Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform

Rhea-AI Summary

Cadence Design Systems, Inc. (Nasdaq: CDNS) has announced the industry's first complete AI thermal design and analysis solution for electronic systems, called Celsius Studio. This solution addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, as well as electronics cooling for PCBs and complete electronic assemblies. Celsius Studio introduces a unified platform that allows electrical and mechanical/thermal engineers to concurrently design, analyze, and optimize product performance without the need for geometry simplification, manipulation, and/or translation. The solution is architected for massively parallel execution and achieves up to 10X faster performance than prior solutions. Celsius Studio is seamlessly integrated within Cadence IC, packaging, PCB, and microwave design platforms, enabling in-design thermal analyses as well as final signoff. The solution brings a new system-level thermal integrity solution into the marketplace, converging electro-thermal co-simulation, electronics cooling, and thermal stress into one cohesive offering. It is made possible by Cadence's acquisition of Future Facilities in 2022. Celsius Studio delivers benefits such as ECAD/MCAD unification, AI design optimization, in-design analysis of 2.5D and 3D-IC packages, micro-to-macro modeling, large-scale simulation, multi-stage analyses, and true system-level thermal analyses. It is integrated with Cadence's implementation platforms, including Virtuoso Layout Suite, Allegro X Design Platform, Innovus Implementation System, Optimality Intelligent System Explorer, and AWR Design Environment. Customer endorsements from Samsung Semiconductor, BAE Systems, and Chipletz highlight the positive impact of Celsius Studio on product development, design insights, and thermal problem resolution.

Insights

Market Research Analyst

With the introduction of Cadence's Celsius Studio, there is a notable advancement in the electronic design automation (EDA) market. This tool represents a significant leap in multiphysics simulation capabilities, particularly for thermal design and analysis, which is critical for the performance and reliability of electronic systems. The integration of finite element method (FEM) and computational fluid dynamics (CFD) within a single platform is designed to streamline the design process, potentially reducing the time and cost associated with product development cycles.

For businesses and investors, the implications of such a tool are multifaceted. On one hand, it could lead to increased productivity and cost savings for electronics manufacturers, which might translate into improved margins and competitive advantage. On the other hand, the adoption of Celsius Studio could disrupt existing workflows and necessitate training or changes in personnel. The market response to this new offering will be a key indicator of its impact, as will the adoption rate among Cadence's customer base.

Financial Analyst

The release of Cadence's Celsius Studio could have a significant impact on the company's financial performance. By being the first to market with a comprehensive AI thermal design and analysis solution, Cadence may strengthen its position in the EDA industry. The tool's ability to offer 10X faster performance than previous solutions could attract new customers and retain existing ones, potentially leading to an increase in revenue.

Moreover, endorsements from major industry players like Samsung Semiconductor and BAE Systems serve as powerful testimonials that could enhance the product's credibility and drive sales. The 30% increase in product development efficiency reported by Samsung Semiconductor is particularly noteworthy, as it may set a benchmark for performance improvements that other companies could achieve with Celsius Studio. These factors combined could lead to a positive outlook on Cadence's stock, as investors often look favorably upon innovative solutions that promise to enhance user productivity and profitability.

Technology Analyst

The technical advancements presented by Cadence's Celsius Studio are poised to address several pain points in the design of electronic systems. The seamless ECAD/MCAD unification allows for a more collaborative and efficient workflow between electrical and mechanical engineers. This is particularly relevant for the design of advanced packaging, such as 2.5D and 3D-ICs, where thermal considerations are increasingly complex and critical to system performance.

By leveraging AI for design optimization, Celsius Studio can expedite the exploration of design spaces, leading to quicker convergence on optimal solutions. This is a substantial improvement over traditional methods, which are often time-consuming and iterative. The ability to execute large-scale simulations with detailed granularity is also a significant enhancement, enabling engineers to address thermal issues with greater precision. As the industry trends towards more complex and compact electronic systems, such tools will become indispensable for maintaining system integrity and performance.

Highlights:

• Thermal, stress and electronics cooling in-design analysis empowers designers to utilize ECAD and MCAD seamlessly for multiphysics simulation of electro-mechanical systems
• Convergence of FEM and CFD engines addresses thermal integrity challenges from the chip to the packaging, to the board and out through the complete electronic system
• Architected for massively parallel execution, Celsius Studio achieves up to 10X faster performance than prior solutions
• Seamlessly integrated within Cadence IC, packaging, PCB and microwave design platforms, Celsius Studio enables in-design thermal analyses as well as final signoff

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced Cadence^® Celsius^™ Studio, the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. While current product offerings consist mostly of disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyze and optimize product performance without the need for geometry simplification, manipulation and/or translation.

