Apple reveals M3 Ultra, taking Apple silicon to a new extreme
Apple has unveiled its most powerful chip ever, the M3 Ultra, featuring groundbreaking performance improvements and innovative technologies. The chip combines two M3 Max dies using UltraFusion technology, integrating 184 billion transistors.
Key specifications include a 32-core CPU (24 performance cores and 8 efficiency cores), delivering up to 1.5x performance of M2 Ultra and 1.8x of M1 Ultra. The 80-core GPU offers up to 2x faster performance than M2 Ultra and 2.6x faster than M1 Ultra.
Notable features include support for up to 512GB unified memory, Thunderbolt 5 connectivity with 120 Gb/s data transfer speeds, and enhanced AI capabilities supporting large language models with over 600 billion parameters. The chip includes dedicated media engines capable of playing back up to 22 streams of 8K ProRes 422 video.
Apple ha presentato il suo chip più potente di sempre, l'M3 Ultra, con miglioramenti delle prestazioni rivoluzionari e tecnologie innovative. Il chip combina due die M3 Max utilizzando la tecnologia UltraFusion, integrando 184 miliardi di transistor.
Le specifiche principali includono una CPU a 32 core (24 core ad alte prestazioni e 8 core di efficienza), che offre fino a 1,5 volte le prestazioni dell'M2 Ultra e 1,8 volte quelle dell'M1 Ultra. La GPU a 80 core offre prestazioni fino a 2 volte più veloci rispetto all'M2 Ultra e 2,6 volte più veloci rispetto all'M1 Ultra.
Le caratteristiche principali includono il supporto per un massimo di 512GB di memoria unificata, connettività Thunderbolt 5 con velocità di trasferimento dati di 120 Gb/s e capacità AI avanzate che supportano modelli linguistici di grandi dimensioni con oltre 600 miliardi di parametri. Il chip include motori multimediali dedicati in grado di riprodurre fino a 22 flussi di video 8K ProRes 422.
Apple ha presentado su chip más potente hasta la fecha, el M3 Ultra, que cuenta con mejoras de rendimiento innovadoras y tecnologías revolucionarias. El chip combina dos die M3 Max utilizando la tecnología UltraFusion, integrando 184 mil millones de transistores.
Las especificaciones clave incluyen una CPU de 32 núcleos (24 núcleos de alto rendimiento y 8 núcleos de eficiencia), ofreciendo hasta 1.5 veces el rendimiento del M2 Ultra y 1.8 veces el del M1 Ultra. La GPU de 80 núcleos ofrece un rendimiento hasta 2 veces más rápido que el M2 Ultra y 2.6 veces más rápido que el M1 Ultra.
Entre las características notables se incluye el soporte para hasta 512GB de memoria unificada, conectividad Thunderbolt 5 con velocidades de transferencia de datos de 120 Gb/s, y capacidades de IA mejoradas que soportan modelos de lenguaje grandes con más de 600 mil millones de parámetros. El chip incluye motores multimedia dedicados capaces de reproducir hasta 22 flujos de video 8K ProRes 422.
애플은 그동안 가장 강력한 칩인 M3 Ultra를 공개했습니다. 이 칩은 혁신적인 성능 향상과 혁신적인 기술을 자랑합니다. 이 칩은 UltraFusion 기술을 사용하여 두 개의 M3 Max 다이를 결합하여 1,840억 개의 트랜지스터를 통합합니다.
주요 사양은 32코어 CPU (24개의 성능 코어와 8개의 효율 코어)를 포함하여 M2 Ultra보다 최대 1.5배, M1 Ultra보다 1.8배의 성능을 제공합니다. 80코어 GPU는 M2 Ultra보다 최대 2배, M1 Ultra보다 2.6배 더 빠른 성능을 제공합니다.
주목할 만한 기능으로는 최대 512GB의 통합 메모리 지원, 120 Gb/s 데이터 전송 속도를 제공하는 Thunderbolt 5 연결성, 6000억 개 이상의 매개변수를 지원하는 대규모 언어 모델을 위한 향상된 AI 기능이 포함됩니다. 이 칩은 최대 22개의 8K ProRes 422 비디오 스트림을 재생할 수 있는 전용 미디어 엔진을 포함하고 있습니다.
Apple a dévoilé sa puce la plus puissante à ce jour, le M3 Ultra, offrant des améliorations de performance révolutionnaires et des technologies innovantes. La puce combine deux dies M3 Max utilisant la technologie UltraFusion, intégrant 184 milliards de transistors.
Les spécifications clés incluent un CPU à 32 cœurs (24 cœurs de performance et 8 cœurs d'efficacité), offrant jusqu'à 1,5 fois les performances du M2 Ultra et 1,8 fois celles du M1 Ultra. Le GPU à 80 cœurs offre des performances jusqu'à 2 fois plus rapides que le M2 Ultra et 2,6 fois plus rapides que le M1 Ultra.
