Smartkem To Unveil First Demo of a MicroLED-in-a-Package (MiP) Backlight at Touch Taiwan 2025
Smartkem (NASDAQ: SMTK) has announced it will debut its first MicroLED-in-a-Package (MiP) backlight at Touch Taiwan 2025, scheduled for April 16-18th in Taipei City. Chairman and CEO Ian Jenks will deliver a keynote presentation on April 16th discussing the company's disruptive technology.
The company's innovative 'chip-first' MicroLED architecture introduces a low-temperature manufacturing process that simplifies production and improves yields for LCD displays, which currently represent 65% of the global display industry. At the core of this technology is Smartkem's proprietary Redistribution Layer (RDL) material, which connects four chip-first MicroLEDs in series to create the MiP4 package.
The MiP4 technology offers several advantages:
- Higher brightness at lower power consumption
- Reduced production costs
- Compatibility with existing MiniLED equipment
- MiP4-on-blue tape format for easy industry adoption
Smartkem (NASDAQ: SMTK) ha annunciato che presenterà il suo primo MicroLED-in-a-Package (MiP) retroilluminazione al Touch Taiwan 2025, in programma dal 16 al 18 aprile a Taipei. Il presidente e CEO Ian Jenks terrà una presentazione principale il 16 aprile, discutendo della tecnologia innovativa dell'azienda.
L'architettura 'chip-first' MicroLED dell'azienda introduce un processo di produzione a bassa temperatura che semplifica la produzione e migliora i rendimenti per i display LCD, che attualmente rappresentano il 65% dell'industria globale dei display. Al centro di questa tecnologia c'è il materiale proprietario di Smartkem, il Redistribution Layer (RDL), che collega quattro MicroLED chip-first in serie per creare il pacchetto MiP4.
La tecnologia MiP4 offre diversi vantaggi:
- Maggiore luminosità a minor consumo energetico
- Riduzione dei costi di produzione
- Compatibilità con le attrezzature MiniLED esistenti
- Formato MiP4-on-blue tape per una facile adozione nel settore
Smartkem (NASDAQ: SMTK) ha anunciado que debutará su primera retroiluminación MicroLED-in-a-Package (MiP) en Touch Taiwan 2025, programada para el 16 al 18 de abril en la ciudad de Taipéi. El presidente y CEO Ian Jenks dará una presentación principal el 16 de abril hablando sobre la tecnología disruptiva de la empresa.
La innovadora arquitectura 'chip-first' MicroLED de la empresa introduce un proceso de fabricación a baja temperatura que simplifica la producción y mejora los rendimientos para las pantallas LCD, que actualmente representan el 65% de la industria global de pantallas. En el núcleo de esta tecnología se encuentra el material propietario de Smartkem, el Redistribution Layer (RDL), que conecta cuatro MicroLEDs chip-first en serie para crear el paquete MiP4.
La tecnología MiP4 ofrece varias ventajas:
- Mayor brillo con menor consumo de energía
- Reducción de costos de producción
- Compatibilidad con equipos MiniLED existentes
- Formato MiP4-on-blue tape para una fácil adopción en la industria
스마트켐 (NASDAQ: SMTK)은 타이완 터치 2025에서 첫 번째 MicroLED-in-a-Package (MiP) 백라이트를 공개할 것이라고 발표했습니다. 이 행사는 4월 16일부터 18일까지 타이페이에서 열릴 예정입니다. 이안 젠크스 회장 겸 CEO는 4월 16일에 회사의 혁신적인 기술에 대해 발표할 예정입니다.
회사의 혁신적인 'chip-first' MicroLED 아키텍처는 저온 제조 공정을 도입하여 LCD 디스플레이의 생산을 간소화하고 수율을 개선합니다. 현재 LCD는 전 세계 디스플레이 산업의 65%를 차지하고 있습니다. 이 기술의 핵심은 스마트켐의 독점적인 Redistribution Layer (RDL) 소재로, 이는 네 개의 chip-first MicroLED를 직렬로 연결하여 MiP4 패키지를 생성합니다.
MiP4 기술은 여러 가지 장점을 제공합니다:
- 낮은 전력 소비로 더 높은 밝기
- 생산 비용 절감
- 기존 MiniLED 장비와의 호환성
- 산업 채택을 위한 MiP4-on-blue tape 형식
Smartkem (NASDAQ: SMTK) a annoncé qu'elle présentera son premier rétroéclairage MicroLED-in-a-Package (MiP) au Touch Taiwan 2025, prévu du 16 au 18 avril à Taipei. Le président et PDG Ian Jenks prononcera une présentation principale le 16 avril sur la technologie disruptive de l'entreprise.
L'architecture innovante 'chip-first' MicroLED de l'entreprise introduit un processus de fabrication à basse température qui simplifie la production et améliore les rendements pour les écrans LCD, qui représentent actuellement 65 % de l'industrie mondiale des écrans. Au cœur de cette technologie se trouve le matériau propriétaire de Smartkem, le Redistribution Layer (RDL), qui connecte quatre MicroLED chip-first en série pour créer le paquet MiP4.
