Supermicro Previews New Max Performance Intel-based X14 Servers for AI, HPC, and Critical Enterprise Workloads
Supermicro is previewing new X14 server platforms designed for AI, HPC, and critical enterprise workloads. These systems feature significant upgrades, including support for 256 performance cores in a single node, MRDIMMs at 8800MT/s, and compatibility with next-generation GPUs. The new platforms offer unprecedented performance and advanced features, with Supermicro ready to deliver high-performance solutions at rack-scale with comprehensive direct-to-chip liquid cooling and total rack integration services. The company has a global manufacturing capacity of up to 5,000 racks per month, including 1,350 liquid-cooled racks.
Supermicro sta presentando nuove piattaforme server X14 progettate per AI, HPC e carichi di lavoro aziendali critici. Questi sistemi presentano aggiornamenti significativi, inclusa la compatibilità con 256 core di prestazione in un singolo nodo, MRDIMMs a 8800MT/s, e compatibilità con GPU di nuova generazione. Le nuove piattaforme offrono prestazioni senza precedenti e funzionalità avanzate, con Supermicro pronta a fornire soluzioni ad alte prestazioni su rack con un raffreddamento a liquido diretto al chip e servizi di integrazione totale del rack. L'azienda ha una capacità di produzione globale di fino a 5.000 rack al mese, inclusi 1.350 rack raffreddati a liquido.
Supermicro está presentando nuevas plataformas de servidor X14 diseñadas para AI, HPC y cargas de trabajo empresariales críticas. Estos sistemas cuentan con mejoras significativas, como el soporte para 256 núcleos de rendimiento en un solo nodo, MRDIMMs a 8800MT/s, y compatibilidad con GPUs de próxima generación. Las nuevas plataformas ofrecen un rendimiento sin precedentes y funciones avanzadas, con Supermicro lista para entregar soluciones de alto rendimiento a nivel de rack con enfriamiento líquido directo al chip y servicios de integración total de racks. La compañía tiene una capacidad de producción global de hasta 5,000 racks por mes, incluidos 1,350 racks enfriados por líquido.
슈퍼마이크로가 AI, HPC 및 주요 기업 작업 부하를 위해 설계된 새로운 X14 서버 플랫폼을 미리 공개하고 있습니다. 이 시스템들은 단일 노드에 256 성능 코어를 지원하는 것을 포함하여, 8800MT/s의 MRDIMM 및 차세대 GPU와의 호환성 등 상당한 업그레이드를 특징으로 합니다. 새로운 플랫폼은 전례 없는 성능과 고급 기능을 제공하며, 슈퍼마이크로는 랙 스케일에서의 고성능 솔루션을 제공할 준비가 되어 있으며, 칩에 직접 연결된 액체 냉각 및 총괄적인 랙 통합 서비스를 갖추고 있습니다. 이 회사는 월 최대 5,000개의 랙 생산 능력을 보유하고 있으며, 그 중 1,350개는 액체 냉각 랙입니다.
Supermicro présente de nouvelles plateformes de serveur X14 conçues pour l'IA, le HPC et les charges de travail critiques d'entreprise. Ces systèmes comportent des améliorations significatives, notamment un support pour 256 cœurs de performance dans un seul nœud, MRDIMMs à 8800MT/s, et une compatibilité avec des GPU de nouvelle génération. Les nouvelles plateformes offrent une performance sans précédent et des fonctionnalités avancées, Supermicro étant prêt à fournir des solutions haute performance à l'échelle des racks avec un refroidissement liquide direct sur puce et des services d'intégration totale des racks. L'entreprise dispose d'une capacité de fabrication mondiale allant jusqu'à 5 000 racks par mois, dont 1 350 racks refroidis par liquide.
Supermicro präsentiert neue X14-Serverplattformen, die für KI, HPC und kritische Unternehmenslasten entwickelt wurden. Diese Systeme verfügen über bedeutende Verbesserungen, darunter die Unterstützung von 256 Leistungs-Kernen in einem einzigen Knoten, MRDIMMs mit 8800MT/s und die Kompatibilität mit Next-Generation-GPUs. Die neuen Plattformen bieten unvergleichliche Leistung und fortschrittliche Funktionen, wobei Supermicro bereit ist, leistungsstarke Lösungen im Rack-Maßstab mit umfassender direkter Chip-Flüssigkeitskühlung und vollständigen Rack-Integrationsdiensten bereitzustellen. Das Unternehmen hat eine globale Produktionskapazität von bis zu 5.000 Racks pro Monat, darunter 1.350 flüssigkeitsgekühlte Racks.
