Camtek Receives New Orders for 46 Systems for High Bandwidth Memory (HBM)

Rhea-AI Summary

Camtek receives additional orders for 46 systems from tier-1 HBM manufacturers, indicating potential upswing in demand for semiconductors.

Positive

• Camtek solidifies reputation as a leading provider of inspection and metrology solutions for HBM.
• Growing demand for high performance computing leads to increased production of HBM.

Negative

• None.

Recent deal flow also indicates potential upswing in demand in other segments of the semiconductor market

MIGDAL HAEMEK, Israel, Sept. 12, 2023 /PRNewswire/ -- Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT), today announced that since its prior press release issued on August 29, 2023, it has received further orders amounting to an additional 46 systems from several tier-1 High Bandwidth Memory (HBM) manufacturers. Most of the The systems are expected to be delivered during 2024. 

High Bandwidth Memory (HBM) is a critical component enabling high performance computing in applications ranging from artificial intelligence and gaming to data centers. Camtek's state-of-the-art inspection and metrology systems play a pivotal role in ensuring the quality, reliability, and performance of HBM devices.

Rafi Amit, CEO of Camtek commented, "We are very pleased to have received these significant orders from Tier-1 manufacturers of High Bandwidth Memory. These new orders further solidify Camtek's reputation as a leading provider of advanced inspection and metrology solutions for HBM. The news follows our previous announcements and further strengthens our expectations that the growing demand for high performance computing is leading to increased production of HBM. Our recent deal flow since the beginning of the third quarter also points to an potential upswing in demand in other areas of the semiconductor market."

For more information about Camtek Ltd. and its advanced inspection and metrology solutions, please visit www.camtek.com.

ABOUT CAMTEK LTD.

Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek's systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek's systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs, OSATs, and foundries.

With eight offices around the world, Camtek has best-in-class sales and customer support organization, providing tailor-made solutions in line with customers' requirements.

This press release is available at www.camtek.com  

This press release contains statements that may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on Camtek's current beliefs, expectations and assumptions about its business and industry, all of which may change.  Forward-looking statements can be identified by the use of words including "believe," "anticipate," "should," "intend," "plan," "will," "may," "expect," "estimate," "project," "positioned," "strategy," and similar expressions that are intended to identify forward-looking statements, including our expectations  and statements relating to the compound semiconductors market and our position in this market and the anticipated timing of delivery of the systems. These forward-looking statements involve known and unknown risks and uncertainties that may cause the actual results, performance or achievements of Camtek to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. Factors that may cause our actual results to differ materially from those contained in the forward-looking statements include, but are not limited to the future contribution of HBM and Chiplet applications to the Company business, the impact of any new or revised export and/or import and doing-business regulations or sanctions, such as changes in U.S. trade policies; the risks relating to the concentration of a significant portion of our business in certain countries in the Asia Pacific Region, particularly China (which is our largest territory), Taiwan and Korea; and those other factors discussed in our Annual Report on Form 20-F and other documents filed by the Company with the SEC as well as other documents that may be subsequently filed by Camtek from time to time with the SEC. We caution you not to place undue reliance on forward-looking statements, which speak only as of the date hereof. Camtek does not assume any obligation to update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this release unless required by law.

While we believe that we have a reasonable basis for each forward-looking statement contained in this press release, we caution you that these statements are based on a combination of facts and factors currently known by us and our projections of the future, about which we cannot be certain. In addition, any forward-looking statements represent Camtek's views only as of the date of this press release and should not be relied upon as representing its views as of any subsequent date. Camtek does not assume any obligation to update any forward-looking statements unless required by law.

CAMTEK LTD.
Moshe Eisenberg, CFO
Tel: +972 4 604 8308
Mobile: +972 54 900 7100
moshee@camtek.com

INTERNATIONAL INVESTOR RELATIONS 
EK Global Investor Relations
Ehud Helft
Tel: (US) 1 212 378 8040
camtek@ekgir.com 

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SOURCE Camtek Ltd.