Smartkem Collaborates with Manz Asia for Advanced Computer and AI Chip Packaging Solutions
Smartkem (SMTK) has announced a collaboration with Manz Asia to demonstrate inkjet printable dielectric layers for advanced computer and AI chip packaging solutions at SEMICON® SEA 2025. The partnership combines Smartkem's specialized dielectric materials with Manz Asia's inkjet printing technology to enable large-area panel chip packaging beyond current 300mm wafer limitations.
The panel level packaging market is projected to reach $600 million by 2030, representing a 27% CAGR from 2024. The collaboration leverages Smartkem's UV curable dielectric layer chemistry and Manz Asia's high-precision inkjet printing equipment to deliver scalable semiconductor packaging solutions. Key advantages of panel level packaging include higher throughput, lower cost per chip, better material utilization, and improved integration capabilities.
Smartkem (SMTK) ha annunciato una collaborazione con Manz Asia per dimostrare strati dielettrici stampabili a getto d'inchiostro per soluzioni avanzate di packaging di chip per computer e intelligenza artificiale durante SEMICON® SEA 2025. La partnership unisce i materiali dielettrici specializzati di Smartkem alla tecnologia di stampa a getto d'inchiostro di Manz Asia, consentendo il packaging di chip su pannelli di grandi dimensioni oltre i limiti attuali dei wafer da 300 mm.
Il mercato del packaging a livello di pannello è previsto raggiungere 600 milioni di dollari entro il 2030, con un CAGR del 27% a partire dal 2024. La collaborazione sfrutta la chimica degli strati dielettrici UV curabili di Smartkem e le apparecchiature di stampa a getto d'inchiostro ad alta precisione di Manz Asia per offrire soluzioni scalabili di packaging per semiconduttori. I principali vantaggi del packaging a livello di pannello includono una maggiore produttività, costi per chip inferiori, migliore utilizzo dei materiali e capacità di integrazione migliorate.
Smartkem (SMTK) ha anunciado una colaboración con Manz Asia para demostrar capas dieléctricas imprimibles mediante inyección de tinta para soluciones avanzadas de empaquetado de chips para computadoras e inteligencia artificial en SEMICON® SEA 2025. La asociación combina los materiales dieléctricos especializados de Smartkem con la tecnología de impresión por inyección de tinta de Manz Asia, permitiendo el empaquetado de chips en paneles de gran área más allá de las limitaciones actuales de obleas de 300 mm.
Se proyecta que el mercado de empaquetado a nivel de panel alcance los 600 millones de dólares para 2030, con una Tasa de Crecimiento Anual Compuesta (CAGR) del 27% desde 2024. La colaboración aprovecha la química de capas dieléctricas curables por UV de Smartkem y el equipo de impresión por inyección de tinta de alta precisión de Manz Asia para ofrecer soluciones escalables de empaquetado de semiconductores. Las ventajas clave del empaquetado a nivel de panel incluyen mayor rendimiento, menor costo por chip, mejor utilización de materiales y capacidades de integración mejoradas.
Smartkem (SMTK)이 Manz Asia와 협력하여 SEMICON® SEA 2025에서 첨단 컴퓨터 및 AI 칩 패키징 솔루션을 위한 잉크젯 인쇄 가능한 유전체층을 시연할 예정입니다. 이번 파트너십은 Smartkem의 특화된 유전체 재료와 Manz Asia의 잉크젯 인쇄 기술을 결합하여 기존 300mm 웨이퍼 한계를 넘어서는 대면적 패널 칩 패키징을 가능하게 합니다.
패널 레벨 패키징 시장은 2030년까지 6억 달러에 이를 것으로 예상되며, 2024년부터 연평균 성장률 27%을 기록할 전망입니다. 이번 협력은 Smartkem의 UV 경화 유전체층 화학 기술과 Manz Asia의 고정밀 잉크젯 인쇄 장비를 활용하여 확장 가능한 반도체 패키징 솔루션을 제공합니다. 패널 레벨 패키징의 주요 장점으로는 높은 처리량, 낮은 칩당 비용, 우수한 재료 활용도, 향상된 통합 능력이 있습니다.
Smartkem (SMTK) a annoncé une collaboration avec Manz Asia pour démontrer des couches diélectriques imprimables par jet d'encre pour des solutions avancées d'emballage de puces informatiques et d'IA lors de SEMICON® SEA 2025. Ce partenariat combine les matériaux diélectriques spécialisés de Smartkem avec la technologie d'impression jet d'encre de Manz Asia, permettant l'emballage de puces sur panneaux de grande surface au-delà des limites actuelles des wafers de 300 mm.
