Odyssey Semiconductor Technologies Announces Final Dissolution Date
Odyssey Semiconductor Technologies (OTC:ODII) has announced its final dissolution timeline following the sale of its assets to Power Integration, Inc. on July 1, 2024. The company plans to set August 19, 2024 as the Final Record Date for dissolution, subject to FINRA processing. On this date, Odyssey will file for dissolution in Delaware and cease operations. FINRA is expected to remove ODII from the OTC Expert Market around this time.
Following dissolution, Odyssey will follow Delaware law procedures to address claims and determine security for potential liabilities. The company currently has $1,673,804 in its bank account with known liabilities of about $150,000. A liquidating cash distribution to shareholders is planned between March and June 2025, but the amount and timing are uncertain due to potential claims and court proceedings.
Odyssey Semiconductor Technologies (OTC:ODII) ha annunciato il suo calendario finale di scioglimento dopo la vendita dei suoi beni a Power Integration, Inc. il 1 luglio 2024. L'azienda prevede di stabilire il 19 agosto 2024 come data di registrazione finale per lo scioglimento, soggetto all'elaborazione di FINRA. In questa data, Odyssey presenterà domanda di scioglimento nel Delaware e cesserà le operazioni. Si prevede che FINRA rimuoverà ODII dal mercato OTC Expert intorno a questo periodo.
Successivamente allo scioglimento, Odyssey seguirà le procedure della legge del Delaware per affrontare le richieste e determinare la garanzia per eventuali passività. Attualmente, l'azienda ha $1.673.804 nel suo conto bancario con passività conosciute di circa $150.000. È previsto un pagamento in contante ai soci tra marzo e giugno 2025, ma l'importo e il momento sono incerti a causa di possibili richieste e procedimenti giudiziari.
Odyssey Semiconductor Technologies (OTC:ODII) ha anunciado su cronograma final de disolución tras la venta de sus activos a Power Integration, Inc. el 1 de julio de 2024. La compañía planea establecer el 19 de agosto de 2024 como la Fecha Final de Registro para la disolución, sujeto al procesamiento de FINRA. En esta fecha, Odyssey presentará la solicitud de disolución en Delaware y cesará sus operaciones. Se espera que FINRA elimine a ODII del Mercado OTC Expert alrededor de este tiempo.
Después de la disolución, Odyssey seguirá los procedimientos de ley de Delaware para abordar reclamaciones y determinar la garantía para posibles responsabilidades. Actualmente, la empresa tiene $1,673,804 en su cuenta bancaria con responsabilidades conocidas de alrededor de $150,000. Se planea una distribución de efectivo liquidante a los accionistas entre marzo y junio de 2025, pero la cantidad y el momento son inciertos debido a posibles reclamaciones y procesos judiciales.
오디세이 반도체 기술(Odyssey Semiconductor Technologies, OTC:ODII)는 2024년 7월 1일 파워 인티그레이션(Power Integration, Inc.)에 자산을 매각한 이후의 최종 해산 일정을 발표했습니다. 회사는 해산을 위한 최종 기록 날짜를 2024년 8월 19일로 설정할 계획이며, 이는 FINRA 처리에 따라 달라질 수 있습니다. 이 날짜에 오디세이는 델라웨어에서 해산을 신청하고 운영을 중단할 것입니다. FINRA는 이 시기에 ODII를 OTC 전문 시장에서 제거할 것으로 예상됩니다.
해산 이후, 오디세이는 델라웨어 법률 절차에 따라 청구 사항을 처리하고 잠재적 책임에 대한 보증을 결정합니다. 현재 회사는 약 $1,673,804의 자금을 보유하고 있으며, 알려진 부채는 약 $150,000입니다. 주주에 대한 청산 현금 배분은 2025년 3월과 6월 사이에 계획되어 있으나, 청구 가능성과 법적 절차로 인해 금액과 시점이 불확실합니다.
Odyssey Semiconductor Technologies (OTC:ODII) a annoncé son calendrier final de dissolution suite à la vente de ses actifs à Power Integration, Inc. le 1er juillet 2024. L'entreprise prévoit de fixer le 19 août 2024 comme date d'enregistrement finale pour la dissolution, sous réserve du traitement par FINRA. À cette date, Odyssey déposera une demande de dissolution dans le Delaware et cessera ses opérations. On s'attend à ce que FINRA retire ODII du marché OTC Expert autour de cette période.
