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Ansys Inc. (NASDAQ: ANSS) is a global leader in engineering simulation software, enabling innovators across various industries to push boundaries by predicting how their designs will perform in the real world. Founded in 1970, Ansys employs over 4,000 professionals, including many master’s and Ph.D.-level engineers, making it the largest simulation provider with such expertise. The company's core competencies include finite element analysis, computational fluid dynamics, electronics, electromagnetics, and design optimization.
Ansys serves over 50,000 customers globally, including those in aerospace, defense, automotive, semiconductor, and more. Known for its steady growth and financial strength, Ansys reinvests 15% of its revenues annually into research and development to maintain its innovative edge. This dedication has earned the company recognition as one of the world's most innovative and fastest-growing companies by prestigious organizations such as BusinessWeek and Fortune magazines.
Recently, Ansys has expanded its electronics portfolio by integrating SynMatrix with Ansys HFSS™ to streamline RF filter design workflows, particularly for 5G, aerospace, defense, satellite communications, and radar applications. This integration reduces design time by over 50%, leveraging AI-driven optimization for enhanced design and modeling.
Ansys is also collaborating with BAE Systems, Inc. to accelerate the adoption of digital engineering and model-based systems engineering across the U.S. Department of Defense. This partnership aims to modernize system design, delivery, and operation, enhancing decision-making for critical programs.
In the realm of AI, Ansys has launched AnsysGPT™, an AI-powered virtual assistant that offers rapid, 24/7 customer support by merging ChatGPT technology with Ansys’ extensive knowledge base. AnsysGPT is designed to assist engineers with real-time responses, streamlining simulation setup and related queries.
Financially, Ansys reported first-quarter 2024 revenue of $466.6 million, with a GAAP diluted earnings per share of $0.40. Despite a slight decline compared to the previous year, Ansys continues to anticipate double-digit annual contract value and revenue growth in the remaining quarters of 2024.
Looking ahead, Ansys is set to be acquired by Synopsys, Inc. in a transaction expected to close in the first half of 2025. This acquisition aims to create a leader in silicon-to-systems design solutions, combining Synopsys' semiconductor electronic design automation with Ansys’ comprehensive simulation and analysis portfolio.
ANSYS, Inc. (ANSS) reported strong Q3 2021 results with GAAP revenue of $441.2 million, a 20% increase from Q3 2020. Non-GAAP revenue reached $445.4 million, marking a 21% rise. Diluted EPS was $0.97 on a GAAP basis and $1.59 non-GAAP, reflecting respective growths of 11% and 17%. The company raised its FY 2021 guidance for revenue to between $1.860 billion and $1.900 billion, attributing growth to a robust sales pipeline and recent acquisition of Zemax, which is anticipated to positively impact future results.
Ansys collaborates with Oculii to enhance automotive radar systems using AI. Their technology increases radar resolution up to 100X while reducing costs and complexity. Oculii's AI software, powered by Ansys HFSS, accelerates design cycles and improves predictive accuracy (80-90%). The global automotive radar market is projected to reach $12.5 billion by 2026, driven by self-driving technology demand. This partnership aims to address engineering challenges in autonomous vehicles, ensuring safety and advanced driver assistance systems.
Seagate Technology has expanded its partnership with Ansys through a new three-year agreement, enhancing its use of Ansys' multiphysics simulation software for product innovation. This collaboration aims to improve data storage solutions' fidelity and speed, reducing late-stage redesigns and associated costs. Seagate is applying these tools in the development of its advanced Heat-Assisted Magnetic Recording technology, which promises significant increases in data bit density, leading to higher capacity drives. This strategic expansion reaffirms the effectiveness of simulation in modern engineering.
Ansys and TSMC have collaborated to provide a sophisticated thermal analysis solution for multi-die designs utilizing TSMC's 3DFabric technologies. This solution includes the use of Ansys RedHawk-SC for power integrity signoff and Icepak for thermal analysis, which are critical for preventing overheating in electronic systems. The collaboration aims to enhance the reliability of complex chip-and-package systems. A paper detailing this solution was presented at the TSMC 2021 Open Innovation Platform Ecosystem Forum.
Ansys has appointed Anil Chakravarthy to its Board of Directors, effective October 26, 2021. Chakravarthy, with extensive experience in digital transformation, SaaS, and cloud technologies, previously served as an executive at Adobe, CEO of Informatica, and held roles at Symantec and VeriSign. His appointment is viewed positively as he brings valuable insights for accelerating growth and innovation at Ansys, a leader in engineering simulation. His expertise in transforming businesses aligns with Ansys's vision of improving product delivery.
Ansys and Electro Magnetic Applications, Inc. have launched EMA3D Charge, a new simulation solution for predicting charging and discharging events in electronic components. This solution aims to enhance safety and design efficiency across industries such as aerospace, electronics, and automotive by allowing engineers to identify risks early in the design process. The intuitive interface and end-to-end workflow of EMA3D Charge could reduce late-phase redesign costs, thereby saving companies potentially millions of dollars.
On October 20, 2021, Ansys (NASDAQ: ANSS) announced a collaboration with Ford to advance predictive smart headlight technology. The partnership utilizes Ansys' AVxcelerate Headlamp solution to enhance headlight performance through virtual simulations, significantly reducing costs and time associated with physical testing. The new system uses real-time data to improve visibility and safety during night driving, enabling Ford to optimize designs before creating physical prototypes. This innovation represents a significant step in automotive safety, leveraging simulation technology to reduce accidents.
Ansys has announced that its LS-DYNA software is the first commercial CAE structural simulation solution to support Fujitsu's Arm-based PRIMEHPC supercomputers. This collaboration aims to lower computing costs and enhance sustainability by reducing energy consumption during simulations. Early tests indicate the single precision version of LS-DYNA runs over 2X faster on the PRIMEHPC FX1000 than on its predecessor. Ansys is set to release a double precision version in 2022, further expanding its HPC offerings for energy-efficient product development.
ANSYS (NASDAQ: ANSS) will release its third quarter earnings on November 3, 2021, after market close. A conference call led by CEO Ajei Gopal and CFO Nicole Anasenes will follow on November 4, 2021, at 8:30 a.m. ET to discuss the results and future outlook. Participants can pre-register for the call or join directly on the event day. The call will also be recorded and available for replay shortly after.
As a leader in engineering simulation, ANSYS aids companies in overcoming complex design challenges and enhancing product development.
Ansys (NASDAQ: ANSS) announced the upcoming launch of its first metal stamping simulation software, Ansys Forming, set for release in January. This all-in-one platform is designed to address various metal stamping needs, empowering engineers with early-stage design configurations and enhanced predictive accuracy using Ansys LS-DYNA as its solver. Ansys Forming allows users to optimize their workflows by eliminating physical testing, improving productivity, and driving cost savings. The software aims to deliver detailed insights into structural weaknesses and increase accessibility for users, streamlining the metal manufacturing process.
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