/C O R R E C T I O N -- Axcelis Technologies, Inc./
Axcelis Technologies (NASDAQ: ACLS) has issued a correction to their previous press release regarding their participation in the Advanced Semiconductor Manufacturing Conference (ASMC). The correction pertains to two coauthor names: Charlie Free (previously listed as David Free) and DaeYoon Kim (previously listed as Dae Yun Kim).
The company will sponsor ASMC, scheduled for May 5-8, 2025, at the Hilton Albany, New York. During Session 5: Contamination Free Manufacturing on May 6, Dr. Phillip Geissbuhler will present research on 'Particle Control for Low-Energy Boron Implantation' at 3:40 PM.
The presentation details a case study on reducing particle contamination during low-energy boron implants through new hardware implementation. The innovation increases ion beam angle to enhance self-sputtering of films, significantly reducing film buildup on surfaces near implanted wafers, thereby improving device yields.
Axcelis Technologies (NASDAQ: ACLS) ha pubblicato una rettifica al comunicato stampa precedente riguardante la loro partecipazione alla Advanced Semiconductor Manufacturing Conference (ASMC). La correzione riguarda i nomi di due coautori: Charlie Free (precedentemente indicato come David Free) e DaeYoon Kim (precedentemente indicato come Dae Yun Kim).
L'azienda sarà sponsor dell'ASMC, in programma dal 5 all'8 maggio 2025 presso l'Hilton Albany, New York. Durante la Sessione 5: Contamination Free Manufacturing il 6 maggio, il Dr. Phillip Geissbuhler presenterà la ricerca su 'Particle Control for Low-Energy Boron Implantation' alle 15:40.
La presentazione descrive uno studio di caso sulla riduzione della contaminazione da particelle durante l'impianto di boro a bassa energia tramite l'implementazione di nuove apparecchiature. L'innovazione aumenta l'angolo del fascio ionico per migliorare l'auto-sputtering dei film, riducendo significativamente l'accumulo di film sulle superfici vicine ai wafer impiantati, migliorando così la resa dei dispositivi.
Axcelis Technologies (NASDAQ: ACLS) ha emitido una corrección a su comunicado de prensa anterior sobre su participación en la Advanced Semiconductor Manufacturing Conference (ASMC). La corrección se refiere a los nombres de dos coautores: Charlie Free (anteriormente listado como David Free) y DaeYoon Kim (anteriormente listado como Dae Yun Kim).
La empresa será patrocinadora de ASMC, programada del 5 al 8 de mayo de 2025, en el Hilton Albany, Nueva York. Durante la Sesión 5: Contamination Free Manufacturing el 6 de mayo, el Dr. Phillip Geissbuhler presentará la investigación sobre 'Particle Control for Low-Energy Boron Implantation' a las 3:40 PM.
La presentación detalla un estudio de caso sobre la reducción de la contaminación por partículas durante la implantación de boro a baja energía mediante la implementación de nuevo hardware. La innovación aumenta el ángulo del haz de iones para mejorar el auto-sputtering de las películas, reduciendo significativamente la acumulación de película en las superficies cercanas a los obleas implantadas, mejorando así el rendimiento de los dispositivos.
Axcelis Technologies (NASDAQ: ACLS)는 Advanced Semiconductor Manufacturing Conference (ASMC) 참여와 관련된 이전 보도자료에 대해 정정 공지를 발표했습니다. 정정 내용은 공동 저자 두 명의 이름으로, Charlie Free(이전에는 David Free로 기재)와 DaeYoon Kim(이전에는 Dae Yun Kim로 기재)입니다.
회사는 2025년 5월 5일부터 8일까지 뉴욕 힐튼 올버니에서 열리는 ASMC를 후원할 예정입니다. 5월 6일 진행되는 세션 5: Contamination Free Manufacturing에서 Phillip Geissbuhler 박사가 오후 3시 40분에 'Particle Control for Low-Energy Boron Implantation' 연구를 발표합니다.
발표 내용은 새로운 하드웨어 도입을 통해 저에너지 붕소 이식 시 입자 오염을 줄인 사례 연구입니다. 이 혁신은 이온 빔 각도를 높여 필름의 자기 스퍼터링을 향상시키며, 이로 인해 이식된 웨이퍼 주변 표면에 필름 축적이 크게 감소하여 장치 수율이 개선됩니다.
