Mitsubishi Electric to Launch “SLIMDIP-X” Power Semiconductor Module

Rhea-AI Summary

Mitsubishi Electric Corporation has announced the launch of its new SLIMDIP-X power semiconductor module on February 18. This module offers reduced thermal resistance and lower noise, aimed at simplifying and downsizing inverter systems in home appliances like air conditioners and refrigerators. Key improvements include a 35% reduction in thermal resistance and an increased current rating of 20A. The design compatibility with the SLIMDIP series will streamline development and lower production costs, enhancing overall system efficiency.

Positive

• Launch of SLIMDIP-X module expected to enhance inverter systems for home appliances.
• 35% reduction in thermal resistance compared to previous models.
• Increased rating current to 20A provides improved performance.
• Design compatibility with SLIMDIP series reduces development time.

Negative

• None.

Reduced thermal resistance and noise will realize simpler, smaller inverter systems for appliances

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that its new SLIMDIP-X power semiconductor module, which achieves low thermal resistance and noise for use in home-appliance inverter systems, will be released on February 18. This new module in the SLIMDIP^TM series is expected to help simplify and reduce the size of inverter systems used in products such as air conditioners, washing machines and refrigerators.

Product Features

1) Reduced thermal resistance will contribute to simpler thermal designs

- An upgraded insulation sheet reduces thermal resistance between the chip and case by approximately 35% compared to the existing SLIMDIP-L module, and the rating current has been increased to 20A.
- High-temperature suppression in the reverse-conducting IGBT (RC-IGBT) will help to simplify the thermal designs for inverter systems.

2) Low noise will help realize smaller, lower-cost inverter systems

- Noise reduction technology deployed in the RC-IGBT helps to reduce the number of noise suppression components, which will lead to smaller and lower-cost inverter systems.

3) SLIMDIP series package compatibility helps to shorten design time

- Adopting a SLIMDIP series-compatible package, including dimensions and pin layout (while nevertheless increasing the rating current), will greatly help to shorten inverter-system designing.

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Customer Inquiries

Power Device Overseas Marketing Dept.A and Dept.B

Mitsubishi Electric Corporation

www.MitsubishiElectric.com/semiconductors/

Media Inquiries

Takeyoshi Komatsu

Public Relations Division

Mitsubishi Electric Corporation

Tel: +81-3-3218-2346

prd.gnews@nk.MitsubishiElectric.co.jp

www.MitsubishiElectric.com/news/

Source: Mitsubishi Electric Corporation

FAQ

What is the SLIMDIP-X power semiconductor module by Mitsubishi Electric?

The SLIMDIP-X is a new power semiconductor module designed to reduce thermal resistance and noise for inverter systems in home appliances, launched on February 18.

How does the SLIMDIP-X improve appliance inverter systems?

It offers a 35% reduction in thermal resistance and increased current rating to 20A, simplifying system design and enhancing efficiency.

What appliances will utilize the SLIMDIP-X module?

The SLIMDIP-X module is intended for use in air conditioners, washing machines, and refrigerators.

When was the SLIMDIP-X module announced?

Mitsubishi Electric announced the SLIMDIP-X module on February 18.

What are the benefits of the SLIMDIP series compatibility?

The compatibility helps shorten the design time for inverter systems by maintaining dimensions and pin layout while increasing rating current.