- Introduction of new X14 server platforms with significant performance upgrades
- Support for 256 performance cores in a single node
- Compatibility with next-generation SXM, OAM, and PCIe GPUs
- Global manufacturing capacity of up to 5,000 racks per month
- Comprehensive direct-to-chip liquid cooling solutions
- New 10U and multi-node form factors for increased GPU and CPU densities
- Upgraded memory performance with 12 memory channels per CPU and MRDIMMs up to 8800MT/s
- Expanded product portfolio with more than ten new systems
- None.
Insights
Supermicro's preview of their new X14 servers represents a significant leap in high-performance computing technology. The support for up to 256 performance cores in a single node is a game-changer for compute-intensive tasks. This, coupled with MRDIMM support at 8800MT/s, could drastically reduce processing times for AI training and complex data analytics.
The compatibility with next-generation SXM, OAM and PCIe GPUs positions these servers at the forefront of AI acceleration. The direct-to-chip liquid cooling is particularly noteworthy, as it allows for higher power densities and improved energy efficiency. This could translate to substantial cost savings for data centers running AI workloads at scale.
However, the true impact will depend on real-world performance benchmarks and pricing, which are yet to be revealed. Potential adopters should also consider the integration challenges with existing infrastructure and the learning curve for new technologies like CXL 2.0.
Supermicro's strategic move to preview these advanced servers could significantly boost its market position. The company's ability to deliver 5,000 racks per month, including 1,350 liquid-cooled racks, demonstrates impressive manufacturing capacity. This scalability could translate into substantial revenue growth, especially if demand for AI infrastructure continues to surge.
The Early Ship Program and JumpStart remote testing initiatives are smart moves to capture early adopters and potentially lock in large orders. However, investors should watch for the capital expenditure required to ramp up production and any potential supply chain constraints for cutting-edge components.
While the news is positive, the financial impact remains speculative until we see concrete orders and revenue figures. The company's ability to maintain margins while delivering these advanced systems will be important for profitability.
Supermicro's new X14 servers are poised to capitalize on the booming AI and HPC markets. The workload-specific categories (GPU-optimized, high compute-density multi-nodes and Hyper rackmounts) demonstrate a nuanced understanding of diverse market needs. This targeted approach could help Supermicro capture market share across various segments.
The compatibility with both Intel Xeon 6900 series processors with P-cores and E-cores offers flexibility that could appeal to a wide range of customers, from those prioritizing performance to those focused on energy efficiency. This adaptability could be a key differentiator in a competitive market.
However, the success of these servers will depend on how they stack up against offerings from major competitors like Dell, HPE and Lenovo. Supermicro will need to leverage its agility and customization capabilities to stand out in a market where brand loyalty and established relationships play significant roles.
A Complete Architecture Upgrade that Includes New Performance-Optimized CPUs, Next-Generation GPU support, Upgraded Memory MRDIMMs, 400GbE Networking, New Storage Options Including E1.S and E3.S drives, and Direct-to-Chip Liquid Cooling, based on the Upcoming Intel® Xeon® 6900 Series Processors with P-Cores (formerly codenamed Granite Rapids-AP) Supporting Demanding Workloads
"We continue to add to our already comprehensive Data Center Building Block solutions with these new platforms, which will offer unprecedented performance, and new advanced features," said Charles Liang, president and CEO of Supermicro. "Supermicro is ready to deliver these high-performance solutions at rack-scale with the industry's most comprehensive direct-to-chip liquid cooled, total rack integration services, and a global manufacturing capacity of up to 5,000 racks per month including 1,350 liquid cooled racks. With our worldwide manufacturing capabilities, we can deliver fully optimized solutions which accelerate our time-to-delivery like never before, while also reducing TCO."
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These new X14 systems feature completely re-designed architectures including new 10U and multi-node form factors to enable support for next-generation GPUs and higher CPU densities, updated memory slot configurations with 12 memory channels per CPU and new MRDIMMs which provide up to
The new additions to the Supermicro X14 family comprise more than ten new systems, several of which are completely new architectures in three distinct, workload-specific categories:
- GPU-optimized platforms designed for pure performance and enhanced thermal capacity to support the highest-wattage GPUs. System architectures have been built from the ground up for large-scale AI training, LLMs, generative AI, 3D media, and virtualization applications.
- High compute-density multi-nodes including SuperBlade® and the all-new FlexTwin™, which leverage direct-to-chip liquid cooling to significantly increase the number of performance cores in a standard rack compared to previous generations of systems.
