Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award
Nano Dimension's Tarantula Underfill system from its Essemtec product line has received the Global Technology Award for Innovation at SMTA International 2024 Show in Chicago. The system is designed for the assembly of complex devices in additive electronics, dispensing epoxy-based composite between chips and substrates to enhance mechanical strength and durability.
The system's key innovation lies in its non-contact heating solution and precise dispensing control, enabling underfill processes on two-side populated PCBs. The Tarantula Underfill features five different valve options: time-pressure, volume dispensing, micro screw, solder paste jetting, and glue jetting, allowing for customized solutions across various applications, particularly in aerospace, defense, and heavy-duty sectors.
Il sistema Tarantula Underfill di Nano Dimension, parte della sua linea di prodotti Essemtec, ha ricevuto il Global Technology Award per Innovazione al SMTA International 2024 Show di Chicago. Il sistema è progettato per l'assemblaggio di dispositivi complessi nell'elettronica additiva, erogando un composito a base di epossidico tra chip e substrati per migliorare la resistenza meccanica e la durata.
L'innovazione chiave del sistema risiede nella sua soluzione di riscaldamento senza contatto e nel controllo preciso dell'erogazione, che permette processi di underfill su PCB popolate su entrambi i lati. Il Tarantula Underfill presenta cinque diverse opzioni di valvole: erogazione a tempo-pressione, erogazione di volume, micro vite, getto di pasta saldante e getto di colla, consentendo soluzioni personalizzate in vari ambiti, in particolare in aerospaziale, difesa e settori ad alta intensità di lavoro.
El sistema Tarantula Underfill de Nano Dimension, parte de su línea de productos Essemtec, ha recibido el Global Technology Award por Innovación en la feria SMTA International 2024 en Chicago. El sistema está diseñado para el ensamblaje de dispositivos complejos en electrónica aditiva, dispensando un compuesto a base de epoxi entre chips y sustratos para mejorar la resistencia mecánica y la durabilidad.
La innovación clave del sistema radica en su solución de calefacción sin contacto y en el control preciso de la dispensación, lo que permite procesos de underfill en PCBs pobladas por ambos lados. El Tarantula Underfill cuenta con cinco opciones de válvulas diferentes: dispensación por tiempo-presión, dispensación de volumen, micro tornillo, inyección de pasta para soldadura y inyección de adhesivo, permitiendo soluciones personalizadas en diversas aplicaciones, especialmente en los sectores aeroespacial, de defensa y de alta resistencia.
나노 디멘션의 타란툴라 언더필 시스템은 Essemtec 제품군의 일환으로 시카고에서 열린 SMTA 국제 2024 쇼에서 혁신을 위한 글로벌 기술상을 수상했습니다. 이 시스템은 적층 전자기기의 조립을 위해 설계되었으며, 칩과 기판 사이에 에폭시 기반 복합재를 분사하여 기계적 강도와 내구성을 높입니다.
시스템의 핵심 혁신은 비접촉 가열 솔루션과 정밀한 분사 제어에 있으며, 이는 양면에 장착된 PCB의 언더필 프로세스를 가능하게 합니다. 타란툴라 언더필은 시간-압력, 용적 분사, 마이크로 스크류, 납땜 페이스트 제팅 및 접착제 제팅의 다섯 가지 서로 다른 밸브 옵션을 특징으로 하여 항공 우주, 방위 및 중공업 분야를 포함한 다양한 응용 프로그램에 대한 맞춤형 솔루션을 제공합니다.
Le système Tarantula Underfill de Nano Dimension, issu de sa gamme de produits Essemtec, a reçu le Global Technology Award pour Innovation lors du SMTA International 2024 à Chicago. Ce système est conçu pour l'assemblage d'appareils complexes dans l'électronique additive, en dispensant un composite époxy entre les puces et les substrats pour améliorer la résistance mécanique et la durabilité.
La principale innovation du système réside dans sa solution de chauffage sans contact et son contrôle de distribution précis, permettant des processus de sous-remplissage sur des PCB peuplés des deux côtés. Le Tarantula Underfill propose cinq options de valve différentes : distribution par temps-pression, distribution de volume, micro vis, jet de pâte à souder et jet de colle, permettant des solutions personnalisées dans divers domaines, en particulier dans les secteurs aérospatial, défense et lourds.
Das Tarantula Underfill-System von Nano Dimension aus der Essemtec-Produktlinie hat den Global Technology Award für Innovation auf der SMTA International 2024 in Chicago gewonnen. Das System ist für die Montage komplexer Geräte in der additiven Elektronik konzipiert und dosiert ein epoxidbasiertes Komposit zwischen Chips und Substraten, um die mechanische Festigkeit und Haltbarkeit zu verbessern.
Die wesentliche Innovation des Systems liegt in seiner kontaktlosen Heizlösung und der präzisen Steuerung der Dosierung, die Unterfülldprozesse auf doppelseitig bestückten PCBs ermöglicht. Das Tarantula Underfill bietet fünf verschiedene Ventiloptionen: Zeit-Druck-Dosierung, Volumendosierung, Mikroschraube, Lötdraht-Jetting und Kleber-Jetting, was maßgeschneiderte Lösungen in verschiedenen Anwendungen, insbesondere in der Luft- und Raumfahrt, Verteidigung und im Schwerlastbereich, erlaubt.