Le marché de l'emballage au niveau panneau devrait atteindre 600 millions de dollars d'ici 2030, avec un TCAC de 27% à partir de 2024. Cette collaboration s'appuie sur la chimie des couches diélectriques durcissables aux UV de Smartkem et les équipements d'impression jet d'encre haute précision de Manz Asia pour fournir des solutions d'emballage de semi-conducteurs évolutives. Les principaux avantages de l'emballage au niveau panneau incluent un débit plus élevé, un coût par puce réduit, une meilleure utilisation des matériaux et des capacités d'intégration améliorées.
Smartkem (SMTK) hat eine Zusammenarbeit mit Manz Asia angekündigt, um auf der SEMICON® SEA 2025 druckbare dielektrische Schichten mittels Tintenstrahldruck für fortschrittliche Computer- und KI-Chip-Verpackungslösungen vorzuführen. Die Partnerschaft kombiniert Smartkems spezialisierte dielektrische Materialien mit der Tintenstrahldrucktechnologie von Manz Asia, um großflächige Panel-Chip-Verpackungen jenseits der aktuellen 300-mm-Wafer-Grenzen zu ermöglichen.
Der Markt für Panel-Level-Packaging wird voraussichtlich bis 2030 600 Millionen US-Dollar erreichen und von 2024 an mit einer jährlichen Wachstumsrate (CAGR) von 27% wachsen. Die Zusammenarbeit nutzt Smartkems UV-härtbare dielektrische Schichtchemie und Manz Asias hochpräzise Tintenstrahldruckausrüstung, um skalierbare Halbleiterverpackungslösungen zu liefern. Zu den Hauptvorteilen des Panel-Level-Packaging zählen höhere Durchsatzraten, geringere Kosten pro Chip, bessere Materialausnutzung und verbesserte Integrationsmöglichkeiten.
- Panel level packaging market expected to reach $600 million by 2030, with 27% CAGR from 2024
- Partnership enables large-area panel chip packaging beyond current 300mm wafer limitations
- Technology offers lower cost per chip through economies of scale
- Solution provides higher throughput and better material utilization compared to traditional circular wafers
- None.
Insights
Smartkem's partnership with Manz Asia targets the high-growth panel-level chip packaging market, potentially expanding their footprint in AI infrastructure.
This collaboration between Smartkem and Manz Asia represents a strategic positioning in the rapidly evolving advanced packaging landscape. Smartkem is leveraging its expertise in dielectric materials to address a specific high-growth segment: panel-level packaging for AI and advanced computing chips. The press release highlights that this market is projected to reach
The technical value proposition centers on adapting Smartkem's UV-curable dielectric layer chemistry (originally developed for thin-film transistors) for inkjet printing in advanced packaging applications. The partnership aims to enable rectangular panel-level packaging that overcomes the size limitations of current 300mm circular wafers. This approach offers compelling advantages: higher throughput, lower per-chip costs through economies of scale, better material utilization, and enhanced integration capabilities.
From an industry perspective, this collaboration addresses a critical bottleneck in AI infrastructure development. As AI computational demands intensify, packaging technologies that can efficiently integrate and connect increasingly complex chips become essential. Panel-level packaging with printed dielectrics offers a potential solution by enabling larger packaging areas without proportionally increasing costs.
While the announcement lacks specific revenue projections for Smartkem, the partnership positions them in a high-value segment of the semiconductor supply chain at a time when AI chip demand is surging. The demonstration at SEMICON SEA suggests the technology is mature enough for industry showcase but likely still pre-commercial revenue generation.
Manz
Visit Manz Asia at Booth no. L1314.
Smartkem Chairman and CEO, Ian Jenks, commented: "We're thrilled to be working with Manz Asia to address a fast-growing opportunity in the market for advanced computer and AI chip packaging. As the demand for AI leads to increasingly complex servers, our materials combined with Manz Asia's printing technology have the potential to enable large area panel chip packaging beyond the existing constraints of today's 300mm wafer packaging. Panel level packaging is a market expected to grow to approximately
Manz Asia General Manger, Robert Lin, commented: "Manz Asia is committed to advancing green manufacturing and smart production through the development of high-precision inkjet printing equipment. Our maskless inkjet technology enables accurate material deposition and supports a wide range of inks, making it suitable for various substrates—including PI, ABF, EMC, silicon, and glass—in both wafer and panel formats. The collaboration with Smartkem marks a significant step in demonstrating how our inkjet platform, combined with next-generation dielectric materials, can deliver scalable and sustainable solutions for semiconductor advanced packaging."
