Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure
Marvell Technology (NASDAQ: MRVL) has introduced Ara, the industry's first 3nm 1.6 Tbps PAM4 interconnects platform with 200 Gbps electrical and optical interfaces. Built on their successful Nova 2 DSP, Ara reduces optical module power consumption by over 20% through its 3nm technology and integrated optical modulator drivers. The platform features eight 200 Gbps electrical and optical lanes, enabling 1.6 Tbps in a standardized module form factor. This advancement aims to address increasing AI bandwidth demands while maintaining data center power constraints. Marvell plans to sample Ara to select customers in Q1 2025.
Marvell Technology (NASDAQ: MRVL) ha introdotto Ara, la prima piattaforma interconnettiva PAM4 da 1,6 Tbps a 3nm del settore, con interfacce elettriche e ottiche da 200 Gbps. Basata sul loro successo Nova 2 DSP, Ara riduce il consumo di energia dei moduli ottici di oltre il 20% grazie alla sua tecnologia a 3nm e ai driver di modulazione ottica integrati. La piattaforma presenta otto linee elettriche e ottiche da 200 Gbps, consentendo 1,6 Tbps in un fattore di forma modulare standardizzato. Questo progresso mira a soddisfare le crescenti esigenze di larghezza di banda per l'IA, mantenendo al contempo i vincoli di potenza dei data center. Marvell prevede di fornire campioni di Ara a clienti selezionati nel Q1 2025.
Marvell Technology (NASDAQ: MRVL) ha presentado Ara, la primera plataforma de interconexiones PAM4 de 1.6 Tbps en 3nm de la industria, con interfaces eléctricas y ópticas de 200 Gbps. Construida sobre su exitoso Nova 2 DSP, Ara reduce el consumo de energía del módulo óptico en más de un 20% gracias a su tecnología de 3nm y a los controladores de moduladores ópticos integrados. La plataforma cuenta con ocho canales eléctricos y ópticos de 200 Gbps, lo que permite alcanzar 1.6 Tbps en un factor de forma de módulo estandarizado. Este avance tiene como objetivo abordar la creciente demanda de ancho de banda para IA, mientras se mantienen las restricciones de potencia en los centros de datos. Marvell planea enviar muestras de Ara a clientes seleccionados en Q1 2025.
마벨 테크놀로지 (NASDAQ: MRVL)는 Ara를 소개했습니다. 이는 업계 최초의 3nm 1.6 Tbps PAM4 상호 연결 플랫폼으로, 200 Gbps 전기 및 광학 인터페이스를 갖추고 있습니다. 성공적인 Nova 2 DSP 기반으로 제작된 Ara는 3nm 기술과 통합 광 변조기 드라이버를 통해 광 모듈 전력 소비를 20% 이상 줄입니다. 이 플랫폼은 200 Gbps 전기 및 광학 레인을 8개 갖추고 있어 표준화된 모듈 형식에서 1.6 Tbps을 가능하게 합니다. 이 발전은 데이터 센터의 전력 제약을 유지하면서 AI 대역폭 증가 요구를 해결하기 위한 것입니다. 마벨은 2025년 1분기에 선택된 고객에게 Ara 샘플을 제공할 계획입니다.
Marvell Technology (NASDAQ: MRVL) a introduit Ara, la première plateforme d'interconnexions PAM4 de 1,6 Tbps à 3 nm de l'industrie, avec des interfaces électriques et optiques de 200 Gbps. Basée sur leur DSP Nova 2 à succès, Ara réduit la consommation d'énergie du module optique de plus de 20% grâce à sa technologie 3 nm et ses pilotes de modulateurs optiques intégrés. La plateforme dispose de huit canaux électriques et optiques de 200 Gbps, permettant d'atteindre 1,6 Tbps dans un format de module standardisé. Cette avancée vise à répondre à la demande croissante de bande passante pour l'IA tout en respectant les contraintes de puissance des centres de données. Marvell prévoit d'échantillonner Ara à des clients sélectionnés au Q1 2025.
Marvell Technology (NASDAQ: MRVL) hat Ara eingeführt, die erste PAM4-Interconnect-Plattform der Industrie mit 1,6 Tbps in 3nm und 200 Gbps elektrischen und optischen Schnittstellen. Basierend auf ihrem erfolgreichen Nova 2 DSP reduziert Ara den Stromverbrauch des optischen Moduls um über 20% dank ihrer 3nm-Technologie und integrierten optischen Modulatoransteuerungen. Die Plattform bietet acht elektrische und optische Kanäle mit 200 Gbps, die 1,6 Tbps in einem standardisierten Modulformat ermöglichen. Dieser Fortschritt zielt darauf ab, den steigenden Bandbreitenbedarf der KI zu decken, während die Energievorgaben der Rechenzentren eingehalten werden. Marvell plant, im Q1 2025 Ara-Muster an ausgewählte Kunden zu versenden.