Les caractéristiques notables incluent le support pour jusqu'à 512 Go de mémoire unifiée, une connectivité Thunderbolt 5 avec des vitesses de transfert de données de 120 Gb/s et des capacités d'IA améliorées prenant en charge des modèles linguistiques de grande taille avec plus de 600 milliards de paramètres. La puce comprend des moteurs multimédias dédiés capables de lire jusqu'à 22 flux de vidéo 8K ProRes 422.
Apple hat seinen bisher leistungsstärksten Chip, den M3 Ultra, vorgestellt, der bahnbrechende Leistungsverbesserungen und innovative Technologien bietet. Der Chip kombiniert zwei M3 Max Dies mit UltraFusion-Technologie und integriert 184 Milliarden Transistoren.
Zu den wichtigsten Spezifikationen gehören eine 32-Kern-CPU (24 Leistungskerne und 8 Effizienzkerne), die bis zu 1,5-mal die Leistung des M2 Ultra und 1,8-mal die des M1 Ultra bietet. Die 80-Kern-GPU bietet eine bis zu 2-mal schnellere Leistung als der M2 Ultra und 2,6-mal schneller als der M1 Ultra.
Bemerkenswerte Funktionen umfassen die Unterstützung von bis zu 512 GB einheitlichem Speicher, Thunderbolt 5 Konnektivität mit Datenübertragungsgeschwindigkeiten von 120 Gb/s und verbesserte KI-Funktionen, die große Sprachmodelle mit über 600 Milliarden Parametern unterstützen. Der Chip enthält dedizierte Medien-Engines, die in der Lage sind, bis zu 22 Streams von 8K ProRes 422 Video wiederzugeben.
- Most powerful Apple chip ever with 184 billion transistors
- 32-core CPU delivers 1.5x performance of M2 Ultra
- 80-core GPU offers 2x faster performance than M2 Ultra
- Industry-leading 512GB unified memory support
- Thunderbolt 5 with 120 Gb/s data transfer speeds
- Enhanced AI capabilities for 600B parameter LLMs
- None.
Insights
Apple's new M3 Ultra chip represents a significant leap in the company's silicon strategy, with performance metrics that should strengthen its position in professional workstation markets. The chip offers
What's technically revolutionary here is the 512GB unified memory capacity—unprecedented in personal computing—alongside Apple's UltraFusion architecture that effectively combines two M3 Max dies. This memory capacity exceeds what's available in high-end workstation GPUs, removing bottlenecks for memory-intensive professional workflows like 3D rendering and AI model training.
The Thunderbolt 5 implementation is particularly noteworthy, doubling data throughput to 120 Gb/s with dedicated bandwidth per port. This addresses a longstanding limitation in professional workflows requiring high-speed data transfer with external devices.
The emphasis on AI capabilities—including the 32-core Neural Engine and ability to run 600 billion parameter LLMs on-device—positions Apple strategically in the AI computing race. On-device model execution offers advantages in latency, privacy, and offline capabilities versus cloud-based alternatives.
While technically impressive, this product targets a relatively small market segment of ultra-high-end professional users. However, these advancements will likely cascade down to more mainstream Apple products in future iterations, making this announcement a technological bellwether for Apple's computing strategy.
The M3 Ultra launch further solidifies Apple's vertical integration strategy, which has been a critical business differentiator since the company began transitioning from Intel processors. This represents the third generation of Ultra chips, showing Apple's commitment to iterative improvement in its custom silicon roadmap.
By designing chips specifically for AI workloads—supporting models with over 600 billion parameters—Apple is strategically positioning itself for the next computing paradigm. This aligns perfectly with their upcoming Apple Intelligence initiative mentioned in the release, suggesting these hardware advancements are designed to enable software capabilities that competitors may struggle to match without similar custom silicon.
The professional workstation market, while smaller than consumer segments, carries strategic importance through higher margins and ecosystem lock-in. Professional users who invest in this hardware tend to remain within the ecosystem longer and spend more on software and services.
The introduction of Thunderbolt 5 before many competitors shows Apple maintaining its leadership in connectivity standards—a subtle but important ecosystem advantage that increases switching costs for professionals with significant investments in peripherals.
Perhaps most telling is how Apple has managed to significantly increase performance while maintaining power efficiency. This continuing focus on performance-per-watt remains a sustainable competitive advantage, allowing Apple to push capabilities further without the thermal and power constraints that limit competitors.
For investors, this announcement demonstrates Apple's ongoing ability to innovate in ways that create genuine technical differentiation, which should protect margins and market position in professional computing segments.
The new chip delivers up to 2.6x the performance of M1 Ultra, along with Thunderbolt 5 connectivity and support for more than half a terabyte of unified memory — the most ever in a personal computer
M3 Ultra features a 32-core CPU, an 80-core GPU, double the Neural Engine cores, Thunderbolt 5, and support for the most unified memory ever in a personal computer. (Graphic: Business Wire)
“M3 Ultra is the pinnacle of our scalable system-on-a-chip architecture, aimed specifically at users who run the most heavily threaded and bandwidth-intensive applications,” said Johny Srouji, Apple’s senior vice president of Hardware Technologies. “Thanks to its 32-core CPU, massive GPU, support for the most unified memory ever in a personal computer, Thunderbolt 5 connectivity, and industry-leading power efficiency, there’s no other chip like M3 Ultra.”
