NXP Combines Ultra-Wideband Secure Ranging and Short-Range Radar to Enable Autonomous Industrial and IoT Applications
NXP Semiconductors has unveiled the Trimension SR250, the industry's first single-chip solution integrating on-chip processing with short-range UWB radar and secure ranging. This innovative product enables new user experiences in autonomous homes and Industrial IoT applications, focusing on location, presence, and motion detection. The SR250 combines low-power short-range UWB radar (6-8.5 GHz), secure ranging, and angle-of-arrival calculations to support various use cases in smart homes and industrial environments.
Key features include 3D AoA, TDOA, and ToF readings accurate to within ±5 cm. The chip can be paired with the EdgeLock SE051W secure element for enhanced security. Developed based on FiRa Consortium 3.0 specifications, it ensures interoperability and simplifies certification. The SR250 is supported by firmware, middleware, and sample applications to streamline development and deployment.
NXP Semiconductors ha presentato il Trimension SR250, la prima soluzione monopezzo del settore che integra il processamento on-chip con radar UWB a corto raggio e misurazioni sicure. Questo prodotto innovativo permette nuove esperienze utente nelle applicazioni di case autonome e IoT industriale, focalizzandosi su rilevamento della posizione, presenza e movimento. L'SR250 combina radar UWB a corto raggio a bassa potenza (6-8,5 GHz), misurazioni sicure e calcoli dell'angolo di arrivo per supportare vari casi d'uso in ambienti domestici intelligenti e industriali.
Le caratteristiche chiave includono letture di 3D AoA, TDOA e ToF accurate entro ±5 cm. Il chip può essere abbinato all'elemento sicuro EdgeLock SE051W per una maggiore sicurezza. Sviluppato secondo le specifiche FiRa Consortium 3.0, garantisce interoperabilità e semplifica la certificazione. L'SR250 è supportato da firmware, middleware e applicazioni di esempio per ottimizzare sviluppo e implementazione.
NXP Semiconductors ha presentado el Trimension SR250, la primera solución de un solo chip de la industria que integra el procesamiento on-chip con radar UWB de corto alcance y mediciones seguras. Este producto innovador permite nuevas experiencias para el usuario en aplicaciones de hogares autónomos e IoT industrial, centrándose en la localización, la presencia y la detección de movimiento. El SR250 combina radar UWB de bajo consumo y corto alcance (6-8,5 GHz), mediciones seguras y cálculos de ángulo de llegada para respaldar diversos casos de uso en hogares inteligentes y entornos industriales.
Las características clave incluyen lecturas de 3D AoA, TDOA y ToF precisas dentro de ±5 cm. El chip se puede emparejar con el elemento seguro EdgeLock SE051W para mejorar la seguridad. Desarrollado según las especificaciones del FiRa Consortium 3.0, garantiza interoperabilidad y simplifica la certificación. El SR250 cuenta con soporte de firmware, middleware y aplicaciones de muestra para agilizar el desarrollo y la implementación.
NXP 반도체는 트리메이션 SR250을 발표했습니다. 이는 칩 내 처리와 근거리 UWB 레이더 및 안전한 거리 측정을 통합한 산업 최초의 단일 칩 솔루션입니다. 이 혁신적인 제품은 자율 주택 및 산업 IoT 응용 프로그램에서 사용자 경험을 새롭게 하며, 위치, 존재 및 모션 감지에 초점을 맞추고 있습니다. SR250은 저전력 근거리 UWB 레이더 (6-8.5 GHz), 안전한 거리 측정 및 도착 각도 계산을 결합하여 스마트 홈과 산업 환경에서 다양한 사용 사례를 지원합니다.
주요 기능으로는 ±5 cm 이내의 정확도를 가진 3D AoA, TDOA 및 ToF 읽기가 포함됩니다. 이 칩은 보안을 강화하기 위해 EdgeLock SE051W 보안 요소와 쌍을 이룰 수 있습니다. FiRa Consortium 3.0 사양에 기반하여 개발되어 상호 운용성을 보장하고 인증을 단순화합니다. SR250은 개발 및 배포를 원활하게 하기 위해 펌웨어, 미들웨어 및 샘플 응용 프로그램의 지원을 받습니다.
