Spectra7 and Leading Equipment Suppliers to Demonstrate Robust Performance of 800Gbps Active Copper Interconnects at DesignCon 2024

Rhea-AI Summary

Spectra7 Microsystems Inc. will showcase its new GC1122 product in several demos at the DesignCon Conference Exhibition. The company will be demonstrating 800Gbps QSFP-DD and OSFP interconnects with leading equipment suppliers, focusing on robust performance and testing of 800Gbps Active Copper Cable products for hyperscale data center applications. Spectra7's analog based GaugeChanger™ GC1122 chips offer significant cost, size, and energy consumption advantages over competing technologies.

Spectra7's New GC1122 Product to be Featured in Several Demos

SAN JOSE, Calif., Jan. 17, 2024 /PRNewswire/ -- (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it will be demonstrating 800Gbps QSFP-DD and OSFP interconnects with several leading equipment suppliers at this year's annual DesignCon Conference Exhibition being held in Santa Clara, California from Jan 31-Feb 1, 2024. The companies plan to demonstrate robust performance and testing of 800Gbps Active Copper Cable products for hyperscale data center applications.

DesignCon is the premier high speed interconnect and system design conference attended by engineers from around the world. Spectra7 will be exhibiting in booth #1344.

Spectra7's analog based GaugeChanger^™ GC1122 chips are used in Active Copper Cables (ACCs) and offer significant cost, size and energy consumption value vs. competing Active Electrical Cables (AECs) and Active Optical Cables (AOCs) that use Digital Signal Processing (DSP) technologies.

ABOUT SPECTRA7 MICROSYSTEMS INC.

Spectra7 Microsystems Inc. is a high-performance analog semiconductor company delivering unprecedented bandwidth, speed and resolution to enable disruptive industrial design for leading electronics manufacturers in virtual reality, augmented reality, mixed reality, data centers and other connectivity markets. Spectra7 is based in San Jose, California with a design center in Cork, Ireland and a technical support location in Dongguan, China. For more information, please visit www.spectra7.com. 

Neither the TSX Venture Exchange nor its regulation services provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this release.

CAUTIONARY NOTES

Certain statements contained in this press release constitute "forward-looking statements". All statements other than statements of historical fact contained in this press release, including, without limitation, the Company's strategy, plans, objectives, goals and targets, and any statements preceded by, followed by or that include the words "believe", "expect", "aim", "intend", "plan", "continue", "will", "may", "would", "anticipate", "estimate", "forecast", "predict", "project", "seek", "should" or similar expressions or the negative thereof, are forward-looking statements. These statements are not historical facts but instead represent only the Company's expectations, estimates and projections regarding future events. These statements are not guarantees of future performance and involve assumptions, risks and uncertainties that are difficult to predict. Therefore, actual results may differ materially from what is expressed, implied or forecasted in such forward-looking statements. Additional factors that could cause actual results, performance or achievements to differ materially include, but are not limited to, the risk factors discussed in the Company's management's discussion and analysis for the year ended December 31, 2022. Management provides forward-looking statements because it believes they provide useful information to investors when considering their investment objectives and cautions investors not to place undue reliance on forward-looking information. Consequently, all of the forward-looking statements made in this press release are qualified by these cautionary statements and other cautionary statements or factors contained herein, and there can be no assurance that the actual results or developments will be realized or, even if substantially realized, that they will have the expected consequences to, or effects on, the Company. These forward-looking statements are made as of the date of this press release and the Company assumes no obligation to update or revise them to reflect subsequent information, events or circumstances or otherwise, except as required by law.

For more information, please contact:

Matt Kreps
Darrow Associates
214-597-8200
ir@spectra7.com

Spectra7 Microsystems Inc.
Dave Mier
Interim Chief Financial Officer
925-858-7011
ir@spectra7.com

Spectra7 Microsystems Inc.
John Mitchell
Public Relations
650-269-3043
pr@spectra7.com

 

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SOURCE Spectra7 Microsystems Inc.

FAQ

What product will Spectra7 showcase at the DesignCon Conference Exhibition?

Spectra7 will showcase its GC1122 product at the DesignCon Conference Exhibition.

What are the key features of Spectra7's GC1122 chips?

Spectra7's GC1122 chips offer significant cost, size, and energy consumption advantages over competing technologies.

What will Spectra7 be demonstrating at the conference?

Spectra7 will be demonstrating 800Gbps QSFP-DD and OSFP interconnects with leading equipment suppliers, focusing on robust performance and testing of 800Gbps Active Copper Cable products for hyperscale data center applications.

When and where will the DesignCon Conference Exhibition be held?

The DesignCon Conference Exhibition will be held in Santa Clara, California from Jan 31-Feb 1, 2024.

What is the significance of DesignCon Conference Exhibition?

DesignCon is the premier high speed interconnect and system design conference attended by engineers from around the world.