Smartkem Completes First Sale of its TRUFLEX® Semiconductor Materials to Chip Foundation under their Co-Development Agreement
Smartkem (SMTK) has completed its first sale of TRUFLEX® semiconductor materials to Shanghai Chip Foundation Semiconductor Technology Co., under their co-development agreement. The materials will be used in developing a new generation of microLED-based backlight technology for Liquid Crystal Displays.
The company is supplying its proprietary organic dielectric single layer material (Redistribution Layer - RDL) to Chip Foundation to combine with their microLED devices. The resulting chip is expected to feature high brightness and current efficiency, reducing power losses in driving backlights and improving illumination uniformity.
Additional sales of RDL materials to Chip Foundation are expected to continue throughout 2025.
Smartkem (SMTK) ha completato la sua prima vendita di materiali semiconduttori TRUFLEX® alla Shanghai Chip Foundation Semiconductor Technology Co., nell'ambito del loro accordo di co-sviluppo. I materiali saranno utilizzati per sviluppare una nuova generazione di tecnologia di retroilluminazione basata su microLED per i display a cristalli liquidi.
L'azienda sta fornendo il suo materiale dielettrico organico a strato singolo proprietario (Redistribution Layer - RDL) alla Chip Foundation per combinarlo con i loro dispositivi microLED. Il chip risultante dovrebbe presentare un'alta luminosità e un'efficienza di corrente, riducendo le perdite energetiche nella gestione delle retroilluminazioni e migliorando l'uniformità dell'illuminazione.
Si prevede che ulteriori vendite di materiali RDL alla Chip Foundation continueranno per tutto il 2025.
Smartkem (SMTK) ha completado su primera venta de materiales semiconductores TRUFLEX® a Shanghai Chip Foundation Semiconductor Technology Co., bajo su acuerdo de co-desarrollo. Los materiales se utilizarán para desarrollar una nueva generación de tecnología de retroiluminación basada en microLED para pantallas de cristal líquido.
La empresa está suministrando su material dieléctrico orgánico de capa única (Redistribution Layer - RDL) a Chip Foundation para combinarlo con sus dispositivos microLED. Se espera que el chip resultante presente alta luminosidad y eficiencia de corriente, reduciendo las pérdidas de energía en la conducción de retroiluminaciones y mejorando la uniformidad de la iluminación.
Se espera que las ventas adicionales de materiales RDL a Chip Foundation continúen durante todo 2025.
Smartkem (SMTK)는 상하이 칩 재단 반도체 기술 회사에 TRUFLEX® 반도체 소재의 첫 번째 판매를 완료했습니다. 이는 공동 개발 협약의 일환으로 이루어진 것입니다. 이 소재는 액정 디스플레이용 마이크로LED 기반 백라이트 기술의 새로운 세대를 개발하는 데 사용될 것입니다.
회사는 칩 재단에 자신의 고유한 유기 절연 단층 소재(재분배층 - RDL)를 공급하여 그들의 마이크로LED 장치와 결합합니다. 결과적인 칩은 높은 밝기와 전류 효율성을 특징으로 할 것으로 예상되며, 백라이트 구동 시 전력 손실을 줄이고 조명 균일성을 향상시킬 것입니다.
2025년까지 칩 재단에 RDL 소재의 추가 판매가 계속될 것으로 예상됩니다.
Smartkem (SMTK) a finalisé sa première vente de matériaux semi-conducteurs TRUFLEX® à Shanghai Chip Foundation Semiconductor Technology Co., dans le cadre de leur accord de co-développement. Les matériaux seront utilisés pour développer une nouvelle génération de technologie de rétroéclairage basée sur des microLED pour les écrans à cristaux liquides.
L'entreprise fournit son matériau diélectrique organique à couche unique (Redistribution Layer - RDL) à Chip Foundation pour le combiner avec leurs dispositifs microLED. Le chip résultant devrait présenter une haute luminosité et une efficacité de courant, réduisant les pertes d'énergie dans la conduite des rétroéclairages et améliorant l'uniformité de l'éclairage.
