Ranpak to Showcase Innovations in Automation Solutions and Sustainable Packaging at Upcoming PACK EXPO International

Rhea-AI Summary

Ranpak Holdings Corp (NYSE: PACK) will showcase its latest automated packaging solutions at PACK EXPO International 2022, taking place in Chicago from October 23-26. This year marks Ranpak’s 50th anniversary and the company's return to in-person exhibitions. Key innovations include the Cut’it!™ EVO, Pad’it!® cushioning solution, and AutoFill™ packaging system. The event emphasizes Ranpak's commitment to sustainable packaging and automation, aimed at reducing operational costs and environmental impact.

Positive

• Showcasing new automated packaging solutions at a major industry event.
• Innovations targeting cost reduction and sustainability in packaging.
• 50th anniversary highlights the company's longevity and market experience.

Negative

• None.

Following recent, successful global technology launches, Ranpak to demo advanced automated packaging solutions in-person

CONCORD TOWNSHIP, Ohio--(BUSINESS WIRE)-- Ranpak Holdings Corp. (“Ranpak”) (NYSE: PACK), a global leader of environmentally sustainable, paper-based packaging solutions for e-commerce and industrial supply chains, today announced its plan to showcase its latest innovations in automation solutions and sustainable packaging to customers, partners and media at PACK EXPO International 2022, taking place from October 23-26 in Chicago.

This year marks both Ranpak’s 50^th anniversary as well as the company’s return to exhibiting in-person at the show since the onset of the COVID pandemic. Ranpak’s presence at the EXPO will highlight its strategic investments in innovative automated packaging solutions to help customers lower costs, make logistics easier, and support the global shift to sustainable packaging.

Recent highlights of the company’s enhanced automation portfolio will be on demonstration including recently-launched solutions:

• The next generation Cut’it!™ EVO solution, an in-line packing machine that enables customers to accelerate their packaging output, reduce operating costs, and improve the sustainability profile of their operations.
• The Pad’it!® protective box-liner cushioning solution that protects fragile products.
• The AutoFill™ high-speed end of line packaging solution, the solution of choice for distribution centers worldwide.

Ranpak invites PACK EXPO International attendees to visit Booth #22051 in the West Building to experience the company’s next-generation automation solutions and learn more about Ranpak’s newly launched technology solutions including Void Fill, Cushioning, Wrapping, and Cold Chain. Appointments are also available with Ranpak’s packaging experts at specified times for 1:1 consultations to discuss customers’ challenges.

“We are excited to make our return back to PACK EXPO to showcase our latest innovations in automation solutions and sustainable packaging,” said Omar Asali, Chief Executive Officer of Ranpak. “We look forward to hosting visitors at the Ranpak booth for them to experience first-hand how our suite of technology solutions improve supply chain performance and costs, reduce environmental impact, and support a variety of growing business needs globally.”

For additional information about Ranpak’s presence at PACK EXPO International, please visit: https://www.ranpak.com/pack-expo/

About Ranpak

Founded in 1972, Ranpak's goal was to create the first environmentally responsible system to protect products during shipment. Ranpak’s mission is to deliver sustainable packaging solutions that help improve supply chain performance and costs, reduce environmental impact, and support a variety of growing business needs globally. The development and improvement of materials, systems and total solution concepts have earned Ranpak a reputation as an innovative leader in e-commerce and industrial supply chain solutions. Ranpak is headquartered in Concord Township, Ohio and has approximately 850 employees. Additional information about Ranpak can be found on its website: https://www.ranpak.com.

View source version on businesswire.com: https://www.businesswire.com/news/home/20221011005427/en/

Investor Inquiries:

Bill Drew

ir@ranpak.com

US Media Inquiries:

Cory Ziskind

ICR 646-277-1232

Cory.Ziskind@icrinc.com

EMEA Media Inquiries:

Monika Dürr

duomedia

+49(0)6104 944895

monika.d@duomedia.com

Source: Ranpak Holdings Corp.

FAQ

What will Ranpak showcase at PACK EXPO International 2022?

Ranpak will showcase its latest automated packaging solutions aimed at enhancing sustainability and reducing costs.

When is PACK EXPO International 2022?

PACK EXPO International 2022 will take place from October 23-26 in Chicago.

What is the significance of Ranpak's 50th anniversary?

Ranpak's 50th anniversary marks its long-standing experience and commitment to innovative packaging solutions.

Which new products will Ranpak unveil at the event?

Ranpak will unveil products like Cut’it!™ EVO, Pad’it!®, and AutoFill™ during the event.