Samsung Electro-Mechanics Collaborates with AMD to Supply High-Performance Substrates for Hyperscale Data Center Computing
Samsung Electro-Mechanics (SEMCO) has announced a collaboration with AMD to supply high-performance substrates for hyperscale data center computing. These substrates, produced in SEMCO's Busan technology hub and new Vietnam factory, are designed to enhance the performance and reliability of next-generation data centers.
The semiconductor substrate market is projected to grow at a 7% annual rate, reaching 20 trillion KRW by 2028. SEMCO's 1.9 trillion KRW investment in its FCBGA factory demonstrates its commitment to advancing substrate technology. The collaboration focuses on integrating multiple semiconductor chips (Chiplets) on large substrates, which are ten times larger and have three times more layers than standard computer substrates.
SEMCO's advanced manufacturing processes address challenges like warpage, ensuring high yields during chip mounting. The FCBGA factory's real-time data collection and modeling capabilities enable the development of predictive manufacturing models for signal, power, and mechanical integrity.
Samsung Electro-Mechanics (SEMCO) ha annunciato una collaborazione con AMD per fornire sottostrati ad alte prestazioni per il calcolo nei data center iperscalari. Questi sottostrati, prodotti nel centro tecnologico di SEMCO a Busan e nel nuovo stabilimento in Vietnam, sono progettati per migliorare le prestazioni e l'affidabilità dei data center di nuova generazione.
Il mercato dei sottostrati semiconduttori è previsto crescere a un tasso annuale del 7%, raggiungendo 20 trilioni di KRW entro il 2028. L'investimento di SEMCO di 1,9 trilioni di KRW nel suo stabilimento FCBGA dimostra il suo impegno nell'avanzare la tecnologia dei sottostrati. La collaborazione si concentra sull'integrazione di più chip semiconduttori (Chiplets) su grandi sottostrati, che sono dieci volte più grandi e hanno tre volte più strati rispetto ai sottostrati computer standard.
I processi di fabbricazione avanzati di SEMCO affrontano sfide come la deformazione, garantendo elevate rese durante il montaggio dei chip. Le capacità di raccolta dati e modellazione in tempo reale dello stabilimento FCBGA consentono lo sviluppo di modelli di produzione predittiva per l'integrità del segnale, dell'energia e meccanica.
Samsung Electro-Mechanics (SEMCO) ha anunciado una colaboración con AMD para suministrar sustratos de alto rendimiento para la computación en centros de datos hiperescalables. Estos sustratos, producidos en el centro tecnológico de SEMCO en Busan y en la nueva fábrica de Vietnam, están diseñados para mejorar el rendimiento y la confiabilidad de los centros de datos de próxima generación.
Se espera que el mercado de sustratos semiconductores crezca a una tasa anual del 7%, alcanzando los 20 billones de KRW para 2028. La inversión de SEMCO de 1,9 billones de KRW en su fábrica FCBGA demuestra su compromiso con el avance de la tecnología de sustratos. La colaboración se centra en integrar múltiples chips semiconductores (Chiplets) en grandes sustratos, que son diez veces más grandes y tienen tres veces más capas que los sustratos estándar de computadora.
Los procesos de fabricación avanzados de SEMCO abordan desafíos como la deformación, asegurando altos rendimientos durante el montaje de chips. Las capacidades de recopilación de datos en tiempo real y modelado de la fábrica FCBGA permiten el desarrollo de modelos de fabricación predictiva para la integridad de señal, potencia y mecánica.
삼성전기(SEMCO)는 AMD와 협력하여 고성능 기판을 공급한다고 발표했습니다. 이 기판은 SEMCO의 부산 기술 허브와 베트남의 새로운 공장에서 생산되며, 차세대 데이터 센터의 성능과 신뢰성을 향상시키도록 설계되었습니다.
반도체 기판 시장은 연평균 7% 성장할 것으로 예상되며, 2028년까지 20조 원에 이를 것으로 보입니다. SEMCO의 1.9조 원 규모의 FCBGA 공장 투자에는 기판 기술 발전에 대한 의지가 담겨 있습니다. 이번 협력에서는 표준 컴퓨터 기판보다 10배 크고 3배 더 많은 층을 가진 대형 기판에 여러 반도체 칩(Chiplets)을 통합하는 데 초점을 맞추고 있습니다.