- Won Global Technology Award for Innovation at SMTA International 2024
- Features versatile functionality with five different valve options for customized solutions
- Addresses growing market demand in aerospace, defense, and heavy-duty sectors
- None.
Insights
The Tarantula Underfill system represents a significant technical advancement in electronics manufacturing, particularly for high-reliability applications. The non-contact heating solution and precise dispensing control address critical challenges in two-sided PCB assembly. The system's versatility with five different valve options positions it well for diverse industrial applications. However, while technically impressive, this award recognition alone is unlikely to drive significant revenue growth or stock movement in the immediate term.
The real value proposition lies in the system's potential applications in aerospace and defense sectors, where reliability requirements are stringent. The technology's ability to enhance mechanical strength and improve durability in harsh conditions aligns with growing market demands. Yet, this remains primarily a product enhancement rather than a game-changing innovation that would substantially impact
The Tarantula Underfill System Recognized at SMTA International 2024 Show in Chicago
Waltham, Mass., Dec. 11, 2024 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show (the “SMTA Show”) in Chicago, Illinois.
Essemtec’s Tarantula Underfill system is critical in the additive electronics value chain for assembly of complex devices. It involves dispensing an epoxy-based composite along the edge of a chip, which fills the gap between the chip and the substrate, or printed circuit boards, through capillary action.
This innovation enhances mechanical strength by reducing stresses caused by thermal expansion and vibration, while also improving durability, reliability, thermal cycling, and moisture ingress. This process is critical and in growing demand for industries like aerospace, defense, and heavy-duty sectors, where electronics must withstand harsh conditions and require high durability and robust performance.
The heart of Tarantula Underfill’s innovation is in its non-contact heating solution that enables the underfill process on two-side populated printed circuit boards (“PCBs”) and its precise dispensing control of medium.
Olivier Carnal, General Manager for Additive Electronics, shared, “We are proud to be recognized by the SMTA Show for our innovation. Our Tarantula Underfill product is unique yet flexible. In addition to its primary function as an underfill solution, the Tarantula Underfill offers the full range of Essemtec dispensing machine operations. With five different valve options - time-pressure, volume dispensing, micro screw, solder paste jetting, and glue jetting - it allows us to develop customized solutions to meet almost any customer need.”
Yoav Stern, Nano Dimension’s Chief Executive Officer, added, “I am extremely pleased to be able to announce that we have yet again launched another innovative product, which was designed and produced by our Nano Dimension team in Switzerland. This innovation uniquely meets our customers’ needs. Our ability to deliver this technology for production for large printed circuit boards will allow us to address a wide range of industries immediately.”
About Nano Dimension
Nano Dimension’s (Nasdaq: NNDM) vision is to transform existing electronics and mechanical manufacturing into Industry 4.0 environmentally friendly & economically efficient precision additive electronics and manufacturing – by delivering solutions that convert digital designs to electronic or mechanical devices - on demand, anytime, anywhere.
Nano Dimension’s strategy is driven by the application of deep learning-based AI to drive improvements in manufacturing capabilities by using self-learning & self-improving systems, along with the management of a distributed manufacturing network via the cloud.
Nano Dimension has served over 2,000 customers across vertical target markets such as aerospace and defense, advanced automotive, high-tech industrial, specialty medical technology, R&D, and academia. The Company designs and makes Additive Electronics and AM 3D printing machines and consumable materials. Additive Electronics are manufacturing machines that enable the design and development of High-Performance-Electronic-Devices (Hi-PED®s). AM includes manufacturing solutions for the production of metal, ceramic, and specialty polymers-based applications - from millimeters to several centimeters in size with micron precision.
Through the integration of its portfolio of products, Nano Dimension is offering the advantages of rapid prototyping, high-mix-low-volume production, IP security, minimal environmental footprint, and design-for-manufacturing capabilities, which are all unleashed with the limitless possibilities of AM.
For more information, please visit www.nano-di.com.
Forward Looking Statements
This press release contains forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995 and other Federal securities laws. Words such as “expects,” “anticipates,” “intends,” “plans,” “believes,” “seeks,” “estimates” and similar expressions or variations of such words are intended to identify forward-looking statements. For example, Nano is using forward-looking statements in this press release when it discusses the potential benefits and advantages of Tarantula Underfill, market demand and the potential to customize solutions, and all other statements other than statements of historical fact that address activities, events or developments that Nano intends, expects, projects, believes or anticipates will or may occur in the future. Such statements are based on management’s beliefs and assumptions made based on information currently available to management. Because such statements deal with future events and are based on Nano Dimension’s current expectations, they are subject to various risks and uncertainties, and actual results, performance or achievements of Nano Dimension could differ materially from those described in or implied by the statements in this press release. The forward-looking statements contained or implied in this press release are subject to other risks and uncertainties, including those discussed under the heading “Risk Factors” in Nano Dimension’s Annual Report on Form 20-F filed with the Securities and Exchange Commission (“SEC”) on March 21, 2024, and in any subsequent filings with the SEC. Except as otherwise required by law, Nano Dimension undertakes no obligation to publicly release any revisions to these forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events. References and links to websites have been provided as a convenience, and the information contained on such websites is not incorporated by reference into this communication. Nano Dimension is not responsible for the contents of third-party websites.
NANO DIMENSION INVESTOR RELATIONS CONTACT
Investor Relations | ir@nano-di.com
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