Des ventes supplémentaires de matériaux RDL à Chip Foundation devraient se poursuivre jusqu'en 2025.
Smartkem (SMTK) hat seinen ersten Verkauf von TRUFLEX® Halbleitermaterialien an die Shanghai Chip Foundation Semiconductor Technology Co. im Rahmen ihrer Co-Entwicklungsvereinbarung abgeschlossen. Die Materialien werden zur Entwicklung einer neuen Generation von mikroLED-basierten Backlight-Technologien für Flüssigkristallanzeigen verwendet.
Das Unternehmen liefert sein proprietäres organisches dielektrisches Ein-Schicht-Material (Redistribution Layer - RDL) an die Chip Foundation zur Kombination mit ihren MikroLED-Geräten. Der resultierende Chip wird voraussichtlich eine hohe Helligkeit und Stromeffizienz aufweisen, die den Energieverlust beim Ansteuern von Backlights reduziert und die Homogenität der Beleuchtung verbessert。
Zusätzliche Verkäufe von RDL-Materialien an Chip Foundation werden voraussichtlich bis 2025 weiterhin stattfinden.
- First commercial sale achieved for TRUFLEX® semiconductor materials
- Ongoing sales expected throughout 2025
- Strategic partnership with established semiconductor manufacturer
- None.
Insights
The first commercial sale of TRUFLEX® materials represents a important milestone in Smartkem's commercialization journey. The partnership with Chip Foundation for microLED backlight technology development could potentially address a $5.5 billion LCD backlight market. The single-layer dielectric material's ability to improve brightness and current efficiency directly tackles two critical pain points in LCD technology: power consumption and display uniformity.
This development is particularly notable as it demonstrates real-world commercial validation of Smartkem's OTFT technology. For a company with a market cap of just
From a technical perspective, the single-layer RDL (Redistribution Layer) approach could offer manufacturing cost advantages over traditional multi-layer solutions, potentially providing Smartkem with a competitive edge in the high-growth microLED segment. However, investors should note that this is still early-stage commercialization and market adoption will depend on performance validation in real-world applications.
The integration of Smartkem's organic dielectric materials with microLED technology represents a significant technical advancement in LCD backlighting. The single-layer approach could potentially reduce manufacturing complexity while improving display performance - a rare combination in the display industry. The focus on high brightness and current efficiency directly addresses the increasing demand for HDR (High Dynamic Range) displays in both consumer and professional markets.
For the average consumer, this technology could translate to displays with better brightness, more uniform illumination and lower power consumption - three key factors that drive purchasing decisions in the premium display segment. The collaboration with Chip Foundation is particularly strategic as it combines Smartkem's innovative materials with established manufacturing capabilities, potentially accelerating the path to market.
While competing solutions exist, including quantum dot technology and direct-view microLED displays, Smartkem's approach of enhancing traditional LCD technology with advanced materials could offer a more cost-effective solution for mass-market adoption. The continued material sales throughout 2025 suggest confidence in the technology's commercial viability, though success will ultimately depend on achieving performance metrics that justify any cost premium.
Sales under the Chip Foundation co-development agreement are expected to continue throughout 2025
Smartkem Chairman and CEO, Ian Jenks, comments, "The first sale of our single layer dielectric materials marks a significant development milestone in our path to establish the commercial viability of our advanced materials in both the display industry and within other applications."
Smartkem is supplying its proprietary organic dielectric single layer material, or Redistribution Layer (RDL), to Chip Foundation to combine with its own microLED devices, for the joint development of microLED based device structures. The resulting manufactured chip is expected to have the properties of high brightness coupled with high current efficiency, reducing power losses in driving backlights and improving uniformity of illumination. Additional sales of RDL materials to Chip Foundation are expected to continue throughout 2025.
