Amphenol and Semtech Introduce 1.6T Active Copper Cable at OFC 2025

Rhea-AI Summary

Amphenol and Semtech (SMTC) have unveiled their new 1.6T OSFP Active Copper Cable (ACC) product at OFC 2025, featuring Semtech's CopperEdge™ 224G/lane linear equalizer/redriver ICs. The innovation targets next-generation AI/ML and data center infrastructure needs.

The product offers significant advantages including:

• Ultra-low power consumption (90% lower than DSP-based solutions)
• Ultra-low latency (sub-100ps)
• Simple configuration and control

According to LightCounting analyst Bob Wheeler, 224G/lane data center infrastructure deployment is expected to begin in 2025, with rapid growth anticipated as AI/ML applications drive increased performance and interconnect bandwidth demands. The 1.6T OSFP ACC is now available from Amphenol.

Positive

• Partnership with industry leader Amphenol strengthens market position
• Product offers 90% lower power consumption compared to alternatives
• Targets growing AI/ML infrastructure market
• Immediate product availability indicates strong execution

Negative

• None.

Insights

Technology Infrastructure Analyst

Semtech's launch of a 1.6T Active Copper Cable solution with Amphenol represents a significant technological advancement targeting the explosive growth in AI/ML data center infrastructure. The timing is strategically aligned with market trends, as deployment of 224G/lane infrastructure is expected to begin in 2025 and accelerate thereafter.

What makes this product technically compelling is its substantial performance advantages over alternatives:

• Up to 90% lower power consumption than DSP-based solutions – a critical differentiator as data centers face mounting energy constraints
• Sub-100ps latency – essential for latency-sensitive AI workloads where microseconds matter
• Simplified configuration compliant with industry standards – reducing implementation barriers

The collaboration with Amphenol is particularly valuable, combining Semtech's semiconductor expertise with Amphenol's manufacturing scale and channel relationships. This addresses a pressing market need as AI infrastructure deployments create unprecedented demand for high-bandwidth, energy-efficient interconnects between compute clusters.

The immediate availability of the product positions Semtech to capture design wins as early adopters begin deploying next-generation infrastructure. While competing technologies like optical interconnects exist, the energy efficiency and latency advantages of Semtech's solution could drive meaningful adoption in rack-adjacent connections where copper solutions offer cost benefits without sacrificing performance.

Financial Analyst

This product launch strengthens Semtech's position in the high-growth data center infrastructure market at a crucial inflection point. As AI/ML workloads drive unprecedented demand for high-performance computing, the interconnect segment represents a substantial growth opportunity with deployment beginning in 2025.

The partnership with Amphenol is strategically significant, providing Semtech access to a tier-one manufacturer's established customer base and distribution channels. This dramatically improves go-to-market capabilities compared to selling semiconductor components independently.

From a competitive standpoint, the 90% power reduction compared to DSP-based alternatives creates a compelling value proposition as data center operators increasingly optimize for energy efficiency to control operational costs. This differentiation could potentially support premium pricing and favorable margins.

While the immediate revenue impact isn't quantified, this product addresses the expanding AI infrastructure market where spending continues to accelerate. By positioning at the leading edge of the 224G/lane transition, Semtech demonstrates commitment to diversifying beyond traditional markets and establishing presence in high-growth segments.

Investors should monitor future announcements regarding design wins with major cloud providers and AI infrastructure vendors as indicators of market traction. The product's immediate availability suggests revenue contribution could begin in late 2025 as early deployments commence, though meaningful impact will depend on adoption rates and competitive dynamics.

SAN FRANCISCO & CAMARILLO, Calif.--(BUSINESS WIRE)-- Amphenol, a global leader in high-performance interconnect solutions, and Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today introduced a leading-edge 1.6T OSFP Active Copper Cable (ACC) product featuring Semtech's CopperEdge™ 224G/lane linear equalizer/redriver ICs, targeted for use in next-generation AI/ML and data center infrastructure.

