Axcelis Ships First Purion H200™ High Current Implanter And Follow On Purion M SiC™ Medium Current Implanter To Leading Power Device Manufacturers
Axcelis Technologies (Nasdaq: ACLS) announced the shipment of its first Purion H200 high current implanter evaluation system and a follow-on order for the Purion M SiC medium current implanter to leading power device manufacturers. The Purion H200 is designed for Si power device production, while the Purion M SiC system supports fab capacity expansion. Both systems were shipped in Q3 2020. CEO Mary Puma emphasized the importance of expanding their customer footprint in the power device market to achieve the company's long-term $650M business model.
- First shipment of the Purion H200 high current implanter, enhancing product offerings.
- Follow-on order for the Purion M SiC medium current implanter indicates strong market demand.
- Expansion into the power device market aligns with growth strategy.
- None.
BEVERLY, Mass., Sept. 30, 2020 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today the first shipment of a Purion H200 high current implanter evaluation system, as well as another follow on order for a Purion M SiC medium current implanter to leading power device manufacturers. The Purion H200 system is targeted for use in a production ramp for Si power devices and the Purion M SiC system is being utilized for a fab capacity expansion. Both systems shipped in the third quarter.
Executive Vice President of Product Development, Bill Bintz, commented, "The Purion H200 is the first and only single wafer high current implanter designed to cover all high dose implant applications from energies as low as 5keV to a maximum of 200keV, and is especially suited to foundry and power device manufacturers' needs. Built upon the industry-proven Purion H high current beamline with its unique scanned spot beam architecture, the Purion H200 delivers the productivity of high current tools with the precision and accuracy of medium current implanters. The superior precision, productivity and process capabilities (widest dose and energy range) position the Purion H200 as the most versatile single wafer high current ion implanter in the fab, enabling device manufacturers to develop novel material modification applications previously considered impractical with implant."
Mary Puma, president and CEO of Axcelis Technologies, said, "We are very pleased to be able to offer new and innovative implant solutions to leading device makers serving this very important market segment. Expanding our customer footprint in the power device market is a key objective of our growth strategy and will help us achieve our long term
About Axcelis:
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 40 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.
CONTACTS:
Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552
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SOURCE Axcelis Technologies, Inc.
FAQ
What is the significance of Axcelis' shipment of the Purion H200 implanter?
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