AMD Achieves First TSMC N2 Product Silicon Milestone
AMD (NASDAQ: AMD) has achieved a significant milestone as its next-generation AMD EPYC processor, codenamed 'Venice,' becomes the first HPC product to be taped out and brought up on TSMC's advanced 2nm (N2) process technology. This achievement demonstrates the strong partnership between AMD and TSMC in semiconductor manufacturing, combining new design architectures with cutting-edge process technology.
The company has also successfully completed the bring up and validation of its 5th Gen AMD EPYC CPU products at TSMC's new fabrication facility in Arizona, reinforcing AMD's commitment to U.S. manufacturing. The 'Venice' processor is scheduled to launch next year, marking a significant advancement in AMD's data center CPU roadmap.
AMD (NASDAQ: AMD) ha raggiunto un traguardo importante con il suo processore di nuova generazione AMD EPYC, nome in codice 'Venice', che diventa il primo prodotto HPC a essere progettato e realizzato con la tecnologia di processo avanzata a 2nm (N2) di TSMC. Questo risultato dimostra la solida collaborazione tra AMD e TSMC nella produzione di semiconduttori, unendo nuove architetture di design a tecnologie di processo all'avanguardia.
L'azienda ha inoltre completato con successo l'avvio e la validazione dei suoi prodotti 5ª generazione di CPU AMD EPYC presso il nuovo stabilimento di TSMC in Arizona, rafforzando l'impegno di AMD nella produzione negli Stati Uniti. Il processore 'Venice' è previsto per il lancio il prossimo anno, segnando un importante avanzamento nella roadmap delle CPU per data center di AMD.
AMD (NASDAQ: AMD) ha alcanzado un hito significativo con su procesador de próxima generación AMD EPYC, con nombre en clave 'Venice', que se convierte en el primer producto HPC diseñado y fabricado con la tecnología de proceso avanzada de 2nm (N2) de TSMC. Este logro demuestra la sólida colaboración entre AMD y TSMC en la fabricación de semiconductores, combinando nuevas arquitecturas de diseño con tecnología de proceso de vanguardia.
La compañía también ha completado con éxito la puesta en marcha y validación de sus productos CPU AMD EPYC de 5ª generación en la nueva planta de fabricación de TSMC en Arizona, reforzando el compromiso de AMD con la producción en Estados Unidos. El procesador 'Venice' está programado para lanzarse el próximo año, marcando un avance importante en la hoja de ruta de CPUs para centros de datos de AMD.
AMD (NASDAQ: AMD)는 차세대 AMD EPYC 프로세서 코드명 'Venice'가 TSMC의 첨단 2nm(N2) 공정 기술로 설계 및 생산된 최초의 HPC 제품이 되는 중요한 이정표를 달성했습니다. 이 성과는 AMD와 TSMC 간의 반도체 제조 분야에서 강력한 파트너십을 보여주며, 새로운 설계 아키텍처와 최첨단 공정 기술을 결합한 결과입니다.
또한, AMD는 TSMC의 애리조나 신규 제조 시설에서 5세대 AMD EPYC CPU 제품의 초기 가동 및 검증을 성공적으로 완료하여 미국 내 제조에 대한 AMD의 의지를 강화했습니다. 'Venice' 프로세서는 내년에 출시될 예정이며, AMD의 데이터 센터 CPU 로드맵에 중요한 진전을 의미합니다.
AMD (NASDAQ : AMD) a franchi une étape importante avec son processeur de nouvelle génération AMD EPYC, nommé 'Venice', qui devient le premier produit HPC conçu et fabriqué avec la technologie de procédé avancée 2nm (N2) de TSMC. Cette réussite illustre le partenariat solide entre AMD et TSMC dans la fabrication de semi-conducteurs, alliant de nouvelles architectures de conception à une technologie de procédé de pointe.
L'entreprise a également mené à bien la mise en service et la validation de ses produits CPU AMD EPYC de 5e génération dans la nouvelle usine de fabrication de TSMC en Arizona, renforçant ainsi l'engagement d'AMD envers la production aux États-Unis. Le processeur 'Venice' est prévu pour un lancement l'année prochaine, marquant une avancée majeure dans la feuille de route des CPU pour centres de données d'AMD.
AMD (NASDAQ: AMD) hat einen bedeutenden Meilenstein erreicht, indem sein nächstgenerations AMD EPYC Prozessor mit dem Codenamen 'Venice' als erstes HPC-Produkt mit TSMCs fortschrittlicher 2nm (N2) Prozess-Technologie entworfen und gefertigt wurde. Dieser Erfolg zeigt die starke Partnerschaft zwischen AMD und TSMC in der Halbleiterfertigung, die neue Designarchitekturen mit modernster Prozesstechnologie verbindet.
Das Unternehmen hat außerdem die Inbetriebnahme und Validierung seiner 5. Generation AMD EPYC CPUs in der neuen Fertigungsanlage von TSMC in Arizona erfolgreich abgeschlossen und damit AMDs Engagement für die Fertigung in den USA unterstrichen. Der 'Venice' Prozessor soll im nächsten Jahr auf den Markt kommen und markiert einen bedeutenden Fortschritt in AMDs Roadmap für Rechenzentrums-CPUs.
