Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
Lightmatter and Amkor Technology (Nasdaq: AMKR) have announced a strategic partnership to create the largest-ever 3D-packaged chip complex using Lightmatter's Passage™ platform. The collaboration combines Lightmatter's 3D-stacked photonic engine with Amkor's multi-die packaging expertise to address AI workload demands. The Passage platform uses 3D integration of customer dies on a silicon photonic interconnect, enabling optical I/O across the chip area and providing higher connection density and bandwidth. The platform also integrates Optical Circuit Switching within the interconnect, offering enhanced resiliency and flexibility in interconnect topology.
Lightmatter e Amkor Technology (Nasdaq: AMKR) hanno annunciato una partnership strategica per creare il più grande complesso di chip impacchettati in 3D mai realizzato, utilizzando la piattaforma Passage™ di Lightmatter. La collaborazione combina il motore fotonico impilato in 3D di Lightmatter con l'esperienza di Amkor nel confezionamento multi-die, per rispondere alle esigenze dei carichi di lavoro dell'IA. La piattaforma Passage utilizza l'integrazione 3D dei die dei clienti su un'interconnessione fotonica in silicio, permettendo l'I/O ottico su tutta l'area del chip e fornendo una maggiore densità di connessione e larghezza di banda. La piattaforma integra anche il Switching Ottico a Circuito all'interno dell'interconnessione, offrendo maggiore resilienza e flessibilità nella topologia delle interconnessioni.
Lightmatter y Amkor Technology (Nasdaq: AMKR) han anunciado una asociación estratégica para crear el complejo de chip empaquetado en 3D más grande de la historia, utilizando la plataforma Passage™ de Lightmatter. La colaboración combina el motor fotónico apilado en 3D de Lightmatter con la experiencia en empaquetado de múltiples chips de Amkor para abordar las demandas de carga de trabajo de IA. La plataforma Passage utiliza la integración 3D de los chips de los clientes en una interconexión fotónica de silicio, permitiendo la I/O óptica en toda el área del chip y proporcionando una mayor densidad de conexión y ancho de banda. La plataforma también integra el Switching Óptico de Circuito dentro de la interconexión, ofreciendo una mayor resiliencia y flexibilidad en la topología de interconexiones.
라이트매터와 암코르 테크놀로지 (Nasdaq: AMKR)는 패세지™ 플랫폼을 사용하여 역사상 가장 큰 3D 패키징 칩 복합체를 만들기 위한 전략적 파트너십을 발표했습니다. 이 협력은 라이트매터의 3D 스택 포토닉 엔진과 암코르의 다이 패키징 전문성을 결합하여 AI 작업 부하 요구에 대응합니다. 패세지 플랫폼은 실리콘 포토닉 인터커넥트에서 고객 다이의 3D 통합을 사용하여 칩 영역에서 광학 I/O를 가능하게 하고, 더 높은 연결 밀도와 대역폭을 제공합니다. 이 플랫폼은 또한 인터커넥트 내에서 광 회로 스위칭을 통합하여 인터커넥트 토폴로지에서 향상된 강인성과 유연성을 제공합니다.
Lightmatter et Amkor Technology (Nasdaq: AMKR) ont annoncé un partenariat stratégique pour créer le plus grand complexe de puces emballées en 3D jamais réalisé, en utilisant la plateforme Passage™ de Lightmatter. La collaboration combine le moteur photonique empilé en 3D de Lightmatter avec l'expertise d'Amkor en matière d'emballage multi-die pour répondre aux exigences des charges de travail en IA. La plateforme Passage utilise l'intégration 3D des dies des clients sur une interconnexion photonique en silicium, permettant l'I/O optique sur toute la surface de la puce et offrant une densité de connexion et une bande passante plus élevées. La plateforme intègre également le commutateur de circuit optique au sein de l'interconnexion, offrant une résilience et une flexibilité accrues dans la topologie des interconnexions.
Lightmatter und Amkor Technology (Nasdaq: AMKR) haben eine strategische Partnerschaft angekündigt, um den bisher größten 3D-verpackten Chip-Komplex unter Verwendung der Passage™-Plattform von Lightmatter zu schaffen. Die Zusammenarbeit kombiniert den 3D-gestapelten photonischen Motor von Lightmatter mit der Multi-DIE-Verpackungsexpertise von Amkor, um den Anforderungen an KI-Workloads gerecht zu werden. Die Passage-Plattform nutzt die 3D-Integration der Kundendies auf einer Silizium-photonic Interconnect, was optische I/O über die gesamte Chipfläche ermöglicht und eine höhere Verbindungsdichte und Bandbreite bietet. Die Plattform integriert auch optisches Schaltkreis Switching innerhalb der Interconnect und bietet verbesserte Widerstandsfähigkeit und Flexibilität in der Interconnect-Topologie.