Building on the UV curable dielectric layer chemistry developed at Smartkem's R&D facility for thin film transistor fabrication, Smartkem has designed ink formulations suitable for use in advanced computer and AI chip packaging applications. These inks have been co-developed with Manz Asia to be compatible with its existing inkjet-based semiconductor production equipment.
Panel level packaging on rectangular wafers offers key advantages over traditional packaging on circular wafers, including:
- Higher throughput, as a larger print area means more chips can be packaged simultaneously;
- Lower cost per chip from economies of scale with use of printed circuit board like manufacturing equipment;
- Better material utilization from less edge loss compared to circular wafers; and
- Improved integration supported by complex fan-out wafer-level packaging at a larger scale.
About Smartkem
Smartkem is seeking to change the world of electronics with a new class of transistors developed using its proprietary advanced semiconductor materials. Our TRUFLEX® semiconductor polymers enable low temperature printing processes that are compatible with existing manufacturing infrastructure to deliver low-cost, high-performance displays. Our semiconductor platform can be used in a range of display technologies including MicroLED, LCD and AMOLED, as well as in applications in advanced computer and AI chip packaging, sensors, and logic.
Smartkem designs and develops its materials at its research and development facility in
The company has an extensive IP portfolio including 138 granted patents across 17 patent families, 16 pending patents and 40 codified trade secrets. For more information, visit our website or follow us on LinkedIn.
About Manz Asia
Manz Asia is a leading manufacturer of advanced semiconductor equipment, driving technological innovation and process excellence within the CoPoS (CoWoS panelization) technology framework for panel-level packaging.
We offer comprehensive equipment solutions encompassing wet chemistry, plating, digital printing, automation, and proprietary software integration for Redistribution Layer (RDL) process—from lab-scale to mass production. Our technologies support key applications in Fan-Out Panel-Level Packaging (FOPLP), Through Glass Via (TGV), and IC substrates, covering critical stages of semiconductor packaging.
By enhancing production efficiency, optimizing process quality, and strengthening market competitiveness, Manz Asia empowers the semiconductor industry to achieve higher standards of excellence.
For more information, please visit website or follow us on LinkedIn.
About SEMICON®
Forward-thinking semiconductor organizations are implementing practices to reduce the environmental impact of their businesses and manufacturing operations to ensure their resiliency when disruptive events such as geopolitical conflicts, climate-related disasters, and public health crises strike. Initiatives focused on reducing greenhouse gas emissions and water use, deploying renewable energy systems, and improving the energy efficiency of chipmaking equipment are growing in importance.
To thrive in the coming decade and beyond, companies must look beyond short-term performance and focus on building resilience to better withstand unpredictable disruptions to their businesses, the semiconductor industry and global economies. Visit the website for more information.
Forward-Looking Statements
All statements in this press release that are not historical are forward-looking statements, including, among other things, its market position and market opportunity, expectations and plans as to its product development, manufacturing and sales, and relations with its partners and investors. These statements are not historical facts but rather are based on Smartkem, Inc.'s current expectations, estimates, and projections regarding its business, operations and other similar or related factors. Words such as "may," "will," "could," "would," "should," "anticipate," "predict," "potential," "continue," "expect," "intend," "plan," "project," "believe," "estimate," and other similar or elated expressions are used to identify these forward-looking statements, although not all forward-looking statements contain these words. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties, and assumptions that are difficult or impossible to predict and, in some cases, beyond the Company's control. Actual results may differ materially from those in the forward-looking statements as a result of a number of factors, including those described in the Company's filings with the Securities and Exchange Commission. The Company undertakes no obligation to revise or update information in this release to reflect events or circumstances in the future, even if new information becomes available.
Industry Representatives and Media
Selena Kirkwood
Head of Communications for Smartkem
T: +44 (0) 7971 460 364
s.kirkwood@smartkem.com
Analysts and Investors
David Barnard, CFA
Alliance Advisors Investor Relations
T: 1 415 433 3777
dbarnard@allianceadvisors.com
[1] Yole Intelligence: Panel Level Packaging 2025 https://www.yolegroup.com/product/report/panel-level-packaging-2025/
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SOURCE Smartkem
FAQ
What is the projected market size for panel level packaging by 2030 according to Smartkem (SMTK)?
What are the main benefits of Smartkem's panel level packaging technology over traditional circular wafers?
What is the purpose of the collaboration between Smartkem (SMTK) and Manz Asia?
When and where will Manz Asia demonstrate Smartkem's dielectric materials?
