Vertiv Introduces New Flexible, High-Density Heat Rejection System to Support Hybrid Liquid and Air Cooling for AI Applications
Vertiv (NYSE: VRT) has unveiled the Vertiv™ CoolLoop Trim Cooler, a new thermal management solution designed for AI and HPC applications. This innovative system supports hybrid liquid and air cooling in data centers and AI factories, offering significant advantages:
The solution delivers up to 70% reduction in annual cooling energy consumption through free-cooling and mechanical operation, while achieving 40% space savings compared to traditional systems. It can handle supply water temperatures up to 40°C and supports cold plate functionality at 45°C.
Key features include:
- Scalable cooling capacity up to 3 MW in air-cooled configuration
- Low-GWP refrigerant compliance with 2027 EU F-GAS regulations
- Seamless integration with Vertiv™ CoolChip CDU coolant distribution units
- Direct connection capability to immersion cooling systems
Vertiv (NYSE: VRT) ha presentato il Vertiv™ CoolLoop Trim Cooler, una nuova soluzione di gestione termica progettata per applicazioni di AI e HPC. Questo sistema innovativo supporta il raffreddamento ibrido a liquido e ad aria nei data center e nelle fabbriche di AI, offrendo vantaggi significativi:
La soluzione consente una riduzione fino al 70% del consumo energetico annuale per il raffreddamento grazie al free-cooling e al funzionamento meccanico, raggiungendo un risparmio di spazio del 40% rispetto ai sistemi tradizionali. Può gestire temperature dell'acqua di alimentazione fino a 40°C e supporta la funzionalità della piastra fredda a 45°C.
Le caratteristiche principali includono:
- Capacità di raffreddamento scalabile fino a 3 MW in configurazione raffreddata ad aria
- Conformità con refrigeranti a basso GWP secondo le normative F-GAS dell'UE del 2027
- Integrazione senza soluzione di continuità con le unità di distribuzione del refrigerante Vertiv™ CoolChip CDU
- Possibilità di connessione diretta ai sistemi di raffreddamento a immersione
Vertiv (NYSE: VRT) ha presentado el Vertiv™ CoolLoop Trim Cooler, una nueva solución de gestión térmica diseñada para aplicaciones de IA y HPC. Este sistema innovador soporta el enfriamiento híbrido por líquido y aire en centros de datos y fábricas de IA, ofreciendo ventajas significativas:
La solución proporciona una reducción de hasta el 70% en el consumo energético anual de enfriamiento a través del free-cooling y operación mecánica, logrando un ahorro de espacio del 40% en comparación con sistemas tradicionales. Puede manejar temperaturas del agua de suministro de hasta 40°C y soporta la funcionalidad de placa fría a 45°C.
Las características clave incluyen:
- Capacidad de enfriamiento escalable de hasta 3 MW en configuración enfriada por aire
- Cumplimiento con refrigerantes de bajo GWP según las regulaciones F-GAS de la UE para 2027
- Integración perfecta con las unidades de distribución de refrigerante Vertiv™ CoolChip CDU
- Capacidad de conexión directa a sistemas de enfriamiento por inmersión
Vertiv (NYSE: VRT)는 AI 및 HPC 애플리케이션을 위해 설계된 새로운 열 관리 솔루션인 Vertiv™ CoolLoop Trim Cooler를 공개했습니다. 이 혁신적인 시스템은 데이터 센터와 AI 공장에서 액체 및 공기 냉각을 하이브리드 방식으로 지원하여 상당한 이점을 제공합니다:
이 솔루션은 무료 냉각 및 기계 작동을 통해 연간 냉각 에너지 소비를 최대 70%까지 줄입니다, 전통적인 시스템에 비해 공간을 40% 절약합니다. 최대 40°C의 공급수 온도를 처리할 수 있으며, 45°C에서 냉각판 기능을 지원합니다.
