DEEPX Expands First-Generation AI Chips into Intelligent Security and Video Analytics Markets
- DEEPX is expanding its AI chip lineup to target the intelligent video analytics and security system market.
- The company is forming key partnerships with global physical security companies and OEM/ODMs.
- The global AI video analytics market is projected to grow at a CAGR of 33% from 2023 to 2028, reaching $75.35 billion.
- DEEPX's DX-M1 chip offers high efficiency in power consumption and real-time AI computation processing.
- The company holds over 240 patents ensuring low manufacturing costs and competitive pricing for customers.
- DEEPX is running an Early Engagement Customer Program to attract early adopters for its AI solutions.
- The company will participate in upcoming industry events like Embedded Vision Summit and COMPUTEX 2024 to expand its global presence.
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Award-winning on-device AI chipmaker will pursue key industry partnerships to bolster this expansion; following a strong showing at ISC West, it will continue this momentum at Secutech Taipei, Embedded Vision Summit, and COMPUTEX 2024.
To explore partnering with DEEPX to drive synergies in the security and surveillance industry, please contact: info@deepx.ai
DEEPX will also have a booth #123 at the Secutech Taipei exhibition in
The global AI video analytics market is expected to grow at a CAGR of
Faced with communication delays, privacy issues, and network costs in systems that previously ran AI on the cloud or central servers, these markets require the realization of intelligent video analysis functions in real time using on-device AI semiconductors. In addition, a reorganization of the physical security industry's global supply chains is creating an opportunity for DEEPX to accelerate the expansion of its on-device AI solutions.
Harnessing this opportunity to empower physical security companies worldwide, DEEPX's DX-M1, which uses a 5nano processing, has secured a significant lead compared to similar solutions on the global market by demonstrating overwhelming efficiency of power consumption to performance. DX-M1 supports real-time AI computation processing of more than 30 frames per second (FPS) for more than 16 channels of multi-channel video on a single chip. Moreover, unlike other AI semiconductors, it has a wide spectrum of AI model support, from the most popular YOLOv5 model used for object recognition to the latest YOLOv9 and vision transformer models.
This technological and market advantage is made possible by more than 240 patents covering the underlying technology that ensures low manufacturing costs, low power consumption, and competitive pricing — all key considerations for customers when purchasing AI semiconductors.
DEEPX is currently running an Early Engagement Customer Program (EECP) program to attract early customers, offering a small camera module with DX-V1 (5TOPS), an AI SoC solution; M.2 module with DX-M1 (25TOPS), an AI accelerator solution; DX-H1 quattro PCIe card (100TOPS), a product for AI servers; and DXNN®, DEEPX's developer environment. Currently, more than 100 global companies have received hardware and software from DXNN® through the program, which they are using to develop new AI-powered products for mass production.
Following its participation in ISC West and Secutech Taipei, DEEPX will attend Embedded Vision Summit in Silicon Valley in May and COMPUTEX 2024 in
For more information, please visit: https://deepx.ai/
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SOURCE DEEPX
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