Ansys 2025 R1 Increases Collaboration, Expands Cloud and AI Functionality, and Delivers Data-Driven Insights with Powerful Digital Engineering Technology
Ansys (NASDAQ: ANSS) has released its 2025 R1 update, introducing significant enhancements to its digital engineering technologies. The release features expanded AI and cloud computing capabilities, including improvements to SimAI for enhanced post-processing insights and new GPU-powered solutions.
Key improvements include the new CFD HPC Ultimate product for enterprise-level computational fluid dynamics, support for SysML v2 in System Architecture Modeler, and significant performance boosts across various platforms. The Fluent multi-GPU solver now handles larger mesh cell counts, while Mechanical GPU-accelerated solver achieves up to 6x faster performance than alternatives.
The update also introduces PowerX, a new tool for power FET and PMIC analysis, and enhances the Minerva simulation process with improved data management capabilities. These improvements aim to accelerate product development, reduce costs, and facilitate better cross-team collaboration.
Ansys (NASDAQ: ANSS) ha rilasciato il suo aggiornamento 2025 R1, introducendo miglioramenti significativi alle sue tecnologie di ingegneria digitale. L'uscita presenta capacità ampliate di AI e cloud computing, inclusi miglioramenti a SimAI per approfondimenti di post-elaborazione migliori e nuove soluzioni potenziate da GPU.
I miglioramenti chiave includono il nuovo prodotto CFD HPC Ultimate per la dinamica dei fluidi computazionali a livello enterprise, supporto per SysML v2 nel System Architecture Modeler e notevoli aumenti di prestazioni su varie piattaforme. Il risolutore multi-GPU Fluent ora gestisce un numero maggiore di celle della maglia, mentre il risolutore meccanico accelerato da GPU raggiunge prestazioni fino a 6 volte più veloci rispetto alle alternative.
L'aggiornamento introduce anche PowerX, un nuovo strumento per l'analisi di FET e PMIC, e migliora il processo di simulazione di Minerva con capacità di gestione dei dati migliorate. Questi miglioramenti mirano ad accelerare lo sviluppo del prodotto, ridurre i costi e facilitare una migliore collaborazione tra i team.
Ansys (NASDAQ: ANSS) ha lanzado su actualización 2025 R1, introduciendo mejoras significativas en sus tecnologías de ingeniería digital. La versión incluye capacidades ampliadas de IA y computación en la nube, que incluyen mejoras en SimAI para obtener mejores cosnecimientos de posprocesamiento y nuevas soluciones potenciadas por GPU.
Las mejoras clave incluyen el nuevo producto CFD HPC Ultimate para dinámica de fluidos computacional a nivel empresarial, soporte para SysML v2 en el Modelador de Arquitectura de Sistemas y aumentos significativos en el rendimiento en diversas plataformas. El solucionador multi-GPU Fluent ahora maneja un mayor número de celdas de malla, mientras que el solucionador mecánico acelerado por GPU logra hasta 6 veces más rendimiento que las alternativas.
La actualización también presenta PowerX, una nueva herramienta para análisis de FET y PMIC, y mejora el proceso de simulación de Minerva con capacidades mejoradas de gestión de datos. Estas mejoras tienen como objetivo acelerar el desarrollo del producto, reducir costos y facilitar una mejor colaboración entre equipos.
Ansys (NASDAQ: ANSS)는 2025 R1 업데이트를 발표하며 디지털 엔지니어링 기술에 중대한 개선을 도입했습니다. 이번 릴리스는 AI 및 클라우드 컴퓨팅 기능을 확대하고 있으며, SimAI의 후처리 통찰력을 향상시키고 새로운 GPU 기반 솔루션을 포함하고 있습니다.
주요 개선 사항으로는 기업 수준의 전산 유체 역학을 위한 새로운 CFD HPC Ultimate 제품과 시스템 아키텍처 모델러에서 SysML v2에 대한 지원, 다양한 플랫폼에서의 성능 향상이 포함됩니다. Fluent 멀티-GPU 해결기는 더 많은 메쉬 셀 수를 처리할 수 있으며, 기계적 GPU 가속 해결기는 기존 솔루션보다 최대 6배 더 빠른 성능을 달성합니다.