주요 기능은 다음과 같습니다:
- 공기 냉각 구성에서 최대 3 MW의 확장 가능한 냉각 용량
- 2027년 EU F-GAS 규정을 준수하는 저 GWP 냉매
- Vertiv™ CoolChip CDU 냉각수 분배 장치와의 원활한 통합
- 침수 냉각 시스템에 직접 연결할 수 있는 기능
Vertiv (NYSE: VRT) a dévoilé le Vertiv™ CoolLoop Trim Cooler, une nouvelle solution de gestion thermique conçue pour les applications IA et HPC. Ce système innovant prend en charge le refroidissement hybride par liquide et par air dans les centres de données et les usines d'IA, offrant des avantages significatifs :
La solution permet une réduction de jusqu'à 70% de la consommation d'énergie de refroidissement annuelle grâce au free-cooling et à un fonctionnement mécanique, tout en atteignant 40% d'économies d'espace par rapport aux systèmes traditionnels. Elle peut gérer des températures de l'eau d'alimentation allant jusqu'à 40°C et prend en charge la fonctionnalité de plaque froide à 45°C.
Les caractéristiques clés incluent:
- Capacité de refroidissement évolutive allant jusqu'à 3 MW en configuration refroidie par air
- Conformité avec les réfrigérants à faible GWP selon les réglementations F-GAS de l'UE pour 2027
- Intégration transparente avec les unités de distribution de réfrigérant Vertiv™ CoolChip CDU
- Capacité de connexion directe aux systèmes de refroidissement par immersion
Vertiv (NYSE: VRT) hat den Vertiv™ CoolLoop Trim Cooler vorgestellt, eine neue Lösung für das thermische Management, die für KI- und HPC-Anwendungen entwickelt wurde. Dieses innovative System unterstützt hybride Flüssigkeits- und Luftkühlung in Rechenzentren und KI-Fabriken und bietet erhebliche Vorteile:
Die Lösung ermöglicht eine Reduzierung des jährlichen Kühlenergieverbrauchs um bis zu 70% durch Freikühlung und mechanischen Betrieb und erzielt 40% Platzersparnis im Vergleich zu herkömmlichen Systemen. Es kann Wassertemperaturen von bis zu 40°C verarbeiten und unterstützt die Kaltplattentechnologie bei 45°C.
Zu den Hauptmerkmalen gehören:
- Skalierbare Kühlkapazität von bis zu 3 MW in luftgekühlter Konfiguration
- Konformität mit niedrig-GWP-Kältemitteln gemäß den EU-F-GAS-Vorschriften von 2027
- Nahtlose Integration mit Vertiv™ CoolChip CDU Kühlmittelverteilungseinheiten
- Direktverbindung zu Immersionskühlsystemen
- 70% reduction in annual cooling energy consumption
- 40% space savings compared to traditional systems
- Scalable cooling capacity up to 3 MW
- Future-proof compliance with 2027 EU F-GAS regulations
- Flexible integration with multiple cooling systems
- None.
Insights
Vertiv's launch of the CoolLoop Trim Cooler represents a strategic expansion of its thermal management portfolio specifically targeting the high-growth AI infrastructure market. The product addresses critical cooling challenges in AI deployments that typically generate significantly higher heat loads than traditional computing environments.
The solution's claimed 70% reduction in cooling energy consumption and 40% space savings directly target two primary pain points for data center operators: operational expenses and physical footprint constraints. With power costs representing approximately 40-60% of data center operational expenses, these efficiency gains could translate to meaningful TCO advantages for customers implementing AI at scale.
From a competitive positioning standpoint, Vertiv is leveraging its established leadership in data center thermal management to address emerging AI cooling challenges. The product's compliance with upcoming 2027 EU F-GAS regulations provides future-proofing that could reduce customer switching costs and strengthen Vertiv's customer retention.
While the announcement doesn't quantify expected revenue contribution, the addressable market is substantial given industry forecasts projecting AI infrastructure spending to grow at a CAGR of 26.5% through 2028. Vertiv appears well-positioned to capture share in this expanding market segment with solutions specifically engineered for the thermal demands of AI workloads.
