Ansys Inc Stock Price, News & Analysis

ANSYS announced that executives will present virtually at two upcoming investor conferences. Maria Shields, CFO, will discuss at the RBC Capital Markets Technology Conference on November 18, 2020, at 1:20 p.m. ET. Ajei Gopal, President & CEO, will present at the Nasdaq 43rd Investor Conference on December 2, 2020, at 8:30 a.m. ET. A live audio webcast and archived presentations will be available on the company's website. Forward-looking statements regarding financial results and product development may be made during these events.

ANSYS reported strong Q3 2020 results with GAAP revenue of $367.0 million and non-GAAP revenue of $369.1 million, reflecting a 7% increase year-over-year. GAAP diluted EPS was $0.87 and non-GAAP diluted EPS was $1.36, down from $1.04 and $1.42 respectively in Q3 2019. Deferred revenue reached $879.9 million, up 35% year-over-year. The company announced a pending acquisition of Analytical Graphics, Inc. for $700 million, enhancing its capabilities in the aerospace and defense sector. FY 2020 guidance was also raised.

D2H Advanced Technologies and Ansys (NASDAQ: ANSS) have introduced an innovative automated simulation workflow that optimizes NASCAR race car development. This collaboration allows racing teams to enhance aerodynamics while significantly reducing reliance on costly wind tunnel tests, ultimately improving design efficiency and speed. The new workflow enables teams to triple the number of designs produced without additional time, addressing design issues more rapidly. This advancement promises increased production efficiency, potentially leading to better on-track performance and championships for NASCAR teams.

Ansys is partnering with Microsoft to enhance engineering simulation capabilities using public cloud high-performance computing (HPC) and digital twin solutions. This collaboration aims to increase productivity, reduce development costs, and expedite time to market in industries like industrial manufacturing and automotive.

The integration of Ansys' simulation solutions with Microsoft Azure is anticipated to optimize operations, enhance product maintenance, and enable large-scale autonomous vehicle simulations. The partnership is set to influence the way engineering challenges are approached, promising significant advancements in technology.

On October 27, 2020, Ansys announced certifications for its semiconductor design solutions with Samsung Foundry's FinFET process nodes. This includes the integration of Ansys RedHawk-SC aimed at designing efficient chips for markets like 5G, AI, HPC, automotive, and IoT.

The certification covers all FinFET nodes from 4nm to 14nm, focusing on power integrity and thermal analysis. This collaboration allows Samsung to optimize performance while reducing simulation time significantly. The partnership enhances the ability to meet advanced design requirements and reliability challenges in semiconductor applications.

Ansys has entered into a definitive agreement to acquire Analytical Graphics, Inc. for $700 million, expected to close in Q4 2020 subject to regulatory clearance. This acquisition will enhance Ansys' offerings by enabling mission-driven simulation capabilities, essential for aerospace and defense sectors. The deal involves a cash payment of 67% and 33% in Ansys common stock. Once finalized, it is projected to contribute $75 million to $85 million in non-GAAP revenue in 2021, with modest accretion to earnings per share.

Ansys has been recognized with two TSMC Open Integration Platform Partner of the Year awards for its contributions to 3nm design infrastructure and 3D-IC design productivity solutions. The awards highlight Ansys' advanced simulation tools, including Ansys RedHawk-SC and Totem, which are tailored for TSMC's latest technologies. These tools enable efficient design and verification for high-performance applications in sectors like automotive and IoT. TSMC's senior director lauded Ansys for facilitating customer success through innovative solutions.

Ansys (NASDAQ: ANSS) and EOS have partnered to enhance the workflow for developing additive manufacturing (AM) parts. This collaboration integrates EOS's industrial 3D printing systems with Ansys simulation solutions, enabling AM engineers to create precise parts more efficiently. By eliminating trial-and-error methods, the new workflow significantly reduces production time and costs, allowing for faster product market entry. Users can design complex print jobs up to 20% faster and simple jobs by 50-60%. This collaboration aims to reduce build failures, enhance material property selection, and improve overall productivity.

ANSYS, Inc. (NASDAQ: ANSS) will release its Q3 2020 earnings on November 4, 2020, after market close.

A conference call is scheduled for November 5, 2020, at 8:30 a.m. ET, hosted by Ajei Gopal, President and CEO, and Maria T. Shields, CFO. Participants can pre-register for immediate call access without operator intervention.

The earnings announcement, prepared remarks, and investor presentation will be available on the Ansys Investor Relations website.