Ansys Joins TSMC's OIP Cloud Alliance for Secure Multiphysics Analysis in the Cloud

Rhea-AI Summary

Ansys has announced its partnership with TSMC as a new member of the OIP Cloud Alliance, aimed at enhancing multiphysics analysis tools for cloud usage. This collaboration will facilitate faster run times and elastic computing for mutual customers utilizing major cloud platforms. Notably, Ansys has integrated its tools to optimize workflows for distributed computing, significantly benefiting sectors ranging from AI to high-performance computing. Ansys' cloud-native platform, SeaScape, has been pivotal in this integration, supporting tools like RedHawk-SC and others. TSMC's leadership emphasizes the importance of this partnership in accelerating product development and improving quality for customers.

Positive

• Partnership with TSMC enhances cloud capabilities for Ansys tools.
• Faster run times and elastic computing will benefit mutual customers.
• Integration of Ansys multiphysics tools into major cloud platforms enhances productivity.
• Investment in cloud-native platforms like SeaScape positions Ansys competitively.

Negative

• None.

TSMC and Ansys are partnering to enable Ansys multiphysics analysis tools to work easily together with data security across major cloud providers

/ Key Highlights

• Ansys tools and flows are designed natively for the cloud
• Mutual customers will benefit from faster run times and elastic computing with major cloud vendors

PITTSBURGH, April 26, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) announced that it has joined TSMC's OIP Cloud Alliance to facilitate the deployment of fully distributed workflows for mutual customers. By driving toward the cloud interoperability of Ansys multiphysics solutions with TSMC's technology enablement, customers will easily be able to gain the full benefits of faster run times and elastic computing with major cloud vendors.

Combining EDA parallelism and cloud scalability, TSMC and its OIP Cloud Alliance partners are creating next-generation, cloud-optimized design methodologies to further accelerate turnaround time of critical design tasks. Ansys and other EDA partners will optimize their tools for multi-threaded, fully-distributed runs to best utilize cloud, while cloud partners will bring new virtual machines most suitable for the EDA workload of IC designs.

"Our customers of all sizes are leveraging the cloud to boost productivity while designing in TSMC's leading-edge technologies for new applications from high performance computing to mobile, artificial intelligence, networking, and 3D-IC," said Dan Kochpatcharin, head of the Design Infrastructure Management Division at TSMC. "By welcoming Ansys as the latest member into our OIP Cloud Alliance, TSMC aims to make Ansys' leading multiphysics signoff solutions available to all of our customers and help them bring their differentiated products to market sooner, with higher quality."

Ansys was an early adopter of elastic cloud computing with its SeaScape big-data platform – a cloud-native data infrastructure that was designed specifically for EDA. Ansys® RedHawk-SC™ was the first tool built to work with SeaScape (SC) and many other Ansys semiconductor tools have followed, including Ansys® PathFinder-SC™, Ansys® Totem-SC™, and Ansys® PowerArtist-SC™.

"Ansys' strategy for the future foresees an absolutely central role for cloud computing," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "We have invested heavily in cloud-enabled platforms that give our products clear advantages in speed and capacity over traditional tool environments that were not designed for the cloud."

/ About Ansys

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

Take a leap of certainty … with Ansys.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS–T

/ Contacts

Media	Mary Kate Joyce
	724.820.4368
	marykate.joyce@ansys.com
Investors	Kelsey DeBriyn
	724.820.3927
	kelsey.debriyn@ansys.com

 

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SOURCE Ansys

FAQ

What is the significance of Ansys joining TSMC's OIP Cloud Alliance?

Ansys joining the OIP Cloud Alliance enhances the compatibility and performance of their multiphysics analysis tools in cloud environments, benefiting customers with faster processing and improved workflows.

How will Ansys tools perform better in the cloud after partnering with TSMC?

The partnership with TSMC allows for optimized workflows and faster run times, leveraging cloud scalability and elastic computing, enhancing the efficiency of design tasks.

When was the partnership between Ansys and TSMC announced?

The partnership was announced on April 26, 2023.

What are the main benefits of Ansys' SeaScape platform in this partnership?

SeaScape provides a cloud-native data infrastructure optimized for electronic design automation, enabling faster and more efficient processing for Ansys tools.

What areas of technology will benefit from the Ansys and TSMC partnership?

The partnership will benefit various sectors, including high-performance computing, artificial intelligence, networking, and 3D-IC designs.