Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
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The introduction of the Ceva-Waves™ Links™ IP family by Ceva, Inc. represents a strategic development in the semiconductor industry. It addresses a critical market demand for integrated multi-protocol connectivity in Smart Edge devices. With the proliferation of IoT devices and the increasing need for seamless communication between them, the ability to support various wireless standards within a single chip is becoming essential. This move by Ceva aligns with market forecasts, such as those from ABI Research, which predict a significant rise in combo chipset shipments by 2028.
The integration of Wi-Fi, Bluetooth, UWB and IEEE 802.15.4 protocols into one platform could potentially streamline the design process for OEMs and semiconductor companies. This consolidation reduces the time and resources required to bring new products to market, which can lead to cost savings and competitive pricing. Furthermore, the emphasis on low power consumption aligns with the current trend towards energy-efficient devices, which is particularly important in the consumer IoT space where battery life is a key selling point.
From a technological standpoint, the Ceva-Waves™ Links100 platform's integration on the TSMC 22nm process is a noteworthy aspect. This choice of foundry process indicates a balance between performance and cost, which is important for IoT applications where margins can be thin. The inclusion of Wi-Fi 6 and Bluetooth 5.4 suggests that Ceva is targeting not just connectivity, but also the quality of that connectivity with advanced features like Auracast in Bluetooth audio.
Moreover, the support for UWB and its applications in micro-location and radar sensing opens up new possibilities for Smart Edge devices. These could range from enhanced security features, like digital keys, to more precise location tracking within smart homes and industrial settings. This versatility could make Ceva's IP offering attractive to a wide range of customers, potentially leading to increased adoption and market share.
From a financial perspective, Ceva's launch of the Ceva-Waves Links IP family could have significant implications for the company's revenue streams. The ability to capture more market share in the burgeoning IoT and Smart Edge device sectors could lead to increased licensing revenues. The deployment by a leading OEM customer serves as a validation of the platform's market readiness and potential for widespread adoption, which could be a positive indicator for investors.
It is also important to consider the competitive landscape. As companies vie for dominance in the IoT chipset market, Ceva's comprehensive and integrated approach could provide a competitive edge. However, investors should monitor the company's ability to maintain technological leadership and manage production costs effectively, as these factors will influence profitability and long-term financial success.
- Ceva-Waves™ Links™ IP Family delivers fully integrated multi-protocol connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs
- Ceva-Waves™ Links100, an IoT-focused connectivity platform IP with RF implemented on TSMC 22nm, currently being deployed by a leading OEM customer
NUREMBERG,
The Links™ family leverages the newly rebranded Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi 6 / Bluetooth 5.4 / 802.15.4 communications subsystem IP for IoT applications is the first IP available in this family and is currently being deployed by a leading OEM customer.
The demand for smaller, low-cost, high-performing, innovative devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip. ABI Research reflects on the move from module-level integration to on-die chip integration and forecasts that Wi-Fi plus Bluetooth combo chipset shipments will approach 1.6 billion chips annually by 2028.
"Increasingly, wireless connectivity chips are required to handle multiple standards to meet the evolving needs and diverse use cases of consumer and industrial devices. The Ceva-Waves Links family offers a significant value proposition to semiconductor companies and OEMs, lowering the risk and investment required to integrate multi-protocol wireless connectivity into chip designs. Moreover with support for UWB, the Links family offers innovative micro-location and radar sensing features for truly advanced smart edge devices," said Andrew Zignani, Senior Research Director, ABI Research.
"The Ceva-Waves Links wireless connectivity IPs build on our extensive portfolio that already powers more than 1 billion devices annually and has enabled us to establish a strong and diversified customer base across consumer and industrial IoT applications," said Tal Shalev, Vice President and General Manager of the Wireless IoT BU at CEVA. "With many customers designing chips employing multiple wireless standards, Links is a natural extension, leveraging our technology and expertise to dramatically reduce the technology barrier but yet delivering a tailored, optimal solution that provides the high-performance, low latency and low-power connectivity required."
Ceva-Waves Links Key Features
The first member of the Ceva-Waves Links family, the Links100, is an integrated, low power, Wi-Fi / Bluetooth / 15.4 communications subsystem IP for IoT applications, with the following key features:
- Wi-Fi 6 optimized for cost-sensitive IoT applications,
- Bluetooth 5.4 Dual Mode, supporting advanced Bluetooth Audio with Auracast, and with a comprehensive suite of Bluetooth profiles
- IEEE 802.15.4 (for Thread, ZigBee, Matter) for smart home applications
- Optimized co-existence scheme for efficient concurrent communications
- Pre-integrated with a low power multi-protocol radio at TSMC 22nm process
With its modular architecture, the Ceva-Waves Links family is highly versatile to meet customers' needs, leveraging the latest Ceva-Waves wireless IPs. Upcoming Links platforms may include:
- Advanced Wi-Fi 6/6E/7 with MLO, for a variety of use-cases, from power-efficient IoT to high-speed data streaming
- Next generation Bluetooth for Channel Sounding and High Data Throughout
- UWB, supporting FiRa 2.0, CCC Digital Key 3.0, and Radar, for innovative micro-location and sensing features
- Optimized co-existence schemes for each specific configuration
- Pre-integrated radio solutions, including partner and customer's own technology, to address a wide range of configurations and foundry process nodes
For more information, visit https://www.ceva-ip.com/product/ceva-waves-links/
About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 17 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.
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