Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications
Rhea-AI Summary
Ceva Inc. (NASDAQ: CEVA) has maintained its #1 position in the wireless connectivity IP market, holding a 67% market share of IP revenues in 2023, according to IPNest's latest Design IP Report. The company's Ceva-Waves portfolio includes widely adopted wireless connectivity IPs for Bluetooth, Wi-Fi, UWB, and 802.15.4. Ceva's leadership in this space has led to over 1.3 billion devices sold worldwide in 2023 powered by their wireless connectivity IP.
Notably, Ceva estimates a 35% market share in Bluetooth IoT and 45% in TWS earbuds (excluding Apple) for 2023. The company also projects capturing 25-30% of the Wi-Fi IoT market share within two years. Ceva's success is attributed to its focus on low power innovation and being first to market with the latest standards, positioning it as a key player in the growing smart edge AI/IoT applications market.
Positive
- 67% market share in wireless connectivity IP revenues for 2023
- 1.3 billion devices sold worldwide in 2023 powered by Ceva wireless connectivity IP
- 35% estimated market share in Bluetooth IoT for 2023
- 45% estimated market share in TWS earbuds (excluding Apple) for 2023
- Projected 25-30% market share in Wi-Fi IoT within 2 years
- More than 40 licensees for Wi-Fi 6 IP
Negative
- None.
Insights
Ceva's dominance in wireless connectivity IP is a significant achievement. With a
The company's estimate of
Ceva's focus on low-power innovation and early adoption of new standards positions them well for future market demands, especially as devices become more intelligent and energy-efficient.
Ceva's market leadership in wireless connectivity IP is a strategic advantage in the rapidly evolving IoT landscape. With 1.3 billion devices sold worldwide powered by their IP in 2023, Ceva has established a robust ecosystem.
The company's expansion into next-generation technologies like Bluetooth Channel Sounding, Wi-Fi 7 and UWB 2.0 indicates a forward-thinking approach. This proactive strategy could lead to increased market share and revenue streams as these technologies become mainstream.
However, it's important to monitor potential challenges such as increased competition, regulatory changes, or shifts in technology adoption that could impact Ceva's dominant position in the future.
Ceva's market leadership in wireless connectivity IP translates to a strong financial position. The
The company's diverse portfolio across multiple wireless standards mitigates risk and opens up various revenue opportunities. As IoT and edge AI applications continue to grow, Ceva's expanded offerings in sensing IPs and edge AI NPUs could drive additional revenue streams.
Investors should watch for Ceva's ability to maintain its market share and successfully monetize its new technologies in the coming years.
Latest Design IP Report from IPNest ranks Ceva #1 in Wireless Interface IP Revenue for 2023 with
Ceva's wireless connectivity IP leadership began over a decade ago, starting with Bluetooth and expanding to include Wi-Fi, 802.15.4 and most recently UWB. With the emergence of the Internet of Things, almost every electronic device around us has become connected, leading to a huge push for semiconductor companies to integrate wireless connectivity into their MCU and SoC designs. A scarcity of wireless design expertise coupled with strict cost, power and time-to-market constraints has led to strong demand for Ceva's wireless connectivity IPs, culminating in more than 1.3 billion devices in 2023 sold worldwide powered by Ceva wireless connectivity IP. In Bluetooth alone, Ceva estimates its worldwide Bluetooth IoT market share in 2023 was
"For many years, Ceva has been the dominant supplier of wireless interface IP to the semiconductor industry, with a strong focus on low power innovation and constantly being first to market with the latest standards," said Dr. Eric Esteve, Principal Analyst at IPnest. "As the IP vendor with the broadest range of wireless connectivity IPs in an increasingly connected world, their portfolio provides proven solutions for the integration of multi-standard wireless connectivity into chip designs, faster and with lower risk."
Iri Trashanski, Chief Strategy Officer at Ceva, added: "Wireless connectivity is a fundamental building block of every smart edge device and forms the basis of our strategy at Ceva to enable any device to connect, sense and infer data more reliably and efficiently. IPNest's latest Design IP Report reinforces our incredible track record of successful implementations of wireless connectivity that powers billions of devices, established through partnerships with many of the world's leading semiconductor companies and OEMs. Our customers rely on our proven and reliable IP to provide secure and high performance connectivity today and in future generations of their products. As the devices we connect become increasingly intelligent, our portfolio of sensing IPs and edge AI NPUs perfectly complement our wireless IPs, and offer our customers a single source and unified approach for their smart edge product roadmaps."
*Market share based on ABI Research Bluetooth Market Tracker – Q2'24, data excluding mobile shipments, and; Ceva internal data.
**Market share based on Ceva customer market share estimates from 52audio, Morgan Stanley Research as of Sept '23.
About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 18 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.
Our headquarters are in
Ceva: Powering the Smart Edge™
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
Logo - https://mma.prnewswire.com/media/74483/CEVA_INC_LOGO_v2.jpg
View original content:https://www.prnewswire.com/news-releases/ceva-expands-its-market-share-leadership-in-wireless-connectivity-ip-strengthening-its-solutions-for-smart-edge-aiiot-applications-302220760.html
SOURCE Ceva, Inc.