
How does Ceva contribute to edge AI and sensor fusion?
What role do partnerships play in Ceva’s business model?
How does Ceva ensure the reliability of its IP solutions?
Where does Ceva stand in the competitive landscape?