SEMCO의 첨단 제조 공정은 왜곡과 같은 문제를 해결하며, 칩 장착 중 높은 수율을 보장합니다. FCBGA 공장의 실시간 데이터 수집 및 모델링 기능은 신호, 전력 및 기계적 무결성을 위한 예측 제조 모델 개발을 가능하게 합니다.
Samsung Electro-Mechanics (SEMCO) a annoncé une collaboration avec AMD pour fournir des sous-strats haute performance pour l'informatique dans les centres de données hyperscale. Ces sous-strats, produits dans le centre technologique de SEMCO à Busan et dans la nouvelle usine du Vietnam, sont conçus pour améliorer les performances et la fiabilité des centres de données de nouvelle génération.
Le marché des sous-strats semiconducteurs devrait croître à un taux annuel de 7 %, atteignant 20 trillions de KRW d'ici 2028. L'investissement de SEMCO de 1,9 trillion de KRW dans son usine FCBGA témoigne de son engagement à faire progresser la technologie des sous-strats. La collaboration se concentre sur l'intégration de plusieurs puces semiconductrices (Chiplets) sur de grands sous-strats, qui sont dix fois plus grands et ont trois fois plus de couches que les sous-strats informatiques standards.
Les processus de fabrication avancés de SEMCO s'attaquent à des défis tels que la déformation, garantissant des rendements élevés lors du montage des puces. Les capacités de collecte de données en temps réel et de modélisation de l'usine FCBGA permettent le développement de modèles de fabrication prédictifs pour l'intégrité des signaux, de l'énergie et des mécanismes.
Samsung Electro-Mechanics (SEMCO) hat eine Zusammenarbeit mit AMD angekündigt, um Hochleistungs-Substrate für hyperskalare Rechenzentren bereitzustellen. Diese Substrate, die im Technologiezentrum von SEMCO in Busan und in der neuen Fabrik in Vietnam hergestellt werden, sind darauf ausgelegt, die Leistung und Zuverlässigkeit der nächsten Generation von Rechenzentren zu verbessern.
Der Markt für Halbleitersubstrate wird voraussichtlich mit einer jährlichen Wachstumsrate von 7% wachsen und bis 2028 20 Billionen KRW erreichen. SEMCOs Investition von 1,9 Billionen KRW in seine FCBGA-Fabrik zeigt das Engagement des Unternehmens für die Weiterentwicklung der Substrattechnologie. Die Zusammenarbeit konzentriert sich auf die Integration mehrerer Halbleiterchips (Chiplets) auf großen Substraten, die zehnmal größer und dreimal so viele Schichten wie Standardcomputer-Substrate haben.
Die fortschrittlichen Fertigungsprozesse von SEMCO gehen Herausforderungen wie Verzug an und gewährleisten hohe Ausbeuten während der Chipmontage. Die Echtzeit-Datenerfassung und Modellierungsfähigkeit der FCBGA-Fabrik ermöglicht die Entwicklung prädiktiver Fertigungsmodelle für Signal-, Leistungs- und mechanische Integrität.
- Collaboration with AMD for high-performance substrates in data centers
- Projected 7% annual growth in semiconductor substrate market
- 1.9 trillion KRW investment in FCBGA factory
- Advanced manufacturing processes to ensure high yields
- Real-time data collection and modeling capabilities for predictive manufacturing
- None.
Insights
Samsung Electro-Mechanics’ (SEMCO) collaboration with AMD to provide high-performance substrates for hyperscale data centers is a significant development. The focus on large, multi-layer substrates is important for the future of data centers, which require advanced solutions for integrating multiple semiconductor chips, or chiplets. The announcement highlights SEMCO's advanced technological capabilities and substantial investment, positioning the company as a key player in the substrate market.
From a tech perspective, the innovative manufacturing processes described, which mitigate issues like warpage, are critical. Warpage can compromise the integrity of chip connections, reducing yields and reliability. SEMCO’s real-time data collection and predictive manufacturing models will likely enhance production efficiency and product quality. This technological edge could give SEMCO a competitive advantage in a growing market, as reflected by Prismark’s market growth predictions.