또한 업데이트는 전력 FET 및 PMIC 분석을 위한 새로운 도구 PowerX를 소개하며, Minerva 시뮬레이션 프로세스를 개선된 데이터 관리 기능으로 강화합니다. 이러한 개선은 제품 개발을 가속화하고 비용을 절감하며 팀 간 협업을 촉진하는 것을 목표로 합니다.
Ansys (NASDAQ: ANSS) a publié sa mise à jour 2025 R1, introduisant d'importantes améliorations à ses technologies d'ingénierie numérique. La sortie propose des capacités élargies en IA et en cloud computing, y compris des améliorations de SimAI pour des analyses post-traitement améliorées et de nouvelles solutions propulsées par GPU.
Parmi les améliorations clés, citons le nouveau produit CFD HPC Ultimate pour la dynamique des fluides computationnelle à l'échelle de l'entreprise, le support de SysML v2 dans le modélisateur d'architecture système et des augmentations significatives de performance sur diverses plateformes. Le solveur multi-GPU Fluent gère maintenant un plus grand nombre de cellules de maillage, tandis que le solveur mécanique accéléré par GPU atteint des performances jusqu'à 6 fois plus rapides que les alternatives.
La mise à jour introduit également PowerX, un nouvel outil pour l'analyse des transistor de puissance et PMIC, et améliore le processus de simulation Minerva avec des capacités de gestion des données améliorées. Ces améliorations visent à accélérer le développement de produits, à réduire les coûts et à faciliter une meilleure collaboration entre les équipes.
Ansys (NASDAQ: ANSS) hat sein 2025 R1 Update veröffentlicht, das bedeutende Verbesserungen seiner digitalen Engineering-Technologien einführt. Die Veröffentlichung enthält erweiterte KI- und Cloud-Computing-Funktionen, einschließlich Verbesserungen von SimAI für optimierte Nachbearbeitungsanalysen und neue GPU-gestützte Lösungen.
Zu den wichtigsten Verbesserungen gehören das neue Produkt CFD HPC Ultimate für die computergestützte Strömungsmechanik auf Unternehmensebene, die Unterstützung von SysML v2 im Systemarchitektur-Modellierer und erhebliche Leistungssteigerungen auf verschiedenen Plattformen. Der Fluent-Multi-GPU-Solver kann jetzt größere Zellzahlen im Netz verarbeiten, während der mechanische, GPU-beschleunigte Solver bis zu 6-mal schnellere Leistungen als Alternativen erzielt.
Das Update führt auch PowerX ein, ein neues Tool zur Analyse von Leistungstransistoren und PMIC, und verbessert den Simulationsprozess von Minerva mit optimierten Datenmanagement-Funktionen. Diese Verbesserungen zielen darauf ab, die Produktentwicklung zu beschleunigen, Kosten zu senken und eine bessere Zusammenarbeit zwischen den Teams zu ermöglichen.
- Introduction of CFD HPC Ultimate product enabling enterprise-level CFD capabilities without additional HPC licenses
- GPU-accelerated simulations showing significant performance improvements (up to 6x faster)
- Cloud Burst Compute with Discovery enables solving 1,000 design variations in 10 minutes
- New PowerX tool introduction for power FET and PMIC analysis
- 20% reduction in meshing time for Lumerical FDTD simulations
- None.
Insights
The 2025 R1 release represents a strategic evolution in Ansys's product portfolio, particularly significant in three key areas: AI integration, cloud computing and GPU acceleration. The new CFD HPC Ultimate product addresses a critical market need by enabling enterprise-level CFD capabilities without additional HPC licenses, potentially reducing customer costs while increasing accessibility to high-performance computing resources.
The integration of AI through SimAI and Electronics AI+ positions Ansys at the forefront of the AI-driven simulation revolution. The reported 6x performance improvement in GPU-accelerated structural analysis and 100x acceleration in parametric studies demonstrate substantial efficiency gains that could translate into significant cost savings for customers. These improvements are particularly valuable for industries like aerospace and automotive, where simulation complexity and time-to-market pressures are increasing.
The enhanced MBSE capabilities and SysML v2 support in ModelCenter and SAM are strategically important as they address the growing industry trend toward digital twin technology and integrated systems engineering. This positions Ansys to capture more market share in the rapidly growing digital engineering space, estimated to reach
The focus on GPU optimization and cloud computing aligns with the industry shift toward more flexible, scalable computing resources. The ability to solve 1,000 design variations in 10 minutes through Cloud Burst Compute represents a paradigm shift in simulation capabilities, potentially transforming how companies approach product development and optimization.