Après la dissolution, Odyssey suivra les procédures juridiques du Delaware pour traiter les réclamations et déterminer la garantie pour les passifs potentiels. Actuellement, l'entreprise dispose de $1,673,804 sur son compte bancaire, avec des passifs connus d'environ $150,000. Une distribution de liquidités aux actionnaires est prévue entre mars et juin 2025, mais le montant et le calendrier restent incertains en raison de réclamations possibles et de procédures judiciaires.
Odyssey Semiconductor Technologies (OTC:ODII) hat seinen endgültigen Zeitplan für die Auflösung nach dem Verkauf seiner Vermögenswerte an Power Integration, Inc. am 1. Juli 2024 bekannt gegeben. Das Unternehmen plant, den 19. August 2024 als endgültiges Stichtagsdatum für die Auflösung festzulegen, vorbehaltlich der Bearbeitung durch FINRA. An diesem Datum wird Odyssey die Auflösung im Bundesstaat Delaware beantragen und den Betrieb einstellen. Es wird erwartet, dass FINRA ODII zu diesem Zeitpunkt vom OTC Expert Market entfernt.
Nach der Auflösung wird Odyssey die gesetzlichen Verfahren in Delaware befolgen, um Ansprüche zu bearbeiten und eine Sicherheitenbewertung für potenzielle Verbindlichkeiten vorzunehmen. Das Unternehmen hat derzeit $1.673.804 auf seinem Bankkonto mit bekannten Verbindlichkeiten von etwa $150.000. Eine Auszahlung in bar an die Aktionäre ist für den Zeitraum von März bis Juni 2025 geplant, aber der Betrag und der Zeitpunkt sind aufgrund potenzieller Ansprüche und Gerichtsverfahren ungewiss.
- Sale of substantially all assets to Power Integration, Inc. completed on July 1, 2024
- Company has approximately $1,673,804 in its bank account as of July 31, 2024
- Known liabilities and planned expenditures are only about $150,000
- Company is ceasing all business operations and dissolving
- ODII stock will be delisted from the OTC Expert Market
- Uncertain amount and timing of liquidating cash distribution to shareholders
- Potential for delays or reduced distribution due to creditor claims or court-required security postings
ITHACA, NY / ACCESSWIRE / July 31, 2024 / Odyssey Semiconductor Technologies, Inc. (OTC:ODII) ( "Odyssey" or the "Company"), today announced updated timelines for its plan to complete its dissolution and liquidation pursuant to its Plan of Dissolution, as approved by the stockholders at a special meeting (the "Special Meeting") on June 3, 2024, following the closing of the sale of substantially all of its asset to Power Integration, Inc. on July 1, 2024. Following the completion of relevant statutory and regulatory procedures, the Company also intends declare a liquidating cash distribution, subject to payments of any claims and obligations of the Company.
Dissolution Timeline
As required by Rule 6490 of the Uniform Practice Code of the Financial Industry Regulatory Authority (FINRA), the Company shall notify FINRA at least 10 days before the effective date of a corporate action.
The Company intends to set August 19, 2024 (or such later date that FINRA completes processing of our corporate action) as the final record date (the "Final Record Date") for its dissolution and intends to promptly notify FINRA within this week. Under the proposed timeline, we shall file the certificate of dissolution with the State of Delaware on the Final Record Date. Following the processing of the corporate action by FINRA on or around the Final Record Date, we expect that FINRA shall remove the quotation of our common stock on the OTC Expert Market. We will also close our stock transfer book on the Final Record Date, meaning that the recording of transfers of our common stock shall be discontinued. Thereafter, certificates representing shares of our common stock will not be assignable or transferable on our books except by will, intestate succession or operation of law, and we will not issue any new stock certificates.
Immediately after the Final Record Date, as provided under the Plan of Dissolution, the Company shall cease business operations immediately and the Board intends to follow the procedures set forth under Sections 280 and 281(a) of the Delaware General Corporation Law (DGCL) to complete the liquidation process. Under Delaware law, following the Final Record Date, we shall mail a notice of dissolution to known claimants and holders of contingent contractual claims of the Company, if any, and publish in a major newspaper in Ithaca, New York, and New Castle County, Delaware, respectively, for two consecutive weeks, to provide notice to any other potential claimants to present any claims within a 60-day window, after which the Company shall have up to 90 days to accept or reject any claims received during the period. After all known and presented claims are properly accepted or rejected, the Company shall pay such uncontested, fixed claims or obligations to such parties or as may be agreed upon between the Company and the claimant, file an action in the Delaware Court of Chancery for the court to determine an amount of security that the Company shall be required to set aside for any potential claims that may arise.
