Amkor Technology Inc - AMKR STOCK NEWS

Lightmatter and Amkor Technology (Nasdaq: AMKR) have announced a strategic partnership to create the largest-ever 3D-packaged chip complex using Lightmatter's Passage™ platform. The collaboration combines Lightmatter's 3D-stacked photonic engine with Amkor's multi-die packaging expertise to address AI workload demands. The Passage platform uses 3D integration of customer dies on a silicon photonic interconnect, enabling optical I/O across the chip area and providing higher connection density and bandwidth. The platform also integrates Optical Circuit Switching within the interconnect, offering enhanced resiliency and flexibility in interconnect topology.

Amkor Technology (Nasdaq: AMKR) announced a 5% increase in its quarterly cash dividend from $0.07875 to $0.08269 per share. Additionally, the Board approved a special cash dividend of approximately $100 million, or $0.40546 per share. Both dividends will be paid on December 23, 2024, to stockholders of record as of December 4, 2024. The special dividend aligns with Amkor's policy to return 40-50% of cumulative free cash flow to shareholders over time.

Amkor Technology (AMKR) reported Q3 2024 financial results with net sales of $1.86 billion, up 27% sequentially. The company achieved a gross profit of $272 million, operating income of $149 million, and net income of $123 million, resulting in earnings per diluted share of $0.49. The growth was primarily driven by strong demand for Advanced SiP technology in Communications and Consumer markets. The company maintains a strong financial position with $1.5 billion in cash and short-term investments, and $1.1 billion in total debt. For Q4 2024, Amkor projects net sales between $1.60-1.70 billion with gross margin of 13.5-15.5%.

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced that it will release its financial results for the third quarter of 2024 after the Nasdaq Global Select Market closes on Monday, October 28, 2024. The company will host a conference call and webcast to discuss the results on the same day at 5:00 p.m. Eastern Time.

Investors and interested parties can access the live audio webcast and accompanying slide presentation through the Investor Relations section of Amkor's website at ir.amkor.com. An archived replay of the webcast will be available after the call concludes. For those who prefer to join by phone, the live call can be accessed by dialing 1-877-407-4019 or 1-201-689-8337.

Amkor Technology (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) have signed a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor's planned facility in Peoria, Arizona, supporting TSMC's customers using its advanced wafer fabrication facilities in Phoenix.

The collaboration aims to accelerate product cycle times and address customer needs for geographic flexibility in manufacturing. The companies will jointly define specific packaging technologies, including TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®). This partnership supports the development of a comprehensive semiconductor manufacturing ecosystem in the United States and enables seamless technology alignment for customers across a global manufacturing network.

Amkor Technology, Inc. (Nasdaq: AMKR) announced that founder James Kim will retire as Executive Chairman effective October 31, 2024, after more than 56 years of service. Susan Y. Kim, currently Executive Vice Chairman, will become Chairman of the Board. James Kim will be recognized as Chairman Emeritus upon retirement.

Founded in 1968, Amkor is a leading provider of semiconductor packaging and test services. The company is well-positioned for growth with strong technology leadership in advanced packaging, a diversified global footprint, and partnerships with lead customers. CEO Giel Rutten expressed confidence in the company's future under the new leadership structure.

Amkor Technology (Nasdaq: AMKR), a leading semiconductor packaging and test services provider, has announced a quarterly cash dividend of $0.07875 per share on its common stock. The dividend is set to be paid on September 23, 2024, to stockholders of record as of the close of business on September 3, 2024. This announcement demonstrates Amkor's commitment to returning value to its shareholders and reflects the company's financial stability in the competitive semiconductor industry.

Amkor Technology (Nasdaq: AMKR) reported its Q2 2024 financial results, with net sales of $1.46 billion, up 7% sequentially. The company's gross profit was $212 million, with operating income of $82 million and net income of $67 million. Earnings per diluted share reached $0.27, while EBITDA stood at $247 million. The growth was primarily driven by Advanced packaging for premium tier smartphones and AI solutions. However, soft demand in Automotive & Industrial and Consumer markets partially offset the gains. Amkor's outlook for Q3 2024 projects net sales between $1.785 billion and $1.885 billion, with a gross margin of 14.0% to 16.0%. The company expects net income between $105 million and $140 million for Q3 2024.

Amkor Technology, Inc. (Nasdaq: AMKR) has signed a non-binding preliminary memorandum of terms with the US Department of Commerce for proposed funding under the CHIPS and Science Act. The agreement includes up to $400 million in direct funding and access to $200 million in loans for Amkor's planned $2 billion advanced packaging and test facility in Peoria, Arizona.

The facility, set to be the largest outsourced advanced packaging and test facility in the US, will create approximately 2,000 jobs and feature over 500,000 square feet of clean room space. Amkor plans to leverage the Department of the Treasury's Investment Tax Credit, expected to be up to 25% of qualified capital expenditures. The project aims to strengthen the domestic semiconductor supply chain and is scheduled to begin production within three years.