Axcelis Announces Participation in Advanced Semiconductor Manufacturing Conference (ASMC)
Axcelis Technologies (NASDAQ: ACLS) announced its sponsorship and participation in the Advanced Semiconductor Manufacturing Conference (ASMC) scheduled for May 5-8, 2025, in Albany, New York. The company will present research on particle control for low-energy boron implantation in Session 5: Contamination Free Manufacturing.
Dr. Phillip Geissbuhler, Staff Scientist at Axcelis, will present findings from a collaborative study with SK Hynix on May 6, 2025. The presentation focuses on new hardware implementation that reduces particle contamination during low-energy boron implants by increasing ion beam angles to enhance self-sputtering of films. This innovation significantly reduces film buildup on surfaces near implanted wafers, addressing a critical yield-impacting issue in semiconductor manufacturing.
Axcelis Technologies (NASDAQ: ACLS) ha annunciato la sua sponsorizzazione e partecipazione alla Advanced Semiconductor Manufacturing Conference (ASMC), che si terrà dal 5 all'8 maggio 2025 ad Albany, New York. L'azienda presenterà una ricerca sul controllo delle particelle durante l'impianto di boro a bassa energia nella Sessione 5: Produzione Senza Contaminazioni.
Il dott. Phillip Geissbuhler, scienziato presso Axcelis, presenterà i risultati di uno studio collaborativo con SK Hynix il 6 maggio 2025. La presentazione si concentrerà su una nuova implementazione hardware che riduce la contaminazione da particelle durante gli impianti di boro a bassa energia, aumentando gli angoli del fascio ionico per migliorare l'auto-sputtering dei film. Questa innovazione riduce significativamente l'accumulo di film sulle superfici vicine ai wafer impiantati, affrontando un problema critico che influisce sulla resa nella produzione di semiconduttori.
Axcelis Technologies (NASDAQ: ACLS) anunció su patrocinio y participación en la Advanced Semiconductor Manufacturing Conference (ASMC), programada del 5 al 8 de mayo de 2025 en Albany, Nueva York. La compañía presentará una investigación sobre el control de partículas en la implantación de boro de baja energía en la Sesión 5: Fabricación Libre de Contaminación.
El Dr. Phillip Geissbuhler, científico del personal de Axcelis, presentará los hallazgos de un estudio colaborativo con SK Hynix el 6 de mayo de 2025. La presentación se centrará en una nueva implementación de hardware que reduce la contaminación por partículas durante las implantaciones de boro de baja energía, aumentando los ángulos del haz de iones para mejorar el auto-sputtering de las películas. Esta innovación reduce significativamente la acumulación de películas en las superficies cercanas a los obleas implantadas, abordando un problema crítico que afecta el rendimiento en la fabricación de semiconductores.
Axcelis Technologies (NASDAQ: ACLS)는 2025년 5월 5일부터 8일까지 뉴욕주 올버니에서 개최되는 첨단 반도체 제조 컨퍼런스(ASMC)에 후원 및 참여한다고 발표했습니다. 회사는 세션 5: 오염 없는 제조(Contamination Free Manufacturing)에서 저에너지 붕소 이식 시 입자 제어에 관한 연구를 발표할 예정입니다.
Axcelis의 연구원 필립 가이스뷜러 박사는 2025년 5월 6일 SK 하이닉스와의 공동 연구 결과를 발표합니다. 발표 내용은 이온 빔 각도를 높여 필름의 자기 스퍼터링(self-sputtering)을 향상시켜 저에너지 붕소 이식 시 입자 오염을 줄이는 새로운 하드웨어 구현에 관한 것입니다. 이 혁신은 이식된 웨이퍼 주변 표면에 필름 축적을 크게 줄여 반도체 제조에서 수율에 큰 영향을 미치는 문제를 해결합니다.
