Newly Resurrected TD72403L FIFO Memory Chip Enables Vital Defense Platform Extensions

Rhea-AI Summary

Teledyne e2v HiRel Electronics has reintroduced the TD72403L dual port FIFO memory device, compliant with Military MlL-PRF-38535 Class Level B standards. It operates within a temperature range of –55°C to +125°C, making it suitable for high-reliability applications. The TD72403L features 64 x 4 organization, low power consumption (175 mW typical), and a maximum shift frequency of 10 MHz. This device supports various applications, including data buffering and communication protocols. Customers can now order the TD72403L for immediate purchase.

Positive

• Reintroduction of TD72403L FIFO memory enhances semiconductor supply for critical applications.
• Military-grade compliance with MlL-PRF-38535, increasing reliability and trust in products.
• Low power consumption (175mW typical) supports energy-efficient designs.

Negative

• None.

Teledyne e2v HiRel Electronics announces the availability of the newly resurrected TD72403L dual port First-In, First-Out (FIFO) memory device, with Military MlL-PRF-38535, Class Level B processing and a military-suitable temperature range of –55°C to +125°C. It is suitable for platforms using the 5962-89523 Standard Microcircuit Drawing (SMD) for high reliability applications.

Teledyne e2v HiRel TD72403 FIFO (Photo: Business Wire)

“Our customers have struggled to find important semiconductor parts that are needed to keep our countries safe,” said Mont Taylor, VP of Business Development for Teledyne e2v HiRel. “The TD72403L joins a long list of combat-proven memory, logic, analog and control devices that we have re-engineered for customers to assure supply availability long into the future.”

The TD72403L has the following features:

• First-ln/First-Out dual-port memory
• 64 x 4 organization
• RAM-based FIFO with low falI-through time
• Low-power consumption — Active: 175 mW (typical)
• Maximum shift frequency — 10 MHz
• Military MlL-PRF-38535, Class Level B processing
• Military temperature range (–55 °C to +125 °C)

The FIFO device is commonly used for inter-chip communications protocol, frequency matching, bus-width matching, data buffering and data rate matching applications.

Other examples of devices that Teledyne HiRel has re-introduced following re-engineering effort to support legacy systems include:

• 87C5x 8-bit microcontroller with on-chip user-programmable EPROM memory
• 741 general purpose operational amplifier
• AC/ACT logic family multi-project wafer family yielding various advanced CMOS functions
• 26LS3x quad line driver/receiver family

The new TD72403L FIFO is now available for ordering and immediate purchase.

About Teledyne e2v HiRel Electronics, Inc.

Teledyne e2v HiRel Electronics innovations lead developments in space, transportation, defense, and industrial markets. Teledyne HiRel’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom solutions, bringing increased value to their systems. For more information, visit www.tdehirel.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20210317005181/en/

FAQ

What is the TD72403L FIFO memory device by Teledyne e2v HiRel Electronics?

The TD72403L is a dual port FIFO memory device designed for high-reliability applications, compliant with Military MlL-PRF-38535 Class Level B standards.

What temperature range does the TD72403L FIFO memory operate in?

The TD72403L operates within a military temperature range of –55°C to +125°C.

What are the key features of the TD72403L FIFO memory device?

Key features include 64 x 4 organization, low power consumption of 175 mW (typical), and a maximum shift frequency of 10 MHz.

How can customers purchase the TD72403L FIFO memory device?

Customers can now order the TD72403L FIFO memory device for immediate purchase.