Ansys Inc - ANSS STOCK NEWS

ANSYS, Inc. (NASDAQ: ANSS) announced its first quarter earnings release date for May 5, 2021, post-market close. A conference call to discuss the results will be held on May 6, 2021, at 8:30 a.m. Eastern Time, led by CEO Ajei Gopal and CFO Nicole Anasenes. Participants are encouraged to pre-register for immediate access. The earnings press release and call details will be available on the company's investor website. ANSYS is a leader in engineering simulation, helping innovative companies in product development.

H3C Semiconductor has launched the ENGIANT 660, a high-performance network processor chip designed for routing, AI, 5G backhaul, and cybersecurity applications. The development utilized Ansys' advanced multiphysics simulation solutions, enhancing product efficiency and reducing costs. Key features include 56G Serdes and LPDDR5 interfaces, with significant improvements in design signoff and production speed, cutting analysis times by 10x. This collaboration aims to address complex challenges in thermal reliability and power integrity for large-scale chips.

Ansys and Velodyne are collaborating to develop advanced physics-based models for Velodyne's lidar sensors, enhancing safety in autonomous vehicles (AVs). This partnership aims to improve hazard detection and accelerate the integration of lidar technology into AVs, reducing development costs. By utilizing Ansys' VRXPERIENCE platform, automakers can simulate countless driving scenarios, decreasing the need for extensive physical testing. This innovation supports safer driving environments and expedites the market introduction of next-generation AVs, contributing significantly to the autonomous driving landscape.

Ansys and ESSS have announced a collaboration to enhance discrete element modeling (DEM) workflows for industrial applications. Their new tool, Ansys Rocky, allows for the simulation of product performance in various operating scenarios, improving the design processes for products influenced by granular materials. By leveraging multiple GPUs, Ansys Rocky accelerates analysis by 20-90 times, integrating seamlessly with Ansys' flagship solvers like Fluent and Mechanical. This collaboration aims to provide engineers with more reliable products, reducing development time and waste.

Global Unichip Corporation (GUC) is utilizing Ansys HFSS 3D Layout to enhance its Advanced-IC design capabilities, accelerating the development of application-specific integrated circuits (ASICs) for AI, high-performance computing, and data center networking. This innovative simulation workflow drastically reduces simulation set-up times, facilitating a shift from hours to minutes, thereby improving device performance and reducing power consumption. GUC's latest technology, the GLink interface, is noted for its efficiency, consuming 6-10 times less power than alternatives.

Ansys received the Customers' Choice Award at the TSMC 2020 Open Innovation Platform Ecosystem Forum for its technical paper on 5G RF device analysis using Ansys Totem technology. The award reflects the efficacy of Totem in addressing electromigration and self-heating challenges in high-speed RF designs. Presented by TSMC, the paper demonstrated a validated electromigration flow on TSMC's 16nm process technology, emphasizing Ansys' role in supporting innovative silicon design solutions. This accolade marks Ansys' second win in three years, highlighting its continued collaboration with TSMC.

Zoltan Cendes, former Chief Technology Officer at Ansys, has been elected to the National Academy of Engineering (NAE) for his vital contributions to electromagnetics simulation software, including the development of Ansys HFSS. This honor recognizes his role in advancing engineering technology and innovation. Cendes' career highlights include founding Ansoft and his pivotal work on finite element modeling techniques and algorithms that transformed high-frequency electronic design. He will be inducted into the NAE on October 3, 2021, alongside 127 other new members.

Ansys (NASDAQ: ANSS) announced the appointment of Kelsey DeBriyn as the new head of investor relations and government affairs, effective March 17, 2021. DeBriyn, who has 15 years of experience in investment banking and equity research, will enhance stakeholder engagement and provide insights into Ansys' strategy and financial outlook. She previously worked at Raytheon Technologies and BlackRock. Annette Arribas, the former senior director of investor relations, is leaving for other opportunities. The move aims to support Ansys' growth initiatives.