- 20% reduction in optical module power consumption
- Industry-first 3nm PAM4 optical DSP technology
- Integration of eight 200 Gbps lanes enabling 1.6 Tbps throughput
- Reduced module design complexity and cost
- Product won't be available for sampling until Q1 2025
Insights
This next-generation 3nm PAM4 DSP represents a significant technological advancement for data center interconnects. The
The projected market growth to 127 million PAM4 DSP units by 2029 signals strong demand potential. The integrated laser driver and companion TIA demonstrate a comprehensive system-level approach that will help reduce implementation complexity and total cost of ownership for data centers. This advancement could give Marvell a competitive edge in the rapidly growing AI infrastructure market.
This product launch strengthens Marvell's position in the high-growth AI infrastructure market. With major cloud providers and AI companies constantly expanding their data center capabilities, the timing is strategic. The endorsement from InnoLight Technology and LightCounting's market projection validate the product's market potential. However, the Q1 2025 sampling timeline means revenue impact won't be immediate.
The focus on power efficiency and TCO aligns perfectly with data center operators' priorities, particularly as energy costs and environmental concerns become increasingly important factors in infrastructure decisions. This could drive strong adoption among hyperscalers looking to optimize their AI operations.
New Ara PAM4 DSP Reduces Optical Module Power by
Ara, the industry's first 3nm PAM4 optical DSP, builds on six generations of Marvell leadership in PAM4 optical DSP technology. It integrates eight 200 Gbps electrical lanes to the host and eight 200 Gbps optical lanes, enabling 1.6 Tbps in a compact, standardized module form factor. Leveraging 3nm technology and laser driver integration, Ara reduces module design complexity, power consumption and cost, setting a new benchmark for next-generation AI and cloud infrastructure.
"Ara sets a new industry standard by leveraging advanced 3nm technology to deliver significant power reduction, driving the volume adoption of 1.6 Tbps connectivity for AI infrastructure," said Xi Wang, Vice President of Product Marketing for Optical Connectivity at Marvell. "With a co-optimized companion TIA, our next-generation PAM4 optical DSP platform empowers customers to scale generative AI and large-scale compute applications with best-in-class performance and unmatched energy efficiency."
"Ara is another Marvell optical connectivity industry-first solution, delivering the power efficiency required for the most demanding AI workloads," said Osa Mok, chief marketing officer, InnoLight Technology. "The Ara platform combined with InnoLight's advanced high-speed optical transceiver design and manufacturing expertise, offers the industry a state-of-the-art pluggable module optimized for next-generation AI and cloud infrastructure."
"We anticipate unit shipments of PAM4 DSPs will more than triple from 2024 to 2029 to nearly 127 million units a year and remain the primary optical technology for connecting assets inside data centers for the foreseeable future," said Bob Wheeler, Analyst at Large, LightCounting. "Ara marks another first for Marvell and demonstrates that PAM4 technology continues to evolve to meet the challenges of AI infrastructure."
Optimized for next-generation AI and cloud infrastructure, Ara is designed to support high-density 200 Gbps I/O interfaces across switches, network interface cards (NICs) and XPUs, while ensuring backward compatibility with prior generations. With best-in-class power efficiency and integration, Ara addresses the growing requirements of hyperscale data centers, to deliver high-performance accelerated infrastructure with best-in-class total cost of ownership (TCO).
Ara Platform Key Features
- 200 Gbps per channel support, providing high bandwidth for next-generation AI-driven applications.
- 200 Gbps per lane line-side receiver with companion Marvell TIA CB11269TA, providing best-in-class linearity and low noise for AI applications.
- PAM4 modulation for efficient high-speed data transmission – critical for AI and cloud applications.
- Integrated, high-swing laser driver to improve performance while reducing overall transceiver module design complexity, power consumption, and TCO.
- Enhanced crossbar switching capabilities within a streamlined architecture, improving routing flexibility across channels.
- InfiniBand and Ethernet support for versatile interconnect flexibility across diverse network topologies, enhancing adaptability for accelerated infrastructure.
Availability
Marvell Ara will sample to select customers in Q1 2025.
About Marvell
To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.
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