Media Alert: Rambus Leads Panel on “Frontiers in Memory Innovation” at the AI Hardware Summit
Rambus Inc. (NASDAQ: RMBS) will participate in the AI Hardware Summit from September 13-15, 2022, at Booth #123 in Santa Clara, CA. Dr. Steven Woo will lead a panel on memory innovation, focusing on new system architectures to enhance AI/ML performance. The panel will discuss advances in technologies like CXL and HBM that improve data throughput, which is crucial for future processors. For more information, visit rambus.com/event/ai-hardware-summit/.
- Participation in the AI Hardware Summit highlights Rambus's commitment to leading advancements in AI and memory technology.
- Dr. Steven Woo's panel may enhance visibility in the tech community, potentially attracting new partnerships and clients.
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To learn more about the panel that Woo will lead at the AI Hardware Summit, visit https://www.rambus.com/event/ai-hardware-summit/. For more details on the latest Rambus high-speed memory and SerDes PHY solutions, as well as security IP solutions, visit rambus.com.
Follow Rambus:
Company website: rambus.com
Rambus blog: rambus.com/blog
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc
About
Rambus is a provider of industry-leading chips and silicon IP making data faster and safer. With over 30 years of advanced semiconductor experience, we are a pioneer in high-performance memory subsystems that solve the bottleneck between memory and processing for data-intensive systems. Whether in the cloud, at the edge or in your hand, real-time and immersive applications depend on data throughput and integrity. Rambus products and innovations deliver the increased bandwidth, capacity and security required to meet the world's data needs and drive ever-greater end-user experiences. For more information, visit rambus.com.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220912005021/en/
t: (650) 309-6226
cpasinetti@rambus.com
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