Dr. Maosheng Hao, Chairman of Chip Foundation, comments, "We are excited to collaborate with Smartkem and integrate their TRUFLEX® materials into our microLED devices. This partnership marks a significant step forward in advancing high-performance backlight solutions for LCDs, combining innovation and efficiency to meet the evolving demands of the display industry."
About Smartkem
Smartkem is seeking to reshape the world of electronics with its disruptive organic thin-film transistors (OTFTs) that have the potential to revolutionize the display industry. Smartkem's patented TRUFLEX® liquid semiconductor polymers can be used to make a new type of transistor that can be used in a number of display technologies, including next generation microLED displays. Smartkem's organic inks enable low temperature printing processes that are compatible with existing manufacturing infrastructure to deliver low-cost displays that outperform existing technology.
Smartkem develops its materials at its research and development facility in
About Shanghai Chip Foundation Semiconductor Technology Co., Ltd.
Shanghai Chip Foundation Semiconductor Technology Co., Ltd. has developed a comprehensive Chemical Lift-off (CLO) technology for Gallium Nitride (GaN) growth substrates through years of continuous research and practice, achieving mass production. The substrate, as the core support for GaN materials and chips, plays a crucial role. Chip Foundation have successfully developed a new type of composite patterned sapphire substrate, namely Dielectric Patterned Sapphire Substrate (DPSS), which is significantly different from the industry-standard Patterned Sapphire Substrate (PSS). Utilizing precise facet controlled epitaxial lateral over growth technology, Chip Foundation can reduce the dislocation density of the GaN epitaxial layer on the DPSS substrate to the level of 10^7/cm². For large-size LED chips, the effect of dislocations can be ignored, but for Micro LED chips, the negative effects of dislocations will become increasingly prominent. Relying on the DPSS substrate, Chip Foundation have further innovated the processing technology of chemical lift-off growth substrates. Compared with the traditional laser lift-off method, chemical lift-off shows superior performance in cost-effectiveness and product yield. The laser lift-off process has an adverse effect on the leakage performance of the chip, while the chemical lift-off process can effectively improve the leakage performance of the chip, a conclusion that has been experimentally verified and its physical mechanism clearly explained.
These technologies can effectively promote the mass production of Micro LED chips and can be used to produce Mini Thin-film Flip-chip LED chips. Due to the omission of substrate thinning, laser scribing, and cracking processes, and the fact that almost no scribe channels are needed between chips, the cost advantage is very significant. Chip Foundation have developed wafer-level packaging technology based on thin-film chips and Mini LED backlight technology that can fully leverage the superior performance of thin-film chips.
The advantages of GaN materials in electronic power and radio frequency chips are also unparalleled. Our core technologies (DPSS substrate, lateral epitaxial growth technology, chemical lift-off substrate technology) can effectively solve the reliability and heat dissipation issues of electronic power and radio frequency chips, and Chip Foundation look forward to cooperating with various parties in these fields in various forms.
Forward-Looking Statements
All statements in this press release that are not historical are forward-looking statements, including, among other things, its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on Smartkem, Inc.'s current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as "may," "will," "could," "would," "should," "anticipate," "predict," "potential," "continue," "expect," "intend," "plan," "project," "believe," "estimate," and other similar or elated expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company's control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company's filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available.
Contacts:
Selena Kirkwood
Head of Communications for Smartkem
T: +44 (0) 7971 460 364
s.kirkwood@smartkem.com
U.S. Investors
David Barnard, CFA
Alliance Advisors Investor Relations
T: 1 415 433 3777
dbarnard@allianceadvisors.com
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FAQ
What is the significance of Smartkem's first TRUFLEX® sale to Chip Foundation?
How will SMTK's RDL technology benefit microLED backlight displays?
What is the duration of SMTK's sales agreement with Chip Foundation?
What is the main application of Smartkem's TRUFLEX® materials in the Chip Foundation partnership?