The strategic partnership between SEMCO and AMD is poised to capitalize on the growth trajectory of the semiconductor substrate market, projected to grow at an average annual rate of 7% according to Prismark. SEMCO’s investment of 1.9 trillion KRW in their FCBGA factory signifies a strong commitment to capturing a significant share of this expanding market. This growth is driven by increased demand for high-performance computing in hyperscale data centers, which require advanced substrate solutions to handle higher data loads and ensure efficient power delivery and signal integrity.
Investors should note the potential for SEMCO to increase its market share and revenue streams through this collaboration. The partnership not only strengthens SEMCO's product portfolio but also broadens its customer base, leveraging AMD's market presence. The successful execution of this project could drive significant financial gains and enhance SEMCO's market positioning over the long term.
The collaboration between SEMCO and AMD represents a strategic move that could have significant financial implications. The investment of 1.9 trillion KRW in the FCBGA factory indicates SEMCO’s robust financial health and strategic foresight. Such a substantial investment aims to align with the anticipated growth in the semiconductor substrate market, increasing from 15.2 trillion KRW in 2024 to 20 trillion KRW by 2028. This growth is driven by the rising demand for advanced data center solutions.
From a financial standpoint, this partnership is likely to enhance SEMCO’s revenue and profitability, given the high-margin nature of high-performance substrates. The integration with AMD, a leading player in the CPU/GPU market, ensures a steady demand for SEMCO’s products. Additionally, the advanced manufacturing capabilities of SEMCO’s new factory, including real-time data collection and predictive modeling, could lead to cost efficiencies and higher production yields, further bolstering financial performance.
Joint effort enhances the performance and reliability of next-generation data centers with cutting-edge substrate technology
Market research firm Prismark predicts that the semiconductor substrate market will grow at an average annual rate of about
SEMCO's collaboration with AMD focuses on meeting the unique challenges of integrating multiple semiconductor chips (Chiplets) on a single large substrate. These high-performance substrates, essential for CPU/GPU applications, offer significantly larger surface areas and higher layer counts, providing the dense interconnections required for today's advanced data centers. Compared to standard computer substrates, data center substrates are ten times larger and feature three times more layers, ensuring efficient power delivery and lossless signal integrity between chips. Addressing these challenges, SEMCO's innovative manufacturing processes mitigate issues like warpage to ensure high yields during chip mounting.
SEMCO's FCBGA factory is equipped with advanced real-time data collection and modeling capabilities, enabling SEMCO to develop predictive manufacturing models that ensure signal, power, and mechanical integrity. This state-of-the-art facility positions SEMCO as a leader in the production of embedded substrates with both passive (capacitor and inductor) and active (integrated circuit) components, meeting the forward-looking needs of next-generation data centers.
"We are honored to be a strategic partner with AMD, a global leader in high-performance computing and AI semiconductor solutions," said Kim Wontaek, Executive Vice President of the Strategic Marketing Center at Samsung Electro-Mechanics. "Our continued investment in advanced substrate solutions will provide key value to customers like AMD, addressing the evolving demands of data centers and other compute-intensive applications ranging from AI to automotive systems." "At AMD, we are always pushing the edge of innovation to meet the performance and efficiency needs of our customers," says Scott Aylor, Corporate VP of Global Operation Manufacturing Strategy at AMD. "Our leadership in chiplet technologies has enabled AMD to deliver leadership performance, efficiency, and flexibility across our CPU and data center GPU portfolio. Continued investments with partners such as SEMCO highlight the work we are doing to ensure we have the advanced substrate technologies and capacity we need to deliver future generations of high-performance computing and AI products."
About Samsung Electro-Mechanics
For over 50 years, Samsung Electro-Mechanics (SEMCO) has been a leading developer and manufacturer of a wide range of mechanical and high-tech electronic components. Founded in 1973, SEMCO has grown into a world-class company, supplying essential electronic parts to industries worldwide. Our product portfolio includes chip parts, communication modules and substrates, and optical components, addressing the challenges of next-generation designs. Our employees are dedicated to innovating and producing high-quality components that enhance modern technology and everyday life. Learn more at Samsung Electro-Mechanics.
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SOURCE Samsung Electro-Mechanics
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