TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems
Ansys (NASDAQ: ANSS) received four TSMC 2024 OIP Partner of the Year awards for excellence in design enablement. The recognition highlights Ansys' achievements in multiphysics analysis solutions for advanced silicon processes and 3D-IC technologies. The awards specifically acknowledge joint development in: multiphysics analysis incorporating mechanical stress analysis, power integrity solutions for N2P and A16 processes, COUPE enablement for multi-die systems, and RF design migration automation. The collaboration between TSMC and Ansys aims to address complex design challenges in AI, HPC, and photonics silicon systems.
Ansys (NASDAQ: ANSS) ha ricevuto quattro premi TSMC 2024 OIP Partner of the Year per l'eccellenza nell'abilitazione del design. Questo riconoscimento mette in evidenza i risultati di Ansys nelle soluzioni di analisi multifisica per processi di silicio avanzati e tecnologie 3D-IC. I premi riconoscono in particolare lo sviluppo congiunto in: analisi multifisica che incorpora l'analisi di stress meccanico, soluzioni di integrità energetica per i processi N2P e A16, abilitazione COUPE per sistemi multi-die e automazione della migrazione del design RF. La collaborazione tra TSMC e Ansys mira a affrontare le complesse sfide progettuali nei sistemi di silicio nell'AI, HPC e fotonica.
Ansys (NASDAQ: ANSS) recibió cuatro premios TSMC 2024 OIP Partner of the Year por su excelencia en la habilitación del diseño. Este reconocimiento destaca los logros de Ansys en soluciones de análisis multifísico para procesos avanzados de silicio y tecnologías 3D-IC. Los premios reconocen específicamente el desarrollo conjunto en: análisis multifísico que incorpora el análisis de estrés mecánico, soluciones de integridad de energía para los procesos N2P y A16, habilitación COUPE para sistemas de múltiples chip y automatización de la migración del diseño RF. La colaboración entre TSMC y Ansys tiene como objetivo abordar los complejos desafíos de diseño en sistemas de silicio de AI, HPC y fotónica.
Ansys (NASDAQ: ANSS)는 설계 지원의 우수성을 인정받아 TSMC 2024 OIP 올해의 파트너 상을 4개 수상했습니다. 이 인정은 고급 실리콘 공정 및 3D-IC 기술을 위한 다물리 분석 솔루션에서 Ansys의 성과를 강조합니다. 이 상은 특히 기계적 스트레스 분석을 포함한 다물리 분석, N2P 및 A16 공정을 위한 전력 무결성 솔루션, 다중 다이 시스템을 위한 COUPE 지원 및 RF 설계 마이그레이션 자동화에서의 공동 개발을 인정합니다. TSMC와 Ansys 간의 협력은 AI, HPC 및 포토닉스 실리콘 시스템에서 복잡한 설계 과제를 해결하는 것을 목표로 하고 있습니다.
Ansys (NASDAQ: ANSS) a reçu quatre prix TSMC 2024 OIP Partenaire de l'année pour son excellence en matière d'activation du design. Cette reconnaissance met en lumière les réalisations d'Ansys dans les solutions d'analyse multiphysique pour des processus de silicium avancés et des technologies 3D-IC. Les prix reconnaissent spécifiquement le développement conjoint dans : l'analyse multiphysique incorporant l'analyse des contraintes mécaniques, les solutions d'intégrité énergétique pour les processus N2P et A16, l'activation COUPE pour les systèmes multi-dies et l'automatisation de la migration de conception RF. La collaboration entre TSMC et Ansys vise à relever les défis complexes de conception dans les systèmes de silicium AI, HPC et photonique.
Ansys (NASDAQ: ANSS) erhielt vier TSMC 2024 OIP Partner des Jahres-Auszeichnungen für hervorragende Leistungen in der Designermöglichkeit. Diese Anerkennung hebt die Erfolge von Ansys in multiphysikalischen Analyselösungen für fortschrittliche Siliziumprozesse und 3D-IC-Technologien hervor. Die Auszeichnungen würdigen insbesondere die gemeinsame Entwicklung in: multiphysikalischer Analyse, die mechanische Spannungsanalysen umfasst, Lösungen zur Energieintegrität für die Prozesse N2P und A16, COUPE-Habilitation für Multichip-Systeme und Automatisierung der RF-Design-Migration. Die Zusammenarbeit zwischen TSMC und Ansys zielt darauf ab, komplexe Entwurfsherausforderungen in KI-, HPC- und Photoniksiliziumsystemen anzugehen.
- Recognition with four prestigious TSMC 2024 OIP Partner of the Year awards
- Strategic collaboration with TSMC for advanced silicon processes
- Expanded market presence in AI, HPC, and photonics sectors
- Development of new AI-assisted RF process migration flow
- None.