This release significantly strengthens Ansys's market position through strategic product enhancements that address key industry pain points. The introduction of CFD HPC Ultimate represents a potential new revenue stream while simultaneously lowering barriers to entry for enterprise-level CFD capabilities. This could accelerate adoption among mid-sized companies previously priced out of advanced simulation tools.
The enhanced AI and cloud capabilities position Ansys to capitalize on the growing demand for scalable, efficient engineering solutions. The 50% reduction in GPU memory usage and 20% reduction in meshing time for Lumerical FDTD demonstrate tangible efficiency improvements that could drive customer adoption and retention.
Customer testimonials from Firefly Aerospace and Vertiv validate the real-world impact of these improvements, particularly in high-stakes industries where simulation accuracy and speed are critical. The platform's ability to integrate with existing infrastructure minimizes adoption barriers, potentially accelerating market penetration and customer acquisition rates.
The expanded MBSE capabilities and improved data management features address the growing market demand for integrated engineering solutions, potentially opening new opportunities in industries transitioning to digital engineering practices. This positions Ansys to capture a larger share of the digital transformation spending in traditional engineering sectors.
Digital engineering-enabling technologies connect parallel workstreams, reducing costly prototyping, facilitating cross-functional collaboration, and accelerating time-to-market
/ Key Highlights
- The Ansys SimAI™ cloud-enabled artificial intelligence solution now allows users to expand the training data to gain further insight during post-processing
- New capabilities in the Ansys System Architecture Modeler (SAM)™ include support for SysML v2, enabling more optimized product designs and significant time savings by creating tighter connections across teams while making product requirements accessible and scalable across the engineering organization
- CFD HPC Ultimate is a new product that enables enterprise-level computational fluid dynamics (CFD) capabilities for one job on multiple CPU cores or GPUs — without the need for additional high-performance computing (HPC) licenses
"Ansys 2025 R1 offers more integration capabilities than ever, helping teams carve a digital path through the entire lifecycle of a product, with tools and solutions to help expertly manage data pre- and post-development," said Shane Emswiler, senior vice president of products at Ansys. "This release highlights that our solutions can serve as guideposts, helping disconnected teams stay the course and work collaboratively from a single, accessible source of truth. This not only significantly cuts costs, but it also accelerates time-to-market, which helps our customers stay competitive."
As products become more integrated and complex, R&D processes must adapt to meet growing and ever-changing market demands. Ansys meets customers where they are in their digital transformation journey and equips them with tools and solutions to meet evolving market needs.
Advanced physics solvers
Ensuring product performance begins with understanding the multiphysics involved, from the components to the system. The latest release from Ansys highlights new products and capabilities that deliver fast, high-fidelity, physics-based results, helping teams make informed decisions earlier in the design cycle:
- Ansys Discovery™ 3D simulation software significantly expands thermal modeling with the addition of electrothermal analysis, orthotropic conductivity, and internal fans while maintaining speed and ease of use
- The structural analysis suite features a fully integrated solution for noise, vibration, harshness (NVH), delivering 10x faster frequency response function (FRF) calculator, vibro-acoustics mapping, optimized meshing, and mode contribution analysis
- Ansys Electronics connects to other Ansys software products, enabling improved meshing that is crucial for 3D integrated circuits, automated workflow capabilities, and boosted simulation performance
- A new Polymer FEM product utilizes high-fidelity models to capture real-world materials behavior, addressing customers' evolving materials simulation requirements
"The Ansys platform offers key advantages for Firefly as we rapidly innovate to support responsive space services," said Brigette Oakes, vice president of engineering at Firefly Aerospace. "CFD is one area where Ansys shines — Fluent accurately models combustion dynamics and complex thermal interactions in our engine designs. Its integration of thermal and structural analysis simplifies workflows, and its user-friendly interface and responsive support team make it a critical tool for a fast-paced company like ours."