La technologie MiP4 offre plusieurs avantages :
- Plus de luminosité avec une consommation d'énergie réduite
- Coûts de production réduits
- Compatibilité avec les équipements MiniLED existants
- Format MiP4-on-blue tape pour une adoption facile dans l'industrie
Smartkem (NASDAQ: SMTK) hat angekündigt, dass es auf der Touch Taiwan 2025 seine erste MicroLED-in-a-Package (MiP) Hintergrundbeleuchtung vorstellen wird, die vom 16. bis 18. April in Taipeh stattfinden wird. Der Vorsitzende und CEO Ian Jenks wird am 16. April eine Hauptrede halten, in der er über die disruptive Technologie des Unternehmens spricht.
Die innovative 'chip-first' MicroLED-Architektur des Unternehmens führt einen Niedertemperatur-Herstellungsprozess ein, der die Produktion vereinfacht und die Ausbeuten für LCD-Displays verbessert, die derzeit 65% der globalen Display-Industrie ausmachen. Im Kern dieser Technologie steht das proprietäre Redistribution Layer (RDL) Material von Smartkem, das vier chip-first MicroLEDs in Reihe verbindet, um das MiP4-Paket zu erstellen.
Die MiP4-Technologie bietet mehrere Vorteile:
- Höhere Helligkeit bei geringerem Energieverbrauch
- Reduzierte Produktionskosten
- Kompatibilität mit bestehenden MiniLED-Geräten
- MiP4-on-blue tape Format für eine einfache Branchenakzeptanz
- Innovative MiP4 technology offers higher brightness at lower power consumption
- Technology compatible with existing MiniLED equipment, reducing adoption barriers
- Targets large LCD market (65% of global display industry)
- New process simplifies production and improves manufacturing yields
- Technology still in demonstration phase, not yet commercialized
Smartkem Chairman and CEO, Ian Jenks, to Deliver Keynote Address on Transformative MicroLED technology
Keynote Presentation Details
Date: April, 16, 2025
Time: 16:00-16:25
Location: Room 401, Nangang Exhibition Center Hall 1,
Smartkem's 'chip-first' MicroLED architecture introduces a breakthrough approach to MicroLED display manufacturing with a low temperature process that simplifies production, improves yields and delivers an enhanced display performance. This new MicroLED-in-a-Package (MiP) backlight simplifies assembly and yield management for display manufacturers and is designed for seamless integration of MicroLEDs to enhance today's Liquid Crystal Display (LCD) market, which represents approximately
"Smartkem's mission is to enable the next generation of displays using our transistor technology," said Ian Jenks, Chairman and CEO of Smartkem. "This demonstration shows how our 'chip-first' approach creates a new category of MicroLED-in-a-Package (MiP) backlight that can use MicroLEDs to transform LCD display technology. This innovation allows LCDs and large-scale signage to achieve low power consumption, high contrast ratios, and exceptional readability—even in bright environments. Importantly, this demonstration shows that Smartkem's technology can be used to enable the next generation of MicroLED displays as well as to improve existing display technologies including LCDs.
Smartkem's MiP4
At the core of this advancement is Smartkem's proprietary Redistribution Layer (RDL) material, which interconnects four chip-first MicroLEDs in a series to form a single high-voltage chip—the MiP4. This MiP4 package is designed to replace existing MiniLED packages in LCD backlights and signage applications, offering:
- Higher brightness at lower power
- Lower production costs
- Compatibility with existing MiniLED die bonding equipment
- Shipping in MiP4-on-blue tape format for seamless industry adoption
Demonstration at Touch Taiwan 2025
Smartkem will showcase its first 12.3-inch MicroLED-in-a-Package (MiP) backlight at Booth M505 at Touch Taiwan 2025, held at the Taipei Nangang Exhibition Center, Hall 1, 4F in
For more information or to schedule a meeting with Smartkem's leadership team during Touch Taiwan 2025, please contact:
Michelle Ouyang
Head of Business Development
m.ouyang@smartkem.com
For more information on Touch Taiwan, please visit: https://www.touchtaiwan.com/en/
About Smartkem
Smartkem is seeking to change the world of electronics with a new class of transistor using its proprietary advanced semiconductor materials that have the potential to revolutionize the display industry. Smartkem's TRUFLEX® semiconductor technology enables low temperature printing processes that are compatible with existing manufacturing infrastructure with the potential to deliver low-cost, high performance displays in a range of display technologies including microLED, miniLED and AMOLED, as well as applications in sensors and logic.
Smartkem develops its materials at its research and development facility in
Forward-Looking Statements
All statements in this press release that are not historical are forward-looking statements, including, among other things, its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on Smartkem, Inc.'s current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as "may," "will," "could," "would," "should," "anticipate," "predict," "potential," "continue," "expect," "intend," "plan," "project," "believe," "estimate," and other similar or elated expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company's control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company's filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available.
Contacts:
Selena Kirkwood
Head of Communications for Smartkem
T: +44 (0) 7971 460 364
s.kirkwood@smartkem.com
U.S. Investors
David Barnard, CFA
Alliance Advisors Investor Relations
T: 1 415 433 3777
dbarnard@allianceadvisors.com
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SOURCE Smartkem
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