Welcome to our dedicated page for Murata Manufacturing Co news (Ticker: MRAAY), a resource for investors and traders seeking the latest updates and insights on Murata Manufacturing Co stock.
Murata Manufacturing Co., Ltd. (MRAAY) drives innovation in advanced electronic components and IoT connectivity solutions. This news hub provides investors and industry professionals with timely updates on Murata's technological advancements, strategic partnerships, and market leadership.
Access consolidated coverage of earnings announcements, product launches (including RFID systems and UWB radar solutions), and collaborations like the NXP Semiconductors partnership. Track developments in automotive electronics, smart energy applications, and industrial automation technologies.
Discover how Murata's ceramic-based components and communication modules are shaping next-generation devices across multiple industries. Our curated news collection enables informed analysis of the company's R&D focus areas and global market strategy.
Bookmark this page for continuous updates on Murata's progress in creating high-density modules and smart connectivity solutions. Check regularly for official press releases and verified financial updates directly impacting MRAAY's market position.
Murata Manufacturing Co., Ltd. has partnered with Autotalks to introduce innovative V2X communication technology, enhancing automated mobility and safety. The new wireless module solution supports direct vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communication, utilizing Autotalks’ CRATON2 and SECTON chipsets. The modules can operate with both DSRC and C-V2X standards, allowing adaptability across geographic regions with reduced engineering costs. Murata's solutions have already been selected by a major vehicle manufacturer, with initial integrations expected by early 2024, potentially improving road safety and traffic flow.
Murata Manufacturing Co., Ltd. has launched the BLM21HE series of chip ferrite beads, enhancing noise suppression technology for vehicles. These components offer high impedance (up to 850Ω at 1GHz), crucial for next-gen designs where high-current power lines interact with high-frequency communications. They are vital for applications like wireless battery management systems and vehicle-to-vehicle communication. The BLM21HE series operates from -55°C to +150°C and minimizes power loss, thereby improving efficiency and reducing thermal management needs.
Murata Manufacturing Co., Ltd. (Tokyo:6981) has launched an innovative three-in-one soil sensor designed for sustainable agriculture. This advanced sensor measures electrical conductivity (EC), water content, and temperature simultaneously, allowing farmers to optimize yields while conserving resources like water and fertilizers. With a grid of 9 sensitive electrodes, the sensor ensures accurate EC readings unaffected by soil moisture. The robust design supports harsh environments and offers multi-interface compatibility, enhancing its effectiveness in agricultural management.
Murata Manufacturing has announced a co-development with Michelin of a new passive RFID module embedded in tires. This technology enhances tire management operations by enabling low-cost, efficient traceability throughout the tire's lifecycle. Currently implemented in over four million tires, the plan is to expand usage across all Michelin tires by 2024. The innovation, approximately the size of a grain of rice, aims to improve inventory logistics, maintenance, and recycling efforts, reflecting a significant step towards increased market adoption of RFID technology in tire manufacturing.
Resonant Inc. (NASDAQ: RESN) has announced an expanded partnership with Murata Manufacturing Co., Ltd. to develop 5G XBAR® RF filters. This agreement enhances Resonant's XBAR® technology application across additional frequency bands, aiming to meet the growing demand for high-performance RF solutions in next-gen wireless networks. Chairman and CEO George B. Holmes emphasized the validation of their collaboration and the importance of XBAR® technology in addressing challenges faced by future networks. This partnership is expected to facilitate high-volume manufacturing and improve market scalability.