Amphenol and Semtech Introduce 1.6T Active Copper Cable at OFC 2025 Forum

The explosion of data center deployments to support new AI/ML applications and workloads is driving requirements for ever higher-bandwidth interconnect solutions between compute and storage resources in clusters. Amphenol’s 1.6T OSFP ACC with Semtech's CopperEdge technology is designed for use with leading-edge 200G/lane switches and xPUs, and provides the extended reach required to connect adjacent equipment racks with high performance and reliability.

“We expect deployment of 224G/lane data center infrastructure starting in 2025 and ramping rapidly over the coming years, as AI/ML applications continue to push the envelope on performance and interconnect bandwidth,” commented Bob Wheeler, analyst at large, LightCounting. “We see 1.6T active copper cables (ACCs) as a key tool to support these higher interconnect speeds at manageable power consumption and cost.”

Compared to alternative approaches, the 1.6T OSFP ACC provides

• Ultra-low power consumption (up to 90% lower than DSP-based solutions), significantly reducing thermal design constraints and energy cost
• Ultra-low latency (sub-100ps) for demanding AI/ML workloads
• Simple configuration and control, compliant with auto-negotiation and link training, for easier management and link bring up

“We’re excited to collaborate with Semtech on this 1.6T interconnect innovation,” said Greg Walz, director of product marketing for high-speed I/O Cables at Amphenol. “The 1.6T ACC is a key addition to our industry-leading interconnect portfolio for leading-edge data center customers interested in high-performance, low power solutions.”

“The combination of Amphenol’s world-class cable technology and manufacturing scale with Semtech’s advanced semiconductor capability creates a powerful customer offering,” added Brian Bentham, data center market manager at Semtech. “Together, we are delivering technology that is helping deliver the reliable, high-bandwidth, low-power connectivity enabling next-generation AI/ML infrastructure.”

The 1.6T OSFP Active Copper Cable is available now from Amphenol – please visit Amphenol’s booth #2718 and Semtech’s booth #1028 at OFC 2025 for more information.

About Amphenol

Amphenol Corporation is one of the world’s largest designers, manufacturers and marketers of electrical, electronic and fiber optic connectors and interconnect systems, antennas, sensors and sensor-based products and coaxial and high-speed specialty cable. Amphenol designs, manufactures and assembles its products at facilities in approximately 40 countries around the world and sells its products through its own global sales force, independent representatives and a global network of electronics distributors. Amphenol has a diversified presence as a leader in high-growth areas of the interconnect market including: Automotive, Commercial Aerospace, Communications Networks, Defense, Industrial, Information Technology and Data Communications and Mobile Devices. For more information, visit www.amphenol.com.

About Semtech

Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions dedicated to delivering high-quality technology that enables a smarter, more connected, and sustainable planet. Our global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more about Semtech technology, visit us at Semtech.com or follow us on LinkedIn or X.

Semtech and the Semtech logo, are registered trademarks or service marks of Semtech Corporation or its subsidiaries, and CopperEdge is a trademark or service mark of Semtech Corporation or its subsidiaries. All other trademarks and trade names mentioned may be marks and names of their respective companies.

SMTC-P

View source version on businesswire.com: https://www.businesswire.com/news/home/20250401302832/en/

Michelle Lozada, pr@semtech.com

Source: Semtech Corporation

FAQ

What are the key features of Semtech's (SMTC) new 1.6T Active Copper Cable?

The 1.6T ACC features 90% lower power consumption than DSP solutions, sub-100ps latency, and simple configuration compliant with auto-negotiation and link training.

When will Semtech's (SMTC) 224G/lane data center infrastructure deployment begin?

According to LightCounting analyst, deployment will start in 2025 with rapid scaling expected in subsequent years.

How does Semtech's (SMTC) 1.6T ACC benefit AI/ML applications?

It provides high-bandwidth interconnect solutions with ultra-low latency for demanding AI/ML workloads, while maintaining low power consumption.

What market demand is driving Semtech's (SMTC) 1.6T ACC development?

The explosion of data center deployments supporting AI/ML applications is driving demand for higher-bandwidth interconnect solutions between compute and storage resources.