Insights
This recognition from TSMC significantly strengthens Ansys's position in the semiconductor design ecosystem. The four awards, particularly in critical areas like AI, HPC and photonics, validate Ansys's essential role in advanced chip development. The collaboration with TSMC for their N2P and A16 processes is especially valuable, as these represent cutting-edge semiconductor manufacturing nodes.
The partnership enhances Ansys's competitive moat in semiconductor design software, particularly for advanced packaging technologies and 3D-IC design. The company's multiphysics platform integration with TSMC's processes creates high switching costs for customers, potentially leading to sustained revenue streams. This positions Ansys favorably in the growing AI chip design market, where thermal management and power integrity are important challenges.
Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies
/ Key Highlights
- Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact universal photonics engine (COUPE)
- Ansys' joint development of design solutions for TSMC's N2P and A16™ advanced silicon processes ensure power integrity, electromigration reliability, and critical thermal management for compute-heavy applications like high-performance computing (HPC) and artificial intelligence (AI)
- Ansys collaborated on a new AI-assisted radio frequency (RF) process migration flow that automates circuit designs and improves product performance
TSMC announced the award winners at its annual TSMC OIP Ecosystem Forum, which assembled semiconductor ecosystem partners and customers for a day of industry discussion around technological trends and design solutions. Ansys received the following Joint Development awards:
- Multiphysics: TSMC expanded the collaboration with Ansys RedHawk-SC Electrothermal™ thermal and multiphysics signoff platform, incorporating mechanical stress analysis solutions. In addition, TSMC, Ansys, and Synopsys developed an efficient flow to address multiphysics coupling challenges among timing, thermal, and power integrity. The flow seamlessly combines Synopsys' 3DIC Compiler™ exploration-to-signoff platform with Ansys multiphysics solutions RedHawk-SC Electrothermal and Ansys RedHawk-SC™ power integrity signoff platform for digital and 3D-IC.
- N2P and A16: Ansys collaborated with TSMC to develop power integrity analysis, electromigration reliability analysis, and critical thermal management solutions for TSMC's N2P and A16 advanced silicon processes. The flow includes RedHawk-SC, Ansys Totem™ power integrity signoff platform, and RedHawk-SC Electrothermal.
- COUPE enablement: Ansys and TSMC delivered a high-fidelity multiphysics solution to address design and reliability challenges for the TSMC COUPE integration system. This includes Ansys Zemax OpticStudio™ optical system design and analysis software, Ansys Lumerical™ FDTD advanced 3D electromagnetic FDTD simulation software, RedHawk-SC and Totem signoff platforms for multi-die power integrity signoff, Ansys RaptorX™ silicon optimized electromagnetic (EM) solver for design analysis and modeling for high-frequency EM analysis between dies, and RedHawk-SC Electrothermal for vital thermal management of the multi-die heterogenous system. Additionally, Lumerical allows custom Verilog-A models for electronic photonic circuit simulations, which work seamlessly with the TSMC Modeling Interface (TMI) and are co-designed with TSMC's Process Design Kit (PDK).
- RF design migration: Ansys collaborated with Synopsys and TSMC to combine the RaptorX electromagnetic modeling engine with Ansys optiSLang® process integration and design optimization software and Synopsys Custom Compiler and ASO.ai solution to automate the migration and optimization of analog circuits from one silicon process to another — enhancing design efficiency, reliability, and scalability.
"Ansys is a key ecosystem partner that has worked relentlessly alongside TSMC to address our mutual customers' most complex design challenges," said Dan Kochpatcharin, head of the ecosystem and alliance management division at TSMC. "The awards celebrate OIP partners like Ansys who strive for excellence in design enablement, working closely with TSMC to accelerate advanced 3D IC design for the next generation of AI innovation."
"The Ansys multiphysics platform is integral to meeting designers' stringent design requirements for 3D-IC," said John Lee, vice president and general manager of electronics, semiconductor, and optics business unit at Ansys. "Without the Ansys multiphysics platform, the chips that are enabling the AI, HPC, and silicon systems growth would take demonstrably longer to develop and validate, and the associated costs would be much higher. Together, Ansys and TSMC push the industry forward by empowering our mutual customers to explore advanced packaging technologies, leverage the speed and power of AI, and enhance product performance and durability."
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™.
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in
ANSS–T
/ Contacts | |
Media | Mary Kate Joyce |
724.820.4368 | |
Investors | Kelsey DeBriyn |
724.820.3927 | |
View original content to download multimedia:https://www.prnewswire.com/news-releases/tsmc-recognizes-ansys-for-excellence-in-design-enablement-for-ai-hpc-and-photonics-silicon-systems-302286438.html
SOURCE Ansys
FAQ
What awards did Ansys (ANSS) receive from TSMC in 2024?
What is the significance of Ansys (ANSS) collaboration with TSMC for N2P and A16 processes?
How does Ansys (ANSS) contribute to TSMC's COUPE integration system?