The CoolLoop Trim Cooler addresses a critical bottleneck in AI deployment - thermal management for compute-intensive workloads. As AI model sizes continue expanding exponentially, cooling has emerged as a fundamental constraint alongside power delivery and chip availability.
What's particularly notable is Vertiv's focus on hybrid cooling approaches and support for water temperatures up to 40°C, recognizing that AI infrastructure often requires multiple cooling modalities within the same environment. The direct compatibility with both chip-direct cooling and immersion systems demonstrates understanding of the heterogeneous nature of modern AI deployments.
The 3MW cooling capacity specification is significant, positioned to support the next generation of AI clusters that will require substantially more power density than today's deployments. Many facilities are struggling to retrofit existing infrastructure for these demands, creating an opening for purpose-built solutions like this.
The integration with Vertiv's existing CoolChip CDU ecosystem creates a comprehensive cooling platform that can scale with customer needs. This systems approach differentiates Vertiv from point-solution providers and aligns with enterprise buyers' preference for integrated platforms from fewer vendors.
With major cloud providers and AI startups racing to build out specialized infrastructure, Vertiv's timing brings a mature solution to market when alternatives are and demand is accelerating. The ability to support both retrofit and new-build scenarios positions them well for immediate market penetration.
The Vertiv™ CoolLoop Trim Cooler is an energy-efficient and space-saving solution designed to operate with fluctuating water temperatures common to AI and HPC applications
(Photo: Business Wire)
Integrating seamlessly with high-density, liquid-cooled environments, the Vertiv CoolLoop Trim Cooler delivers operational efficiency and aligns with the industry's evolving needs for energy-efficient and compact cooling solutions. It provides up to a
Straightforward water connections provide smooth and direct system integration for the Vertiv CoolLoop Trim Cooler and the Vertiv™ CoolChip CDU coolant distribution units, for direct-to-chip cooling. Vertiv CoolLoop Trim Cooler can also connect directly to immersion cooling systems. This simplifies installation and operational complexity, allowing compatibility across a range of high-density cooling environments, offering time savings and cost efficiencies for customers.
“AI is dramatically changing the cooling profiles of today’s data centres, requiring innovative approaches to managing the thermal challenges inherent in 100kW+ racks,” said Sam Bainborough, vice president, thermal business EMEA at Vertiv. “Today’s announcement, and the ongoing expansion of Vertiv’s industry-leading high-density thermal management portfolio, allow us to deliver pioneering, future-ready liquid cooling and chilled water solutions to meet our customers’ AI-driven demands.”
The Vertiv™ CoolLoop Trim Cooler uses low-GWP refrigerant and offers a scalable cooling capacity up to almost 3 MW in the air-cooled configuration. With free cooling coils optimized for high ambient temperatures, the system is designed to operate in free cooling mode across more seasons and conditions, for reduced electrical consumption and CO2e emissions. It is compliant with 2027 EU F-GAS regulations ban, avoiding the need for costly redesigns or infrastructure upgrades to meet this upcoming regulatory requirement.
For more information on the Vertiv CoolLoop Trim Cooler, Vertiv CoolChip CDU family or other Vertiv solutions to enable AI acceleration, visit Vertiv.com.
About Vertiv
Vertiv (NYSE: VRT) brings together hardware, software, analytics and ongoing services to enable its customers’ vital applications to run continuously, perform optimally and grow with their business needs. Vertiv solves the most important challenges facing today’s data centres, communication networks and commercial and industrial facilities with a portfolio of power, cooling and IT infrastructure solutions and services that extends from the cloud to the edge of the network. Headquartered in
Forward-Looking Statements
This release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, Section 27 of the Securities Act, and Section 21E of the Securities Exchange Act. These statements are only a prediction. Actual events or results may differ materially from those in the forward-looking statements set forth herein. Readers are referred to Vertiv’s filings with the Securities and Exchange Commission, including its most recent Annual Report on Form 10-K and any subsequent Quarterly Reports on Form 10-Q for a discussion of these and other important risk factors concerning Vertiv and its operations. Vertiv is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.
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Source: Vertiv
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