- First-mover advantage in HPC with TSMC's 2nm process technology
- On-track product development for next-gen Venice EPYC processor launch
- Successful validation of 5th Gen EPYC production in US-based TSMC facility
- None.
Insights
AMD's achievement as the first HPC product taped out on TSMC's 2nm node represents a significant technological milestone in the semiconductor industry. Being an early adopter of advanced nodes provides AMD with several competitive advantages. The N2 process will likely deliver substantial improvements in transistor density, power efficiency, and performance compared to current-generation chips.
The successful bring-up (initial silicon validation) indicates the design is functional, a critical risk-reduction milestone in semiconductor development. This achievement demonstrates AMD's growing technical execution capabilities and the strength of its co-optimization strategy with TSMC. By working closely with TSMC during the design phase, AMD can better exploit the node's specific characteristics.
With Venice scheduled for launch in 2026, AMD is positioning itself to maintain competitive pressure in the data center space. The additional news about 5th Gen EPYC production at TSMC's Arizona facility highlights AMD's supply chain diversification strategy, reducing geopolitical risks while supporting U.S. semiconductor manufacturing goals.
This announcement reinforces AMD's commitment to maintaining a consistent cadence of architectural and node advancements for its server products, where margins are highest. By establishing leadership on TSMC's most advanced node, AMD continues its strategy of leveraging TSMC's manufacturing excellence while focusing on its own architectural innovations.
This milestone signals AMD's continued momentum in the data center CPU market, where technology leadership translates directly to competitive advantage. Being first to utilize TSMC's 2nm process for HPC chips positions the "Venice" EPYC processors to potentially deliver significant performance and efficiency gains when they launch next year.
The data center market highly values performance-per-watt improvements, as energy costs represent a major operational expense. Advanced nodes like N2 typically deliver substantial efficiency gains, potentially lowering the total cost of ownership for AMD-based infrastructure. This could strengthen AMD's value proposition against competitors.
The announcement also demonstrates execution consistency on AMD's roadmap, something data center customers prioritize when making long-term infrastructure decisions. By providing visibility into next-generation products, AMD helps customers plan their technology adoption cycles with greater confidence.
The domestic production of 5th Gen EPYC processors addresses growing concerns about supply chain security and resilience among enterprise and government customers. This could potentially open additional market opportunities, particularly with security-sensitive clients who value U.S.-based manufacturing.
While the financial impact won't materialize until Venice launches next year, this technical milestone reduces execution risk and reinforces AMD's position as a credible long-term technology provider in the highly competitive data center market.
— Next-generation AMD EPYC CPU, codenamed “Venice,” is the first HPC product to be brought up on TSMC’s next-generation N2 node —
SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) today announced its next-generation AMD EPYC™ processor, codenamed “Venice,” is the first HPC product in the industry to be taped out and brought up on the TSMC advanced 2nm (N2) process technology. This highlights the strength of AMD and TSMC semiconductor manufacturing partnership to co-optimize new design architectures with leading-edge process technology. It also marks a major step forward in the execution of the AMD data center CPU roadmap, with “Venice” on track to launch next year. AMD also announced the successful bring up and validation of its 5th Gen AMD EPYC™ CPU products at TSMC’s new fabrication facility in Arizona, underscoring its commitment to U.S. manufacturing.
“TSMC has been a key partner for many years and our deep collaboration with their R&D and manufacturing teams has enabled AMD to consistently deliver leadership products that push the limits of high-performance computing,” said Dr. Lisa Su, chair and CEO, AMD. “Being a lead HPC customer for TSMC’s N2 process and for TSMC Arizona Fab 21 are great examples of how we are working closely together to drive innovation and deliver the advanced technologies that will power the future of computing.”
“We are proud to have AMD be a lead HPC customer for our advanced 2nm (N2) process technology and TSMC Arizona fab,” said TSMC Chairman and CEO Dr. C.C. Wei. “By working together, we are driving significant technology scaling resulting in better performance, power efficiency and yields for high-performance silicon. We look forward to continuing to work closely with AMD to enable the next era of computing.”
Supporting Resources
- Learn more about AMD EPYC Processors
About AMD
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Cautionary Statement
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as AMD’s partnership with TSMC; next-generation AMD EPYC™ processors to be taped out and brought up on the TSMC advanced 2nm process technology and being on track to launch next year; AMD’s data center CPU roadmap; and 5th Gen AMD EPYC™ CPU products being planned for shipment later this year, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; Nvidia’s dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD’s products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD’s ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD’s business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or strategic investments on AMD’s business and AMD’s ability to integrate acquired businesses, such as ZT Systems; impact of any impairment of the combined company’s assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.
AMD, the AMD Arrow logo, EPYC and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/ad5a4173-91fc-43cf-9833-8feeea9330e1
Contact: Aaron Grabein AMD Communications (737) 256-9518 aaron.grabein@amd.com Liz Stine AMD Investor Relations +1 720-652-3965 liz.stine@amd.com
FAQ
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