Ansys Multiphysics Signoff Solutions Certified for Samsung's 2nm Power Backside Delivery Technology
Ansys (NASDAQ: ANSS) announced that its power integrity solutions, RedHawk-SC™ and Totem™, have been certified by Samsung Foundry for the new SF2Z 2nm gate-all-around manufacturing technology. This innovative technology shifts the power distribution network to the backside of the chip, optimizing space, reducing costs, and enhancing performance. The certification enables early adopters to design advanced semiconductor products for applications like high-performance computing, AI, smartphones, data centers, and graphics processors. The RedHawk-SC platform offers accurate signoff verification for electromigration and voltage drop, while Totem focuses on analog and mixed-signal designs, ultimately reducing project risk and improving chip reliability.
- Certification of Ansys' RedHawk-SC™ and Totem™ power integrity solutions for Samsung's SF2Z 2nm technology.
- Enables design of next-gen semiconductor products for HPC, AI, smartphones, data centers, and graphics processors.
- Improves performance and lowers costs through innovative backside power distribution network.
- Reduces project risk and increases reliability and longevity of semiconductor chips.
- None.
Insights
Ansys certification of its power integrity solutions by Samsung for their new 2nm gate-all-around manufacturing technology marks a significant milestone in semiconductor development. The 2nm process introduces power backside delivery, shifting power distribution to the chip's backside. This innovation not only saves space but also improves performance and reduces costs. Such advancements are critical as semiconductor demands rise in areas like high-performance computing, AI and data center communication. Early adopters using Ansys' RedHawk-SC and Totem power integrity platforms will benefit from reliable design tools, translating to reduced project risks and enhanced chip reliability.
By providing accurate signoff verification for electromigration and IR drop, RedHawk-SC ensures the stability of digital designs, a important factor given the complexities of today's semiconductor landscapes. Meanwhile, the Totem platform addresses analog and mixed-signal designs, broadening the scope of Ansys' impact.
This development aligns with industry trends towards more efficient and potent chip designs. It's also promising for Samsung, reinforcing their competitive edge in semiconductor manufacturing. However, the real-world performance will hinge on how swiftly and efficiently the broader industry can adapt these technologies into their design and manufacturing ecosystems.
The certification of Ansys' tools by Samsung signifies a strategic collaboration between two industry leaders, likely to influence investor sentiment positively. For Ansys, this certification underscores their role as an essential player in the semiconductor design tool market. Investors should note that the semiconductor industry is highly competitive and continuously evolving. The successful integration of Ansys' platforms into Samsung's advanced manufacturing processes could lead to increased revenue streams and a stronger market position for Ansys.
Furthermore, the sectors impacted—HPC, AI, data centers—are among the fastest-growing markets, potentially amplifying the demand for Ansys' solutions. However, investors should remain cautious of market dynamics, including potential competition and technological challenges that could affect adoption rates.
Certification of Ansys power integrity platforms includes revolutionary new technology for power distribution on advanced chips
/ Key Highlights
- Ansys RedHawk-SC™ and Ansys Totem™ power integrity platforms are certified for Samsung's SF2Z manufacturing technology
- Ansys solutions enable early adopters to reliably design leading-edge semiconductor products for high-performance computing (HPC), smartphones, artificial intelligence (AI), data center communication, and graphics processors
The certification includes RedHawk-SC, which provides predictively accurate signoff verification for electromigration and voltage drop (IR drop) on power distribution networks for digital designs. In addition, the Totem power integrity platform provides comprehensive evaluation for analog and mixed-signal designs. Both RedHawk-SC and Totem signoff capabilities can reduce project risk, improve reliability, and extend the longevity of chips.
"Samsung Foundry has worked very closely with Ansys for many years to ensure that our mutual customers have timely access to the design tools they need," said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. "Our continued collaboration with Ansys is critical as we tackle new customer challenges in digital, full-custom, mixed-signal, and 3D-IC designs."
"Ansys and Samsung are focused on delivering technology enablement solutions that meet our customers' semiconductor technology needs," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "This collaboration supports the fidelity of our Ansys multiphysics signoff platform and exemplifies Ansys' commitment to powering the best user experience for our joint customers."
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
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