Welcome to our dedicated page for Micron Technology news (Ticker: MU), a resource for investors and traders seeking the latest updates and insights on Micron Technology stock.
Micron Technology Inc. (NASDAQ: MU) is a global leader in innovative memory and storage solutions, powering critical applications across data centers, AI systems, and consumer electronics. This dedicated news hub provides investors and industry professionals with timely updates on Micron's strategic developments, financial performance, and technological advancements.
Access authoritative coverage of Micron's quarterly earnings announcements, product launches, and partnership agreements. Our curated feed includes official press releases detailing advancements in DRAM and NAND technologies, manufacturing expansions, and sustainability initiatives. Stay informed about market-moving developments through verified updates on supply chain strategies and R&D breakthroughs.
This resource serves as your primary source for understanding Micron's role in shaping the semiconductor landscape. Track updates across key operational areas including data center solutions, automotive memory systems, and next-generation storage products. Bookmark this page for streamlined access to essential information that impacts investment analysis and industry trend monitoring.
Micron Technology (MU) has announced a strategic reorganization of its business units to better capitalize on AI-driven growth opportunities across all market segments. The company will transition to four new business units: Cloud Memory (CMBU), focusing on hyperscale cloud customers and high-bandwidth memory; Core Data Center (CDBU), serving OEM data center customers; Mobile and Client (MCBU), handling mobile and client segments; and Automotive and Embedded (AEBU), focusing on automotive, industrial, and consumer segments.
The reorganization will be completed by early fiscal Q4 2025, starting May 30, 2025, with financial reporting under the new structure beginning in the same quarter. The business units will be led by experienced executives Raj Narasimhan, Jeremy Werner, Mark Montierth, and Kris Baxter respectively, all reporting to EVP and Chief Business Officer Sumit Sadana.
Wolfspeed (NYSE: WOLF), the global leader in silicon carbide technology, has appointed Robert Feurle as its new Chief Executive Officer, effective May 1, 2025. Feurle, a semiconductor industry veteran with over 20 years of experience, will succeed Thomas Werner, who will return to his role as Chairman of the Board.
Feurle brings extensive experience from leadership roles at major semiconductor companies, most recently serving as Executive VP and GM of the Opto Semiconductors Business Unit at ams-OSRAM AG, where he managed over 10,000 employees globally. His track record includes successful tenures at Infineon Technologies, Micron Technology, Qimonda, and Siemens.
The new CEO will focus on improving Wolfspeed's financial performance, accelerating its path to positive free cash flow, and strengthening its balance sheet. Feurle, who holds dual US-German citizenship, will relocate to the company's Durham, North Carolina headquarters.
Micron Technology (MU) reported strong fiscal Q2 2025 results, with revenue reaching $8.05 billion, down from $8.71 billion in the previous quarter but up from $5.82 billion year-over-year. The company achieved GAAP net income of $1.58 billion ($1.41 per diluted share) and non-GAAP net income of $1.78 billion ($1.56 per diluted share).
Notable achievements include HBM revenue surpassing $1 billion and record data center DRAM revenue, which tripled compared to the previous year. Operating cash flow improved to $3.94 billion, up from $3.24 billion in the prior quarter. The company declared a quarterly dividend of $0.115 per share, payable on April 15, 2025.
Micron's leadership announced expectations for record quarterly revenue in fiscal Q3, driven by DRAM and NAND demand growth in both data center and consumer markets. The company remains on track for record revenue and improved profitability in fiscal 2025.
Micron Technology (MU) announces its position as the world's first and only memory company shipping both HBM3E and SOCAMM products for AI servers. The company has developed SOCAMM, a modular LPDDR5X memory solution, in collaboration with NVIDIA for their GB300 Grace Blackwell Ultra Superchip.
The SOCAMM solution, now in volume production, offers: 2.5x higher bandwidth than RDIMMs, occupies one-third of standard RDIMM size, consumes one-third power compared to DDR5 RDIMMs, and provides 128GB capacity with four 16-die stacks.