- Market-proven Hyper rackmounts combine single or dual socket architectures with flexible I/O and storage configurations in traditional form factors to help enterprises and data centers scale up and out as their workloads evolve.
Supermicro X14 performance-optimized systems will support the soon-to-be-released Intel® Xeon® 6900 series processors with P-cores and will also offer socket compatibility to support Intel Xeon 6900 series processors with E-cores in Q1'25. This designed-in feature allows workload-optimized systems for either performance-per-core or performance-per-watt.
"The new Intel Xeon 6900 series processors with P-cores are our most powerful ever, with more cores and exceptional memory bandwidth & I/O to achieve new degrees of performance for AI and compute-intensive workloads," said Ryan Tabrah, VP and GM of Xeon 6 at Intel. "Our continued partnership with Supermicro will result in some of the industry's most powerful systems that are ready to meet the ever-heightening demands of modern AI and high-performance computing."
When configured with Intel Xeon 6900 series processors with P-cores, Supermicro systems support new FP16 instructions on the built-in Intel® AMX accelerator to further enhance AI workload performance. These systems include 12 memory channels per CPU with support for both DDR5-6400 and MRDIMMs up to 8800MT/s, CXL 2.0, and feature more extensive support for high-density, industry-standard EDSFF E1.S and E3.S NVMe drives.
Supermicro Liquid Cooling Solutions
Complementing this expanded X14 product portfolio are Supermicro's rack-scale integration and liquid cooling capabilities. With an industry-leading global manufacturing capacity, extensive rack-scale integration and testing facilities, and a comprehensive suite of management software solutions, Supermicro designs, builds, tests, validates, and delivers complete solutions at any scale in a matter of weeks.
In addition, Supermicro offers a complete in-house developed liquid cooling solution including cold plates for CPUs, GPUs and memory, Cooling Distribution Units, Cooling Distribution Manifolds, hoses, connectors, and cooling towers. Liquid cooling can be easily included in rack-level integrations to further increase system efficiency, reduce instances of thermal throttling, and lower both the TCO and Total Cost to Environment (TCE) of data center deployments.
Upcoming Supermicro X14 performance-optimized systems include:
GPU-optimized – The highest performance Supermicro X14 systems designed for large-scale AI training, large language models (LLMs), generative AI and HPC, and supporting eight of the latest-generation SXM5 and SXM6 GPUs. These systems are available in air-cooled or liquid-cooled configurations.
PCIe GPU – Designed for maximum GPU flexibility, supporting up to 10 double-width PCIe 5.0 accelerator cards in a thermally-optimized 5U chassis. These servers are ideal for media, collaborative design, simulation, cloud gaming, and virtualization workloads.
Intel® Gaudi® 3 AI Accelerators – Supermicro also plans to deliver the industry's first AI server based on the Intel Gaudi 3 accelerator hosted by Intel Xeon 6 processors. The system is expected to increase efficiency and lower the cost of large-scale AI model training and AI inferencing. The system features eight Intel Gaudi 3 accelerators on an OAM universal baseboard, six integrated OSFP ports for cost-effective scale-out networking, and an open platform designed to use a community-based, open-source software stack, requiring no software licensing costs.
SuperBlade® - Supermicro's X14 6U high-performance, density-optimized, and energy-efficient SuperBlade maximizes rack density, with up to 100 servers and 200 GPUs per rack. Optimized for AI, HPC, and other compute-intensive workloads, each node features air cooling or direct-to-chip liquid cooling to maximize efficiency and achieve the lowest PUE with the best TCO, as well as connectivity up to four integrated Ethernet switches with 100G uplinks and front I/O supporting a range of flexible networking options up to 400G InfiniBand or 400G Ethernet per node.
FlexTwin™ - The new Supermicro X14 FlexTwin architecture is designed to provide maximum compute power and density in a multi-node configuration with up to 24,576 performance cores in a 48U rack. Optimized for HPC and other compute-intensive workloads, each node features direct-to-chip liquid cooling only to maximize efficiency and reduce instances of CPU thermal throttling, as well as HPC Low Latency front and rear I/O supporting a range of flexible networking options up to 400G per node.
Hyper - X14 Hyper is Supermicro's flagship rackmount platform designed to deliver the highest performance for demanding AI, HPC, and enterprise applications, with single or dual socket configurations supporting double-width PCIe GPUs for maximum workload acceleration. Both air cooling and direct-to-chip liquid cooling models are available to facilitate the support of top-bin CPUs without thermal limitations and reduce data center cooling costs while also increasing efficiency.
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