Ansys Inc - ANSS STOCK NEWS

Realtek has implemented Ansys’ RaptorH to enhance the design of complex radio frequency integrated circuits (RFIC). This advanced electromagnetic simulation workflow enables Realtek to tackle RFIC challenges more efficiently, boosting simulation speed by 3x to 10x while reducing silicon usage and EM crosstalk. The integration of RaptorH allows for more accurate EM modeling, helping Realtek to create high-performance chips for Internet of Things applications. This strategic collaboration is expected to improve product quality and reliability, exemplifying Ansys' leadership in engineering simulation.

Ansys has received certification for its multiphysics solutions, Redhawk-SC and Totem, from Samsung Foundry for their advanced 3nm and 4nm process technologies. This certification will enhance design flow for customers involved in complex chip designs, meeting essential power and reliability standards for applications like AI, HPC, and 5G. Redhawk-SC’s capabilities include power integrity analysis and statistical EM budgeting, while Totem focuses on transistor-level design accuracy. Ansys and Samsung are committed to advancing silicon technology solutions.

Ansys' AGI has been awarded the 2021 President's "E" Award for Exports, recognizing its significant contribution to the expansion of U.S. exports. This prestigious award is given to entities demonstrating sustained commitment to export growth, with AGI noted for its innovative product design and effective use of U.S. government advocacy services. The award ceremony honored 70 U.S. companies, highlighting their roles in enhancing the U.S. economy through exporting.

On November 5, 2021, Ansys announced its collaboration with Panasonic Automotive, enabling the latter to achieve ISO 26262 ASIL-D process certification, a vital functional safety standard. The partnership established a systematic, model-based approach to streamline functional safety analysis in next-generation eCockpit development. This method utilizes Ansys® medini analyze, reducing development time and costs by integrating safety certification early in the design process. The collaboration aims to enhance the safety and performance of future automotive systems.

ANSYS, Inc. (ANSS) reported strong Q3 2021 results with GAAP revenue of $441.2 million, a 20% increase from Q3 2020. Non-GAAP revenue reached $445.4 million, marking a 21% rise. Diluted EPS was $0.97 on a GAAP basis and $1.59 non-GAAP, reflecting respective growths of 11% and 17%. The company raised its FY 2021 guidance for revenue to between $1.860 billion and $1.900 billion, attributing growth to a robust sales pipeline and recent acquisition of Zemax, which is anticipated to positively impact future results.

Ansys collaborates with Oculii to enhance automotive radar systems using AI. Their technology increases radar resolution up to 100X while reducing costs and complexity. Oculii's AI software, powered by Ansys HFSS, accelerates design cycles and improves predictive accuracy (80-90%). The global automotive radar market is projected to reach $12.5 billion by 2026, driven by self-driving technology demand. This partnership aims to address engineering challenges in autonomous vehicles, ensuring safety and advanced driver assistance systems.

Seagate Technology has expanded its partnership with Ansys through a new three-year agreement, enhancing its use of Ansys' multiphysics simulation software for product innovation. This collaboration aims to improve data storage solutions' fidelity and speed, reducing late-stage redesigns and associated costs. Seagate is applying these tools in the development of its advanced Heat-Assisted Magnetic Recording technology, which promises significant increases in data bit density, leading to higher capacity drives. This strategic expansion reaffirms the effectiveness of simulation in modern engineering.

Ansys and TSMC have collaborated to provide a sophisticated thermal analysis solution for multi-die designs utilizing TSMC's 3DFabric technologies. This solution includes the use of Ansys RedHawk-SC for power integrity signoff and Icepak for thermal analysis, which are critical for preventing overheating in electronic systems. The collaboration aims to enhance the reliability of complex chip-and-package systems. A paper detailing this solution was presented at the TSMC 2021 Open Innovation Platform Ecosystem Forum.

Ansys has appointed Anil Chakravarthy to its Board of Directors, effective October 26, 2021. Chakravarthy, with extensive experience in digital transformation, SaaS, and cloud technologies, previously served as an executive at Adobe, CEO of Informatica, and held roles at Symantec and VeriSign. His appointment is viewed positively as he brings valuable insights for accelerating growth and innovation at Ansys, a leader in engineering simulation. His expertise in transforming businesses aligns with Ansys's vision of improving product delivery.