ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems

Rhea-AI Summary

ACM Research, Inc. (NASDAQ: ACMR) announced a significant contract with a leading Chinese OSAT for 10 Ultra ECP ap high-speed plating tools, set for delivery in 2022 and 2023. This order follows previous commitments for 21 ECP tools from a top-tier Chinese foundry, highlighting growing market traction for ACM's ECP technologies. The high-speed plating technology is already qualified by multiple customers, supporting advanced wafer-level packaging applications critical for sectors like 5G and autonomous vehicles.

Positive

• Received contract for 10 Ultra ECP ap plating tools from a leading Chinese OSAT.
• Builds on previous orders for 21 ECP tools, indicating strong market demand.
• Proven high-speed plating technology enhances customer confidence.

Negative

• None.

10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications

FREMONT, Calif., May 06, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that a volume purchase contract has been received from a leading Chinese OSAT for 10 Ultra ECP ap high-speed plating tools, which are scheduled to be delivered later in 2022 and 2023. The Ultra ECP ap system with new high-speed plating technology has been previously qualified by multiple OSAT customers for advanced WLP applications. The new purchase orders, which build on orders announced in February 2022 for 21 ECP tools from a top-tier Chinese foundry and multiple advanced packaging houses, demonstrate the increased market traction for ACM’s ECP technologies for both advanced packaging and front-end customers.

“A wide range of applications, such as 5G cellular phones and autonomous vehicles, are increasingly demanding high-performance microprocessors to meet emerging demands for novel WLP structures,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “This is driving strong demand for our ECP ap high-speed plating systems, with proven performance that has resulted in multiple orders this calendar year. This new contract for 10 tools from a leading Chinese OSAT demonstrates customer confidence and satisfaction in our high-speed plating technology and further increases our share in this rapidly growing advanced packaging market.”

ACM’s Ultra ECP ap plating tool supports copper (Cu) pillar bumping for Cu, nickel (Ni) and tin-silver (SnAg) plating, as well as high-density fan-out (HDFO) WLP product with warpage wafers for Cu, Ni, SnAg and gold plating. Its high-speed plating technology with proprietary paddle design provides stronger mass transfer during the plating process, coating all pillars on the entire wafer concurrently at the same plating rate. This provides improved uniformity below 3% within wafer and within die during high-speed plating. It also offers better coplanarity performance and higher throughput. The single-wafer, flat-type plating design eliminates cross-contamination between chemical baths in vertical-type plating design.

About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and vertical furnace processes, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. The company is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmrcsh.com.

© ACM Research, Inc. The ACM Research logo is a trademark of ACM Research, Inc. For convenience, this trademark appears in this press release without a ™ symbol, but that practice does not mean that ACM will not assert, to the fullest extent under applicable law, its rights to such trademark.

Media Contact:	Company Contacts:
Jillian Carapella	USA
Kiterocket	Robert Metter
+1 646.402.2408	+1 503.367.9753
jcarapella@kiterocket.com
	China
	Xi Wang
	ACM Research (Shanghai), Inc.
	+86 21 50808868
	Korea
	YY Kim
	ACM Research (Korea), Inc.
	+821041415171
	Taiwan
	David Chang
	+886 921999884
	Singapore
	Adrian Ong
	+65 8813-1107

FAQ

What is the significance of the recent contract ACMR announced?

ACMR secured a contract for 10 Ultra ECP ap high-speed plating tools from a leading Chinese OSAT, demonstrating strong demand in the advanced packaging market.

How does ACMR's Ultra ECP ap technology benefit semiconductor manufacturing?

The Ultra ECP ap technology improves plating uniformity, coplanarity, and throughput, crucial for high-performance microprocessors used in applications like 5G.

When will the new plating tools be delivered?

The new plating tools are scheduled for delivery later in 2022 and into 2023.

What market trends are affecting ACMR's business?

Rising demand for advanced wafer-level packaging in sectors such as 5G and autonomous vehicles is boosting ACMR's market opportunities.

How many ECP tools has ACMR ordered in total this year?

ACMR has received orders totaling 31 ECP tools, including the latest 10 from the Chinese OSAT and 21 from a Chinese foundry.