VIA optronics AG to Showcase its Multifaceted Technologies at Embedded World 2022 Exhibition
Jürgen Eichner, Chief Executive Officer and Founder of
“We are excited to participate at the
The Company will showcase its multiple bonding capabilities with different demos including a demo introducing bonded organic light-emitting diodes (OLED) displays on a cold formed cover glass. The VIA team will also display its core competencies in the areas of display, optical bonding, copper metal mesh touch sensor technology, and automotive camera technology with several interactive display systems demos.
About VIA:
VIA is a leading provider of interactive display solutions for multiple end markets in which superior functionality or durability is a critical differentiating factor. Its customizable technology is well-suited for high-end markets with unique specifications and demanding environments that pose technical and optical challenges for displays, such as bright ambient light, vibration and shock, extreme temperatures, and condensation. VIA’s interactive display systems combine system design, interactive displays, software functionality, cameras, and other hardware components. VIA’s intellectual property portfolio, process know-how, optical bonding, metal mesh touch sensor and camera module technologies provide enhanced display solutions built to meet the specific needs of its customers.
Further information on the Company can be found in its Annual Report on Form 20-F for the year ended
https://investors.via-optronics.com/investors/financials-and-filings/sec-filings/default.aspx. A hard copy of the audited consolidated financial statements can also be requested free of charge by contacting the investor relations team via the information provided below.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220614005282/en/
Investor Relations for VIA optronics:
VIAO@alpha-ir.com
Phone: +1 312-445-2870
Media:
Alexandra Müller-Plötz
AMueller-Ploetz@via-optronics.com
+49-911-597 575-302
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