Cloud, HPC, and GPUs
The power of cloud computing, HPC, and GPUs are changing the speed at which modern products are engineered. Accessibility, interoperability, and scalability are the heart of this evolution, empowering customers to go beyond the limits of desktop applications to collaboratively design more innovative products. Ansys R1 highlights advancements to its GPU solvers and adds web-based, on-demand capabilities to a variety of applications:
- The Ansys Fluent® multi-GPU fluid simulation solver now supports applications with very high total mesh cell counts, such as automotive external aerodynamics. This allows designers to add more parameters to refine accuracy without compromising overall simulation speed
- Ansys CFD HPC Ultimate is a new product that enables enterprise-level CFD capabilities for one job on multiple CPU cores or GPUs without the need for additional HPC licenses
- New GPU-accelerated simulations in Ansys Lumerical FDTD™ advanced 3D electromagnetic simulation software uses
50% less GPU memory and provides a20% reduction in meshing time compared to CPUs - The Ansys Mechanical™ GPU-accelerated direct structural finite element analysis solver is up to 6x faster than alternative solutions and the iterative solver is 6x faster than CPU-only versions
- Ansys Cloud Burst Compute with Discovery empowers designers to solve 1,000 design variations in 10 minutes. Parametric studies in Discovery are accelerated by 100x or more by leveraging NVIDIA GPUs
- The Ansys Cloud Burst Compute capability provides elastic, flexible, on-demand HPC capacity for Ansys Mechanical, Fluent, and Ansys HFSS™ high-frequency electromagnetic simulation software
Artificial intelligence
Ansys continues to deepen its portfolio with AI-augmented technologies, bringing unparalleled speed, innovation, and accessibility to the computer-aided engineering (CAE) industry. Ansys AI allows teams to use new or previously generated data to analyze designs within minutes, rapidly train their own AI models, speed time-to-market, and reduce costs:
- Ansys has developed an intuitive, interactive tool to streamline data preparation for SimAI modeling
- SimAI now allows users to expand the training data to gain further insight during post-processing, such as honing analysis around a specific component within a larger design
- Ansys Electronics AI+ uses AI-driven techniques to predict resources and runtime for electronics simulations in Ansys Maxwell® advanced electromagnetic field solver, Ansys Icepak® electronics cooling simulation software, and HFSS
- Advanced synthetic radar simulation within Ansys RF Channel Modeler™ high-fidelity wireless channel modeling software empowers the digital mission engineering community with a comprehensive training and validation dataset for ground-based AI target identification
"Ansys' industry-leading simulation solutions will help drive Vertiv's business model as we design solutions for the future," said Steve Blackwell, vice president of engineering at Vertiv. "Our mission is to revolutionize the way the world conceptualizes and develops data centers — from cooling and power technologies through implementing AI in the design of the data center itself. With Ansys, we will more quickly meet critical milestones that will help us deliver the most optimal infrastructure to support our customers' AI-based projects with energy-efficient and reliable future-forward designs."
Connected ecosystem
Cutting-edge R&D involves adopting design methodologies like model-based systems engineering (MBSE) and automation to keep workflows seamless and efficient. Ansys solutions are interoperable and scalable, making it easy to integrate new technologies into existing infrastructure to avoid product design disruption. Included in the Ansys 2025 R1 are enhancements that focus on MBSE capabilities and data management to make the digital transition easier:
- Ansys ModelCenter® MBSE software and SAM deliver upgraded support for SysML v2, allowing more optimized product designs and significant time savings by creating tighter connections across teams while making product requirements accessible and scalable across the engineering organization
- ModelCenter now has improved MBSE connectivity for greater compatibility, including an enhanced Capella connector and deeper integration with Ansys SAM for intuitive search, save, and modification
- Ansys Minerva® simulation process and data management software generic connector improvements help reduce the time and cost of implementation by standardizing how external data is brought into Minerva, allowing users to verify and resolve any conflicts before uploading. The connector also helps improve engineer productivity with new asynchronous job launch capabilities
Additional R1 announcements include:
- Ansys optiSLang® process integration and design optimization software includes enhancements across interfaces, distributed computing, and more advanced algorithms, adding flexibility and performance to the design workflow
- Ansys Granta Materials Intelligence (MI)® product collection's integrations with CAE, computer-aided design, and product lifecycle management software now feature a unified user experience between the Granta end-user interface and the integration interfaces
- Task-based performance improvements made to the fault tolerant meshing and watertight meshing workflows in Fluent improve meshing speeds
- Ansys PowerX™, a new tool for power field-effect transistor (FET) and power management integrated circuit (PMIC) analysis, simulation, and optimization
Click here to learn more about Ansys 2025 R1.
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in
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724.820.4368 | |
Investors | Kelsey DeBriyn |
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