The industry’s first complete AI thermal design and analysis solution for electronic systems, Cadence® Celsius™ Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. (Graphic: Business Wire)

Celsius Studio brings a new system-level thermal integrity solution into the marketplace, converging electro-thermal co-simulation, electronics cooling and thermal stress into one cohesive offering. Made possible by Cadence’s acquisition of Future Facilities in 2022, best-in-class electronics cooling technology is now accessible to electrical and mechanical engineers. Additionally, the ability to employ Celsius Studio seamlessly for in-design multiphysics analysis empowers designers to identify thermal integrity issues early in the design process and efficiently leverage generative AI optimization and novel modeling algorithms to determine ideal thermal designs.

The result is a streamlined workflow that improves collaboration, reduces design iterations and allows predictable design schedules, which in turn reduces turnaround times and accelerates time to market. Celsius Studio delivers the following benefits:

• ECAD/MCAD Unification – Provides seamless integration of design files with no simplification as well as streamlined workflows for fast and efficient in-design analysis
• AI Design Optimization – Cadence Optimality^™ Intelligent System Explorer’s AI technology within Celsius Studio enables fast and efficient exploration of the full design space to converge on the optimal design
• In-Design Analysis of 2.5D and 3D-IC Packages – Delivers unprecedented capacity to analyze any 2.5D and 3D-IC packages without any simplification or accuracy loss
• Micro-to-Macro Modeling – The first solution capable of modeling structures as small as the IC and its power distribution and as large as the chassis where the PCB(s) are placed
• Large-Scale Simulation – Accurately simulates large systems with detailed granularity for any object of interest including, chip, package, PCB, fan or enclosure
• Multi-Stage Analyses – Enables designers to perform multistage analyses for the design assembly process and addresses 3D-IC warpage issues for multi-die stacks on a single package
• True System-Level Thermal Analyses – Combines finite element method (FEM) with computational fluid dynamics (CFD) for full-system thermal analysis from chip to package to board and end-system
• Seamless Integration – Integrated with Cadence’s implementation platforms, including Virtuoso^® Layout Suite, Allegro^® X Design Platform, Innovus™ Implementation System, Optimality Intelligent System Explorer and AWR Design Environment^®

“Celsius Studio marks a milestone in Cadence’s expanding presence in the system analysis market by offering the first AI platform for not only chip, package and PCB thermal analysis, but also electronics cooling and thermal stress that are critical for today’s advanced packaging designs, inclusive of chiplets and 3D-ICs,” said Ben Gu, corporate vice president of R&D for multiphysics system analysis at Cadence. “Seamless integration with Cadence’s powerful implementation platforms empowers our customers to perform multiphysics in-design analysis for chips, packages and boards all the way through to complete systems.”

Customer Endorsements

“Celsius Studio enables Samsung Semiconductor engineers the ability to gain access to analysis and design insights during the early stages of the design cycle, simplifying the generation of precise and rapid thermal simulations for 3D-IC and 2.5D packages. Our collaboration with Cadence has significantly increased our product development by 30%, optimizing the package design process and reducing turnaround time.”
WooPoung Kim, Head of Advanced Packaging, Samsung Device Solutions Research America

“Celsius Studio’s seamless integration with Cadence’s AWR Microwave Office IC design platform through BAE Systems’ custom GaN PDK is enabling fast and accurate thermal analysis throughout the MMIC design cycle, leading to increased first-pass design success and significantly improved RF and thermal power amplifier performance.”
Michael Litchfield, Technical Director, MMIC Design at BAE Systems

“Celsius Studio enables our design team to work with detailed information early in our design cycle so that we can target and resolve thermal problems before the design is fully committed. With the reduced turnaround time, the Chipletz engineering team has been empowered to efficiently run detailed thermal simulations for 3D-IC and 2.5D packages early and often as we develop these complex designs.”
Jeff Cain, VP of Engineering, Chipletz

Availability

For more information on Celsius Studio, please visit www.cadence.com/go/cstudiopr. Customers interested in gaining early access to Celsius Studio should contact their Cadence account representative.

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware, and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2024 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

Category: Featured

View source version on businesswire.com: https://www.businesswire.com/news/home/20240131987413/en/

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Source: Cadence Design Systems, Inc.

FAQ

What is the name of the AI thermal design and analysis solution announced by Cadence Design Systems, Inc.?

The AI thermal design and analysis solution announced by Cadence Design Systems, Inc. is called Celsius Studio.

What does Celsius Studio address in terms of thermal analysis and stress?

Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, as well as electronics cooling for PCBs and complete electronic assemblies.

What are the benefits of Celsius Studio?

Celsius Studio delivers benefits such as ECAD/MCAD unification, AI design optimization, in-design analysis of 2.5D and 3D-IC packages, micro-to-macro modeling, large-scale simulation, multi-stage analyses, and true system-level thermal analyses.

What platforms is Celsius Studio integrated with?

Celsius Studio is integrated with Cadence's implementation platforms, including Virtuoso Layout Suite, Allegro X Design Platform, Innovus Implementation System, Optimality Intelligent System Explorer, and AWR Design Environment.

What are some customer endorsements for Celsius Studio?

Customer endorsements from Samsung Semiconductor, BAE Systems, and Chipletz highlight the positive impact of Celsius Studio on product development, design insights, and thermal problem resolution.