NXP Semiconductors a dévoilé le Trimension SR250, la première solution monoprocesseur de l'industrie intégrant le traitement sur puce avec radar UWB à courte portée et mesure sécurisée. Ce produit innovant permet de nouvelles expériences utilisateur dans les applications de maisons autonomes et IoT industriel, en se concentrant sur la localisation, la présence et la détection de mouvement. Le SR250 combine radar UWB à faible consommation d'énergie (6-8,5 GHz), mesure sécurisée et calculs de l'angle d'arrivée pour soutenir divers cas d'utilisation dans les maisons intelligentes et les environnements industriels.
Les caractéristiques clés incluent des lectures 3D AoA, TDOA et ToF précises à ±5 cm près. La puce peut être associée à l'élément de sécurité EdgeLock SE051W pour améliorer la sécurité. Développé selon les spécifications du FiRa Consortium 3.0, il garantit l'interopérabilité et simplifie la certification. Le SR250 est soutenu par des firmware, middleware et des applications d'exemple pour rationaliser le développement et le déploiement.
NXP Semiconductors hat den Trimension SR250 vorgestellt, die erste Lösung der Branche, die die On-Chip-Verarbeitung mit kurzreich UWB-Radar und sicheren Entfernungsmessungen integriert. Dieses innovative Produkt ermöglicht neue Benutzererfahrungen in autonomen Haushalten und Industrie-IoT-Anwendungen und konzentriert sich auf Standort-, Präsenz- und Bewegungsdetektion. Der SR250 kombiniert stromsparendes Kurzstrecken-UWB-Radar (6-8,5 GHz), sichere Entfernungen und Ankunftswinkelberechnungen, um verschiedene Nutzungsmöglichkeiten in intelligenten Haushalten und industriellen Umgebungen zu unterstützen.
Wichtige Merkmale sind 3D AoA, TDOA und ToF-Messungen, die innerhalb von ±5 cm genau sind. Der Chip kann mit dem EdgeLock SE051W-Sicherheitselement gekoppelt werden, um die Sicherheit zu erhöhen. Entwickelt basierend auf den FiRa Consortium 3.0-Spezifikationen, gewährleistet es Interoperabilität und vereinfacht die Zertifizierung. Der SR250 wird durch Firmware, Middleware und Musteranwendungen unterstützt, um die Entwicklung und Bereitstellung zu optimieren.
- First single-chip solution integrating on-chip processing with UWB radar and secure ranging
- Enables new user experiences in autonomous homes and Industrial IoT applications
- Supports 3D AoA, TDOA, and ToF readings accurate to within ±5 cm
- Integrated radar processing capabilities for reduced power consumption
- Compliant with FiRa Consortium 3.0 technical specifications for interoperability
- Supported by firmware, middleware, and sample applications for easier development
- None.
Insights
NXP's Trimension SR250 marks a significant leap in UWB technology, combining secure ranging and short-range radar in a single chip. This integration enables advanced presence detection and secure positioning, opening up new possibilities for smart homes and Industrial IoT. The chip's ability to perform autonomous radar processing is particularly noteworthy, as it can significantly reduce power consumption in IoT devices.
The SR250's support for 3D Angle-of-Arrival (AoA) and Time Difference of Arrival (TDOA) calculations, with accuracy to ±5 cm, positions it as a powerful tool for precise location tracking and gesture recognition. Its compatibility with the FiRa Consortium 3.0 specifications ensures interoperability, which is important for widespread adoption in the IoT ecosystem.
While the technology is promising, its success will depend on the ecosystem's readiness to integrate UWB capabilities and the development of compelling use cases that leverage its unique features.
The Trimension SR250 positions NXP to capitalize on the growing smart home and Industrial IoT markets. With the global IoT market projected to reach
The chip's versatility in supporting both consumer and industrial applications broadens its market potential. In smart homes, features like presence-based automation could drive adoption. In industrial settings, the safety and productivity applications align with Industry 4.0 trends.
However, NXP faces competition from other semiconductor giants in the IoT space. The success of the SR250 will depend on NXP's ability to foster a strong developer ecosystem and partner with key IoT platform providers. The Q4 2024 availability gives competitors time to respond, making rapid market penetration important for NXP.
While specific financial projections aren't provided, the Trimension SR250 could significantly impact NXP's revenue in the IoT segment. In Q2 2023, NXP reported
The integration of multiple functions into a single chip could lead to higher margins compared to discrete solutions. Additionally, the reduced power consumption feature aligns with market demands, potentially driving adoption and sales volume.
Investors should monitor the product's uptake post-launch and its impact on NXP's IoT segment growth rate. The company's ability to secure design wins with major IoT manufacturers will be a key indicator of the SR250's success. While the product shows promise, its financial impact may not be immediate due to the Q4 2024 launch timeline.
