Camtek Receives Order for 28 Systems from a tier-1 manufacturer for High Bandwidth Memory (HBM) and Heterogenous Integration (HI) Applications

Rhea-AI Summary

Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT) has received a new order for 28 systems from a tier-1 manufacturer, adding to the already strong backlog of systems expected to be delivered during 2024. The order is for the inspection & metrology of High Bandwidth Memory (HBM) and Heterogenous Integration (HI) applications, critical components in chips enabling high-speed data processing in various applications. Camtek's state-of-the-art inspection and metrology systems play a pivotal role in ensuring the quality, reliability, and performance of the chip leveraging today's newest chip fabrication technologies.

Positive

• Strong momentum with orders for 240 systems since the beginning of the third quarter
• Positive outlook for a strong year and record 2024 for Camtek

Negative

• None.

Since the beginning of the third quarter to-date, Camtek has received orders for 240 systems

MIGDAL HAEMEK, Israel, Nov. 13, 2023 /PRNewswire/ -- Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT), today announced that it has received a new order for 28 systems from a tier-1 manufacturer, for the inspection & metrology of High Bandwidth Memory (HBM) and Heterogenous Integration (HI) applications. This order adds to the already strong backlog of systems that are expected to be delivered during 2024.

 

HBM is a critical component in chips enabling high-speed data processing in applications ranging from artificial intelligence and gaming to data centers.

HI is a new technology which can lead to higher overall chip performance, energy efficiency and reduced footprint, by enabling the integration of various components such as processors, memory and sensors, all into a single package.

Camtek's state-of-the-art inspection and metrology systems play a pivotal role in ensuring the quality, reliability and performance of the chip leveraging today's newest chip fabrication technologies.

Rafi Amit, CEO of Camtek commented, "Our strong momentum continues into the fourth quarter of 2023, with the receipt of this significant 28 system order from a leading tier-1 manufacturer. Since the beginning of the third quarter we have received orders for 240 systems which solidifies our expectations of a strong year and record 2024 for Camtek."

For more information about Camtek Ltd. and its advanced inspection and metrology solutions, please visit www.camtek.com.

ABOUT CAMTEK LTD.

Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek's systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek's systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs, OSATs, and foundries.

With manufacturing facilities in Israel and Germany, and eight offices around the world, Camtek provides state of the art solutions in line with customers' requirements.

This press release is available at www.camtek.com
This press release contains statements that may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on Camtek's current beliefs, expectations and assumptions about its business and industry, all of which may change. Forward-looking statements can be identified by the use of words including "believe," "anticipate," "should," "intend," "plan," "will," "may," "expect," "estimate," "project," "positioned," "strategy," and similar expressions that are intended to identify forward-looking statements, including our expectations and statements relating to the compound semiconductors market and our position in this market and the anticipated timing of delivery of the systems. These forward-looking statements involve known and unknown risks and uncertainties that may cause the actual results, performance or achievements of Camtek to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. Factors that may cause our actual results to differ materially from those contained in the forward-looking statements include, but are not limited to, the future contribution of HBM and Chiplet applications to the Company business, the impact of any new or revised export and/or import and doing-business regulations or sanctions, such as changes in U.S. trade policies; the effect of the evolving nature of the recent war in Gaza between Israel and the Hamas; and those other factors discussed in our Annual Report on Form 20-F and other documents filed by the Company with the SEC as well as other documents that may be subsequently filed by Camtek from time to time with the SEC. We caution you not to place undue reliance on forward-looking statements, which speak only as of the date hereof. Camtek does not assume any obligation to update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this release unless required by law.

While we believe that we have a reasonable basis for each forward-looking statement contained in this press release, we caution you that these statements are based on a combination of facts and factors currently known by us and our projections of the future, about which we cannot be certain. In addition, any forward-looking statements represent Camtek's views only as of the date of this press release and should not be relied upon as representing its views as of any subsequent date. Camtek does not assume any obligation to update any forward-looking statements unless required by law.

CAMTEK LTD. Moshe Eisenberg, CFO Tel: +972 4 604 8308 Mobile: +972 54 900 7100 moshee@camtek.com

INTERNATIONAL INVESTOR RELATIONS EK Global Investor Relations Ehud Helft Tel: (US) 1 212 378 8040 camtek@ekgir.com

 

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SOURCE Camtek Ltd.

FAQ

What is the significance of the new order for Camtek?

The new order for 28 systems from a tier-1 manufacturer adds to the already strong backlog of systems expected to be delivered during 2024, indicating a positive outlook for the company's performance.

What are High Bandwidth Memory (HBM) and Heterogenous Integration (HI) applications?

HBM is a critical component in chips enabling high-speed data processing in various applications, while HI is a new technology that can lead to higher overall chip performance, energy efficiency, and reduced footprint by enabling the integration of various components into a single package.

How does Camtek's systems contribute to chip fabrication technologies?

Camtek's state-of-the-art inspection and metrology systems play a pivotal role in ensuring the quality, reliability, and performance of the chip leveraging today's newest chip fabrication technologies.