SPECTRA7 TO PARTICIPATE IN THE KEYBANC CAPITAL MARKETS 18th ANNUAL EMERGING TECHNOLOGY SUMMIT CONFERENCE
Spectra7 Microsystems Inc. will participate in the KeyBanc Capital Markets 18th Annual Emerging Technology Summit on March 7, 2023, focusing on the Semiconductor Infrastructure Enablers track. The event will take place in San Francisco, California, at the Hyatt Regency Downtown SOMA. Investors interested in meeting with Spectra7 can contact their KeyBanc representative or reach out to investor relations via ir@spectra7.com. As a leading provider of high-performance analog semiconductor products, Spectra7 focuses on markets including data centers, 5G infrastructure, and virtual and augmented reality.
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SAN JOSE, Calif. , Feb. 27, 2023 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for data centers, 5G infrastructure, virtual and augmented reality, and other connectivity markets, today announced that management will be participating in the KeyBanc Capital Markets 18th Annual Emerging Technology Summit on March 7, 2023 in the Semiconductor Infrastructure Enablers track.
The in-person conference will be held at the Hyatt Regency Downtown SOMA in San Francisco, Calif.
To arrange a meeting with Spectra7, please contact your KeyBanc representative. Investors may also contact Spectra7 investor relations at ir@spectra7.com to arrange a meeting.
ABOUT SPECTRA7 MICROSYSTEMS INC.
Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed, and resolution to enable disruptive industrial design for leading electronics manufacturers in data centers, 5G infrastructure, virtual and augmented reality, and other connectivity markets. Spectra7 is based in San Jose, California with a design center in Cork, Ireland and technical support location in Dongguan, China.
For more information, please visit www.spectra7.com.
Neither the TSX Venture Exchange nor its regulation services provided (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.
For more information, please contact:
Matt Kreps
Darrow Associates
214-597-8200
ir@spectra7.com
Spectra7 Microsystems Inc.
Bonnie Tomei
Chief Financial Officer
669-212-1089
ir@spectra7.com
Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
pr@spectra7.com
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SOURCE Spectra7 Microsystems Inc.
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