- Trimension SR250 is the industry’s first single-chip solution combining on-chip processing with short-range ultra-wideband (UWB) radar and secure UWB ranging, enabling new user experiences in autonomous homes and for Industrial IoT
- Integrated radar processing capabilities enable reduced power consumption for improved efficiency
- NXP’s radar capabilities are supported with firmware, middleware, and sample applications to save effort and simplify deployment for faster design-in
EINDHOVEN, the Netherlands, Sept. 10, 2024 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the Trimension® SR250, the industry’s first single-chip solution that integrates on-chip processing capabilities with both short-range UWB radar and secure ranging. This is the next leap forward in NXP’s work to enable a world that anticipates and automates, enabling a wide variety of new user experiences based on location, presence or motion detection across consumer or industrial IoT applications.
The Trimension SR250 combines low-power short-range UWB radar operating at 6-8.5 GHz, secure ranging and angle-of-arrival (AoA) calculations to enable new use cases based on UWB mapping, human or object detection and secure positioning. This allows it to deliver convenience, efficiency, safety and privacy features in a smart home, such as turning lights or TVs on or off based on presence, enabling secure home access capabilities, or even monitoring the safety of an elderly person living alone without intrusive cameras. It also supports safety, security and productivity applications in industrial environments, being capable of tracking location for workers, goods or assets, access control, collision avoidance, danger zone detection and more.
“The Trimension SR250 represents the next generation of NXP’s advanced UWB solutions, delivering a giant leap towards a world that anticipates and automates,” said Philippe Dubois, Senior Vice President and General Manager, Secure Transactions and Identification, NXP. “The precise, secure and energy-efficient detection of presence, motion or location enables an almost unlimited number of new user experiences. Our customers across the consumer and industrial IoT will benefit from the reduced power consumption and the streamlined design process enabled by this industry-first solution.”
The Trimension SR250 is part of one of the industry’s broadest UWB portfolios, spanning devices across automotive, mobile and IoT applications. It supports 3D AoA, time difference of arrival (TDOA), and takes time of flight (ToF) readings accurate to within ±5 cm. For use cases that require added security, it can be combined with the EdgeLock SE051W secure element. To simplify certification and ensure interoperability, the Trimension SR250 is developed based on the FiRa Consortium 3.0 technical specifications.
Expanding UWB Capabilities with UWB Radar and Integrated Radar Processing
While UWB secure ranging requires communication between two UWB-enabled devices to detect location or presence, UWB radar is a passive solution requiring only the single-chip IC. Leveraging low-power radar operating at 6-8.5 GHz, the Trimension SR250 can detect presence, location or even motion, such as breathing or gestures. It can also detect and track one or more people or objects when interfaced to a host processor running AI/ML algorithms, such as the i.MX family of applications processors, RW61x family of wireless MCUs or the MCX family of MCUs.
The Trimension SR250 integrates on-chip radar processing, allowing it to perform radar processing autonomously and reducing the overall energy consumption of the system. For example, the host processor can be in a deep sleep mode, while the Trimension SR250 can use the on-chip presence detection to sense a moving person or object. This on-chip processing is crucial to the autonomous home and Industrial IoT capabilities, allowing the system to take actions, such activating or deactivating an HVAC or autonomous robot as a user enters or leaves a defined zone, such as a room in a smart home or a danger zone in a smart factory.
Developer Enablement with Radar Processing
The Trimension SR250 is supported by firmware, middleware, and sample applications to simplify development and deployment. This includes firmware with support for updates, APIs for the UWB Command Interface, updateable middleware, including C programming language APIs for radar operation, and example radar applications and algorithms.
With a broad ecosystem of partners, modules and development kits, NXP makes it easy to start developing quickly.
Product Availability
The Trimension SR250 is currently sampling and is expected to be generally available in Q4 2024, including through NXP’s broad ecosystem of module partners. For more information, please see NXP.com/Trimension
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of
NXP, Trimension and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © 2024 NXP B.V
For more information, please contact:
| Americas & Europe | Greater China / Asia |
| Phoebe Francis | Ming Yue |
| Tel: +1 737-274-8177 | Tel: +86 21 2205 2690 |
| Email: phoebe.francis@nxp.com | Email: ming.yue@nxp.com |
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/60ab7b24-7cc6-49c9-af72-4ff777f4d7b7
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