Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP

Rhea-AI Summary

Cadence expands its design IP portfolio on TSMC's 3nm process, achieving first-pass silicon success with the 224G-LR SerDes PHY IP. Other Cadence IP on the N3E process has demonstrated silicon success or taped out, providing a wide range of high-speed interface and memory IP. The new 224G-LR SerDes PHY IP features an innovative architecture for speed, reach, and power efficiency. Cadence's IP portfolio supports demanding applications like networking, AI/ML, chiplet, and automotive.

Positive

• Cadence achieves first-pass silicon success with the 224G-LR SerDes PHY IP on TSMC's 3nm process
• Broad portfolio of Cadence IP provides high-speed interface and memory solutions for advanced designs

Negative

• None.

Highlights:

• Proven interface IP architectures realized significant gains in performance and power efficiency on the TSMC N3E process
• 224G-LR SerDes PHY IP on the TSMC N3E process has achieved first-pass silicon success
• 112G-ELR SerDes silicon results on the TSMC N3E process showing optimal PPA
• Multiple Cadence IP test chips have successfully taped out on the TSMC N3E process, including PCIe 6.0 and 5.0, 64G-LR Multi-Protocol PHY, LPDDR5x/5, GDDR7/6 and UCIe

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it has expanded its design IP portfolio on TSMC’s 3nm (N3E) process—most notably with the addition of the flagship Cadence^® 224G Long-Reach (224G-LR) SerDes PHY IP, which has achieved first-pass silicon success. Other Cadence Design IP on the advanced TSMC N3E process has demonstrated silicon success or taped out, providing mutual customers with a wide range of high-speed interface and memory IP for their most advanced designs. Cadence’s broad portfolio on TSMC’s N3E process delivers industry-leading power, performance and area (PPA) to target the most demanding networking, hyperscale computing, artificial intelligence and machine learning (AI/ML), chiplet, automotive and storage applications.

With the proliferation of bandwidth-hungry, low-latency applications fueled by generative AI and large language models (LLMs), the need for innovative IP solutions that enable efficient and robust high-speed data transmission has become paramount. Addressing this surging demand, the new 224G-LR SerDes PHY IP and other leading Cadence interface IP on the TSMC N3E process usher in a new era of innovation and high-speed connectivity. The 224G-LR SerDes PHY IP features an innovative architecture providing an exceptional combination of speed, reach and power efficiency. Key features include:

• Support for full-duplex 1-225Gbps data rates with excellent LR performance
• Optimized power efficiency configurable for different channel reaches (LR, MR, VSR)
• Built-in intelligence to enhance reliability and system robustness

The 224G-LR PHY IP is part of the Cadence IP portfolio on TSMC’s advanced N3E process, which also includes 112G LR SerDes PHY IP, PCI Express^® (PCIe^®) 6.0/5.0/4.0/3.0/2.0, 64G/32G Multi-Protocol SerDes, Universal Chiplet Interconnect Express^™ (UCIe^™), LPDDR5x/5/4x/4, DDR5/4/3 and GDDR7/6 IP. Cadence’s 224G/112G LR SerDes and DDR5 IP have demonstrated first-pass silicon success. The PCIe, 64G/32G Multi-Protocol SerDes, LPDDR5x/5, GDDR7/6 and UCIe IP were successfully taped out in early 2023.

“Cadence’s innovative IP solutions for TSMC’s most advanced N3E process empower our customers to unlock unprecedented levels of performance and power efficiency while benefiting from the leading-edge capabilities of TSMC’s N3E process,” said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. “Our latest collaboration with Cadence on breakthrough IP designs for TSMC’s 3nm technology has the potential to reshape the landscape of hyperscale, AI/ML and 5G/6G infrastructure SoC designs.”

“Our proven interface IP architectures on TSMC’s cutting-edge N3E process have realized significant gains in performance and power efficiency, enabling our mutual customers to harness the benefits of the N3E process while still achieving faster time to market,” said Rishi Chugh, vice president of product marketing for the IP Group at Cadence. “SerDes speeds must quickly move to next-generation nodes to accommodate the increased demand for data bandwidth required by generative AI and other high-speed networking infrastructures. Cadence’s demonstration of 224G-LR silicon offer customers a solid upgrade path to next-generation hyperscale designs. Our close collaboration with TSMC enables us to deliver high-quality IP designed to achieve first-pass silicon success and faster time to market.”

The comprehensive Cadence IP portfolio on the TSMC N3E process supports the Cadence Intelligent System Design^™ strategy by enabling advanced-node SoC design excellence.

For more information about Cadence’s next-generation 224G SerDes PHY IP and the comprehensive Cadence N3E Design IP portfolio, please visit www.cadence.com/go/N3EDIPPR.

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at www.cadence.com.

© 2023 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. PCI Express and PCIe are registered trademarks or trademarks of PCI-SIG. Universal Chiplet Interconnect Express and UCIe are trademarks of the UCIe Consortium. All other trademarks are the property of their respective owners.

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Source: Cadence Design Systems, Inc.