- Partnership enables industry's largest multi-reticle die complex on organic substrate
- Technology provides higher connection density and bandwidth both within and outside the package
- Integration of Optical Circuit Switching offers enhanced resiliency and flexibility
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Insights
The partnership between Lightmatter and Amkor represents a significant technological breakthrough in semiconductor packaging, addressing critical AI computing bottlenecks. The multi-reticle Passage™ platform introduces revolutionary 3D photonic interconnect capabilities that overcome traditional I/O bandwidth limitations through optical communication, enabling higher connection density and improved power efficiency.
This collaboration could potentially disrupt the semiconductor packaging industry by enabling larger, more complex chip designs that were previously impossible due to physical constraints. The integration of Optical Circuit Switching within the interconnect adds strategic value by improving system flexibility and reliability. For Amkor, this positions them at the forefront of next-generation packaging solutions, potentially capturing significant market share in the rapidly growing AI chip packaging segment.
Multi-Reticle Passage™ Implementation to be Showcased at SC24 in
With the end of Moore's Law, scaling AI performance at the chip level increasingly requires integrating more silicon in a single package. Many GPU and accelerator providers address this by incorporating multiple processor, memory and I/O chiplets onto an electrical silicon interposer. While this approach boosts compute capabilities within a package, the I/O bandwidth of the chip is severely constrained by the limited shoreline and the competing need to integrate more memory.
Lightmatter's Passage platform overcomes these shoreline constraints by using 3D integration of customer dies directly onto a silicon photonic interconnect, enabling optical I/O anywhere across the chip area. This platform provides significantly higher connection density and bandwidth both within and outside the package. Additionally, it natively integrates Optical Circuit Switching (OCS) within the interconnect, offering enhanced resiliency and flexibility in interconnect topology. Through their partnership, Lightmatter and Amkor are delivering unmatched advantages of this combined solution to customers, enabling the industry’s largest multi-reticle die complex on an organic substrate within a 3D package.
“We are delighted to partner with Amkor on a 3D photonics solution that pushes both the boundaries of advanced packaging as well as silicon performance,” said Ritesh Jain, SVP of Engineering and Operations at Lightmatter. “This collaboration is a pivotal step in building a world-class ecosystem that empowers our customers to realize AI and HPC compute offerings with unprecedented bandwidth and efficiency.”
As AI processors grow larger, so does their power consumption, doubling every two years. Passage, an all-photonic silicon interconnect layer, seamlessly integrates into a 3D package to address this challenge. This innovative approach enables superior energy efficiency and performance, particularly in demanding thermal conditions. The combined expertise of Lightmatter and Amkor in photonics and 3D packaging has led to a breakthrough that unlocks unprecedented silicon density and bandwidth within a single package. This technological achievement paves the way for the next major computing advances, including AGI.
“As a leader in advanced semiconductor packaging, we are thrilled to collaborate with Lightmatter on integration with their cutting-edge Passage platform,” said Kevin Engel, EVP, Business Units at Amkor. “Leveraging our deep semiconductor integration expertise, we are working closely with Lightmatter to develop and validate a robust 3D packaging solution to bring this groundbreaking silicon photonics technology to mainstream market availability.”
For more information, visit www.lightmatter.co or join us at booth number 511 at SC24 on November 19-21 in
About Lightmatter
Lightmatter is leading a revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company’s groundbreaking Passage™ platform—the world’s first 3D-stacked silicon photonics engine—connects thousands to millions of processors at the speed of light. Designed to eliminate critical data bottlenecks, Lightmatter’s technology enables unparalleled efficiency and scalability for the most advanced AI and high-performance computing workloads, pushing the boundaries of AI infrastructure.
About Amkor Technology, Inc.
Amkor Technology, Inc. is the world's largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey manufacturing services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor's operational base includes production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in
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Media Contacts:
Lightmatter
John O’Brien
press@lightmatter.co
Source: Lightmatter
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