Micron's HBM3E 12H 36GB delivers 50% increased capacity over HBM3E 8H 24GB and 20% lower power consumption compared to competitors. The company's upcoming HBM4 solution is expected to boost performance by over 50% compared to HBM3E.
Micron Technology (MU) has appointed two new members to its board of directors. Mark Liu, former executive chairman of TSMC (2018-2024), brings over 30 years of semiconductor industry experience. During his tenure at TSMC, he held various leadership positions and helped establish it as the world's largest semiconductor foundry. Liu is currently founder and chairman of J&M Copper Beech Ventures.
Christie Simons, a senior audit and assurance partner at Deloitte & Touche LLP, will join the board with nearly 30 years of technology client service experience. Simons, who recently led Deloitte's Global Semiconductor Center of Excellence, will retire from Deloitte in May. Both appointments aim to strengthen Micron's position in addressing AI opportunities and optimizing business growth.
Micron Technology (MU) has announced it is the first in the industry to ship samples of its 1γ (1-gamma) sixth-generation DRAM node-based DDR5 memory. The new 16Gb DDR5 DRAM offers up to 9200MT/s speed capabilities, delivering a 15% speed increase and over 20% power reduction compared to its predecessor.
The 1γ DRAM node features include enhanced performance for AI workloads, significant power savings through next-generation high-K metal gate CMOS technology, and improved bit-density output with over 30% more bits-per-wafer compared to the previous generation. The technology will be implemented across Micron's memory portfolio, serving various applications from data centers to Edge AI devices.
The company has begun shipping samples to ecosystem partners and select customers, with AMD and Intel already starting validation processes for the new memory technology.
Micron Technology (Nasdaq: MU) has announced it will host its fiscal second quarter earnings conference call on Thursday, March 20, 2025, at 2:30 p.m. Mountain time. The event will be accessible through a live webcast on the company's investor relations website. Replay recordings of the presentations will remain available on Micron's Investor Relations website for approximately one year following the call.
Micron Technology (MU) announced that its LPDDR5X memory and UFS 4.0 storage solutions are featured in select Samsung Galaxy S25 series devices. The company is introducing its most power-efficient LPDDR5X memory to date, delivering over 10% power improvement. This advancement supports Samsung's new multimodal AI agents that process text, speech, images, and videos.
The integration is important as smartphone AI capabilities increasingly rely on edge device processing rather than cloud computing, requiring enhanced memory and storage capacity. Micron's UFS 4.0 storage offers high-capacity local data storage for improved security, while the new LPDDR5X memory's power efficiency is achieved through advanced 1β process technology and design optimizations that enable lower operating voltages.
This announcement follows Micron's previous validation for the Snapdragon® 8 Elite Mobile Platform and integration in Samsung's Galaxy S24 series, demonstrating the company's ongoing collaboration in enabling AI-capable smartphones.
Micron Technology (MU) has unveiled the Micron 4600 PCIe Gen5 NVMe SSD, its first Gen5 client SSD that doubles the performance of its predecessor. The new drive features sequential read speeds of 14.5 GB/s and write speeds of 12.0 GB/s, enabling large language model loading in less than one second.
The 4600 SSD demonstrates significant improvements over Gen4 SSDs, including up to 62% faster AI model loading times and 107% better energy efficiency. The drive is compatible with AMD's Ryzen 9000 Series and Intel Core Ultra processors, and has received validation from major manufacturers including Lenovo.
Key performance metrics include 2.1 million random read and write IOPS, up to 38% better PCMark 10 benchmark scores than Gen4 SSDs, and significant speed improvements in various applications: 61% faster for media and entertainment, 59% for energy industry, 45% for product development, and 38% for life sciences applications.
Micron Technology (MU) has announced that its executives will be participating in the Wolfe Research Auto, Auto Tech and Semiconductor Conference in New York. The presentation is scheduled for Wednesday, February 12, at 6:50 a.m. Mountain time. The company will provide live webcasts of the presentations, which will be accessible through Micron's Investor Relations website at investors.micron.com/, along with subsequent replay options.