Ultra Performance and Efficiency
M3 Ultra provides the most performance of any Mac chip, while maintaining the industry-leading power-efficiency of Apple silicon. It features up to a 32-core CPU with 24 performance cores and eight efficiency cores, delivering up to 1.5x the performance of M2 Ultra, and up to 1.8x that of M1 Ultra. It also has the largest GPU in any Apple chip, with up to 80 graphics cores that bring up to 2x faster performance than M2 Ultra, and up to 2.6x faster than M1 Ultra.1
The advanced graphics architecture in M3 Ultra features dynamic caching, along with hardware-accelerated mesh shading and ray tracing, so it can fly through the most demanding content creation workloads and games. A powerful 32-core Neural Engine fuels AI and machine learning (ML), and powers Apple Intelligence™, the personal intelligence system that puts powerful generative models right at the core of the new Mac Studio. In fact, M3 Ultra is built for AI, including ML accelerators in the CPU, Apple’s most powerful GPU, the Neural Engine, and over 800GB/s of memory bandwidth. AI professionals can use Mac Studio with M3 Ultra to run large language models (LLMs) with over 600 billion parameters directly on device, making it the ultimate desktop for AI development.
Unparalleled Memory
The unified memory architecture of M3 Ultra integrates the most high-bandwidth, low-latency memory ever available in a personal computer. Starting at 96GB, it can be configured up to 512GB, or over half a terabyte. This outpaces the memory available in today’s most advanced workstation graphics cards, removing limitations for pro workloads that demand large amounts of graphics memory like 3D rendering, visual effects, and AI.
Thunderbolt 5 for Next-Generation Connectivity
M3 Ultra brings Thunderbolt 5 to Mac Studio for up to 120 Gb/s data transfer speeds — more than double that of Thunderbolt 4. Each Thunderbolt 5 port is supported by its own custom-designed controller directly on the chip. This provides dedicated bandwidth for each port on Mac Studio, making it the industry’s most capable implementation of Thunderbolt 5.
Thunderbolt 5 ports on Mac Studio are a game changer for pro users who require faster data transfer speeds for external storage, docking, and hub solutions, and want to be ready for the next generation of expansion chassis. Thunderbolt 5 also enables connecting multiple Mac Studio systems together for workflows that push the limits of content creation and computer science exploration.
Cutting-Edge Technologies Built In
In the pursuit of maximizing performance and efficiency, M3 Ultra integrates Apple’s advanced technologies right on the chip:
- Apple’s custom-built UltraFusion packaging technology uses an embedded silicon interposer that connects two M3 Max dies across more than 10,000 signals, providing over 2.5TB/s of low-latency interprocessor bandwidth, and making M3 Ultra appear as a single chip to software.
- With 2x the resources of M3 Max, the media engine within M3 Ultra is capable of far more concurrent video processing. The chip offers dedicated, hardware-enabled H.264, HEVC, and four ProRes® encode and decode engines, allowing M3 Ultra to play back up to 22 streams of 8K ProRes 422 video.
- The display engine supports up to eight Pro Display XDRs, driving more than 160 million pixels.
- The Secure Enclave works with hardware-verified secure boot and runtime anti-exploitation technologies to provide state-of-the-art security.
Better for the Environment
The power-efficient performance of M3 Ultra helps the new Mac Studio meet Apple’s high standards for energy efficiency and reduces the total amount of energy consumed over the product’s lifetime. Today, Apple is carbon neutral for global corporate operations and, as part of its ambitious Apple 2030 goal, plans to be carbon neutral across its entire carbon footprint by the end of this decade.
Apple revolutionized personal technology with the introduction of the Macintosh in 1984. Today, Apple leads the world in innovation with iPhone, iPad, Mac, AirPods, Apple Watch, and Apple Vision Pro. Apple’s six software platforms — iOS, iPadOS, macOS, watchOS, visionOS, and tvOS — provide seamless experiences across all Apple devices and empower people with breakthrough services including the App Store, Apple Music, Apple Pay, iCloud, and Apple TV+. Apple’s more than 150,000 employees are dedicated to making the best products on earth and to leaving the world better than we found it.
- Results are compared to previous-generation Mac Studio systems with Apple M1 Ultra, 20-core CPU, 64-core GPU, and 128GB of RAM; and Mac Studio systems with Apple M2 Ultra, 24-core CPU, 76-core GPU, and 192GB of RAM.
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© 2025 Apple Inc. All rights reserved. Apple, the Apple logo, Mac, UltraFusion, Mac Studio, Apple Intelligence, ProRes, and Apple Pro Display XDR are trademarks of Apple. Other company and product names may be trademarks of their respective owners.
View source version on businesswire.com: https://www.businesswire.com/news/home/20250305963719/en/
Press Contacts:
Todd Wilder
Apple
wilder@apple.com
Lauren Klug
Apple
l_klug@apple.com
Source: Apple Inc.
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