Axcelis Technologies (NASDAQ : ACLS) a publié une correction à leur communiqué de presse précédent concernant leur participation à la Advanced Semiconductor Manufacturing Conference (ASMC). La correction concerne les noms de deux coauteurs : Charlie Free (précédemment mentionné comme David Free) et DaeYoon Kim (précédemment mentionné comme Dae Yun Kim).
L'entreprise sera sponsor de l'ASMC, prévue du 5 au 8 mai 2025, à l'Hilton Albany, New York. Lors de la Session 5 : Contamination Free Manufacturing, le 6 mai, le Dr Phillip Geissbuhler présentera ses recherches sur le thème « Particle Control for Low-Energy Boron Implantation » à 15h40.
La présentation détaille une étude de cas sur la réduction de la contamination particulaire lors d'implants de bore à basse énergie grâce à la mise en place de nouveaux équipements. Cette innovation augmente l'angle du faisceau ionique pour améliorer l'auto-sputtering des films, réduisant ainsi considérablement l'accumulation de films sur les surfaces proches des plaquettes implantées, améliorant ainsi le rendement des dispositifs.
Axcelis Technologies (NASDAQ: ACLS) hat eine Korrektur zu ihrer vorherigen Pressemitteilung bezüglich ihrer Teilnahme an der Advanced Semiconductor Manufacturing Conference (ASMC) veröffentlicht. Die Korrektur betrifft zwei Co-Autoren: Charlie Free (zuvor als David Free aufgeführt) und DaeYoon Kim (zuvor als Dae Yun Kim aufgeführt).
Das Unternehmen wird Sponsor der ASMC sein, die vom 5. bis 8. Mai 2025 im Hilton Albany, New York, stattfindet. Während der Session 5: Contamination Free Manufacturing am 6. Mai wird Dr. Phillip Geissbuhler um 15:40 Uhr seine Forschung zum Thema 'Particle Control for Low-Energy Boron Implantation' vorstellen.
Die Präsentation beschreibt eine Fallstudie zur Reduzierung von Partikelkontaminationen während der Niedrigenergie-Boronimplantation durch den Einsatz neuer Hardware. Die Innovation erhöht den Ionenstrahlwinkel, um das Selbst-Sputtern von Filmen zu verbessern, was die Filmbildung auf Oberflächen in der Nähe der implantierten Wafer deutlich verringert und somit die Ausbeute der Bauteile verbessert.
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In the news release, Axcelis Announces Participation in Advanced Semiconductor Manufacturing Conference (ASMC), issued 24-Apr-2025 by Axcelis Technologies, Inc. over PR Newswire, we are advised by the company that 2 coauthor names were incorrectly referenced beneath the section titled "Axcelis will present in Session 5: Contamination Free Manufacturing". "David Free" should be listed as "Charlie Free" and "Dae Yun Kim" should read as "DaeYoon Kim". The complete, corrected release follows:
Axcelis Announces Participation in Advanced Semiconductor Manufacturing Conference (ASMC)
Axcelis will present in Session 5: Contamination Free Manufacturing:
May 6, 2025, 3:40 p.m. - 4:00 p.m.
Particle Control for Low-Energy Boron Implantation
Presented by Dr. Phillip Geissbuhler, Staff Scientist, Axcelis Technologies
Coauthors: David Burtner, Charlie Free, Kevin Wenzel, Luke Kim, DaeYoon Kim, BuMin Son (Axcelis Technologies), HunKyu Cha, SangHyun Na (SK Hynix)
Abstract: We present a case study describing how particles added to wafers during dedicated low-energy boron (LEB) implants can be reduced by the implementation of new hardware to reduce the buildup of boron films on beamline components. The new hardware increases the ion beam angle of incidence on beamline component surfaces to enhance self-sputtering of films and significantly reduces the film growth rate on surfaces near the wafer being implanted. This is important because film growth can lead to delamination which is a particle source. Particle adders can reduce device yields.
President and CEO Russell Low, said, "We're pleased to be a part of ASMC 2025 and especially excited about presenting our work on contamination control, which is the result of a technical collaboration with a leading device maker. Axcelis has deep technical expertise in this area, and we look forward to sharing our findings and recommendations to chipmakers that ensure pristine processes to deliver optimized device performance and yield."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
CONTACTS:
Press/Media Relations Contact:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
Axcelis Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
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SOURCE Axcelis Technologies, Inc.
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