Liquidating Cash Distribution
Following this process, we are required to wait a minimum of 150 days after the date of last rejection to initiate any distribution of a dividend to shareholders. Following this process, to the extent that any assets remain, the Company intends to declare a liquidating cash distribution.
As of July 31, 2024, the Company has approximately
In addition, based on the Company estimate, the Company is expected to distribute the liquidating cash distribution between March and June 2025. However, we are currently unable to predict the precise timing of any such liquidating distributions or whether any liquidating distributions will occur at all. The timing of any such liquidating distributions will depend on and could be delayed by, among other things including by claim settlements with any creditors and the amount of any security required to be posted by the Delaware Court of Chancery. Additionally, any creditor could seek to require the posting of security, or larger security, for the payment of any contingent or unliquidated claims that may exist as of the time of dissolution. Any action of this type could delay or substantially diminish the amount available for such distribution to our stockholders.
Pursuant to Delaware law, the Company will continue to exist for three years after the dissolution or for such longer period as the Delaware Court of Chancery shall direct, or as may be required to resolve any pending claim or litigation matters, for the purpose of prosecuting and defending suits against us and enabling us to gradually close our business, to dispose of the Company's assets, to discharge our liabilities (including posting of any security), and to distribute any remaining assets to stockholders the company.
As provided by the Plan of Dissolution, the Board may at any time turn management of the dissolution process over to a third party to complete the liquidation of our remaining assets and distribute the available proceeds to our stockholders. In addition, a number of our directors may resign from the Odyssey Board prior to or in connection with the filing of the Certificate of Dissolution. If management is turned over to a third party and all of our directors resign from the Odyssey Board, the third party would have sole control over the liquidation process, including the sale or distribution of any remaining assets.
About Odyssey Semiconductor Technologies, Inc.
Odyssey Semiconductor Technologies, Inc. was a semiconductor device company developing innovative high-voltage power switching components based on proprietary gallium nitride ("GaN") processing technology. The company recently completed the sale of substantially all of its assets to Power Integration, Inc., ("Power Integration") on July 1, 2024.
Forward-Looking Statements
Statements in this press release that are not descriptions of historical facts are forward-looking statements within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, but are not limited to, statements about our plans, objectives, forecasts, representations and contentions and are not historical facts and typically are identified by use of terms such as "may," "will," "should," "could," "expect," "plan," "forecast", "anticipate," "believe," "estimate," "predict," "potential," "continue" and similar words, although some forward-looking statements are expressed differently. These forward-looking statements are based on management's current expectations and assumptions and are subject to risks and uncertainties described more fully in the Company's filings on Forms 10-K and 10-Q and other periodic filings with the Securities and Exchange Commission. Factors that could cause actual results to differ materially from those currently anticipated include, without limitation, risks relating to the results of our research and development activities, including uncertainties relating to semiconductor process manufacturing; the early stage of our GaN-based technology presently under development; our ability to protect our intellectual property rights that are valuable to our business, including patent and other intellectual property rights; our ability to successfully market and sell our technologies; the ability to achieve high volume manufacturing and the size and growth of the potential markets for any of our technologies, the rate and degree of market acceptance of any of our technologies and our ability to raise funding to support operations and the continued development and qualification of our technology.
In light of these risks, uncertainties and assumptions, the forward-looking statements regarding future events and circumstances discussed in this press release may not occur, and actual results could differ materially and adversely from those anticipated or implied in the forward-looking statements. You should not rely upon forward-looking statements as predictions of future events. The forward-looking statements included herein speak only as of the date hereof, and we undertake no obligation to update publicly or privately any forward-looking statements for any reason after the date of this release to conform these statements to actual results or to changes in our expectations.
Important Additional Information and Where to Find It
This press release is being issued in connection with the approval by the Company's Shareholders of the Asset Sale and liquidating distribution of the Company at a meeting of the Shareholders held on June 3, 2024. A copy of this Press Release will be filed with the Securities Exchange Commission as an exhibit to a Current Report on Form 8-K, copies of which may be obtained free of charge at www.sec.gov.
Contact
Rick Brown, CEO
Rick.Brown@odysseysemi.com
607-351-9768
SOURCE: Odyssey Semiconductor Technologies, Inc.
View the original press release on accesswire.com
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