Axcelis Technologies (NASDAQ : ACLS) a annoncé son parrainage et sa participation à la Advanced Semiconductor Manufacturing Conference (ASMC), prévue du 5 au 8 mai 2025 à Albany, New York. L'entreprise présentera une recherche sur le contrôle des particules lors de l'implantation de bore à basse énergie lors de la Session 5 : Fabrication sans contamination.
Le Dr Phillip Geissbuhler, scientifique chez Axcelis, présentera les résultats d'une étude collaborative avec SK Hynix le 6 mai 2025. La présentation portera sur une nouvelle mise en œuvre matérielle qui réduit la contamination particulaire lors des implants de bore à basse énergie en augmentant les angles du faisceau ionique pour améliorer l'auto-sputtering des films. Cette innovation réduit significativement l'accumulation de films sur les surfaces proches des plaquettes implantées, traitant un problème critique impactant le rendement dans la fabrication des semi-conducteurs.
Axcelis Technologies (NASDAQ: ACLS) gab seine Sponsoring-Teilnahme an der Advanced Semiconductor Manufacturing Conference (ASMC) bekannt, die vom 5. bis 8. Mai 2025 in Albany, New York, stattfindet. Das Unternehmen wird Forschung zur Partikelkontrolle bei der Niedrigenergie-Borimplantation in Sitzung 5: Kontaminationsfreie Fertigung vorstellen.
Dr. Phillip Geissbuhler, Wissenschaftler bei Axcelis, wird am 6. Mai 2025 Ergebnisse einer gemeinsamen Studie mit SK Hynix präsentieren. Die Präsentation konzentriert sich auf eine neue Hardware-Implementierung, die die Partikelkontamination bei Niedrigenergie-Borimplantationen reduziert, indem die Ionenstrahlwinkel erhöht werden, um das Selbst-Sputtern von Schichten zu verbessern. Diese Innovation verringert die Filmbildung auf Oberflächen in der Nähe der implantierten Wafer erheblich und adressiert ein kritisches, die Ausbeute beeinflussendes Problem in der Halbleiterfertigung.
- Technical collaboration with major chip manufacturer SK Hynix demonstrates strong industry partnerships
- Innovation in particle control technology addresses critical yield-improvement needs in semiconductor manufacturing
- None.
Axcelis will present in Session 5: Contamination Free Manufacturing:
May 6, 2025, 3:40 p.m. - 4:00 p.m.
Particle Control for Low-Energy Boron Implantation
Presented by Dr. Phillip Geissbuhler, Staff Scientist, Axcelis Technologies
Coauthors: David Burtner, David Free, Kevin Wenzel, Luke Kim, Dae Yun Kim, BuMin Son (Axcelis Technologies), HunKyu Cha, SangHyun Na (SK Hynix)
Abstract: We present a case study describing how particles added to wafers during dedicated low-energy boron (LEB) implants can be reduced by the implementation of new hardware to reduce the buildup of boron films on beamline components. The new hardware increases the ion beam angle of incidence on beamline component surfaces to enhance self-sputtering of films and significantly reduces the film growth rate on surfaces near the wafer being implanted. This is important because film growth can lead to delamination which is a particle source. Particle adders can reduce device yields.
President and CEO Russell Low, said, "We're pleased to be a part of ASMC 2025 and especially excited about presenting our work on contamination control, which is the result of a technical collaboration with a leading device maker. Axcelis has deep technical expertise in this area, and we look forward to sharing our findings and recommendations to chipmakers that ensure pristine processes to deliver optimized device performance and yield."
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in
CONTACTS:
Press/Media Relations Contact:
Maureen Hart
Senior Director, Corporate & Marketing Communications
Telephone: (978) 787-4266
Email: Maureen.Hart@axcelis.com
Axcelis Investor Relations Contact:
David Ryzhik
Senior Vice President, Investor Relations and Corporate Strategy
Telephone: (978) 787-2352
Email: David.Ryzhik@axcelis.com
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SOURCE Axcelis Technologies, Inc.
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