Lightwave Logic Announces Issuance of U.S. Patent for Breakthrough Chip-Scale Packaging Technique to Enable Foundry-Level Packaging of Polymer Modulators
Lightwave Logic (NASDAQ: LWLG) announced the issuance of a U.S. patent for a new technology enabling chip-scale packaging of polymer modulators, simplifying high-volume manufacturing. The patent, titled 'Hybrid electro-optic polymer modulator with atomic layer deposition sealant layer' (US 11,506,918 B2), facilitates sealing polymers against moisture at low temperatures, crucial for high-volume applications. This advancement in packaging techniques positions the company to improve stability and reliability while potentially lowering production costs, aligning with trends in silicon electronics.
- Issuance of U.S. patent for chip-scale packaging of polymer modulators.
- Enhances manufacturing efficiency through simplified foundry-level packaging.
- Improves stability and reliability of polymer devices without adverse effects.
- None.
Company Secures Patent Issuance for Previously Announced Patent Application for Ability to Fabricate Polymer Modulators Using Chip-Scale Techniques, Enabling Simplified High-Volume Manufacturing through Foundry-Level Packaging
ENGLEWOOD, Colo., Dec. 12, 2022 /PRNewswire/ -- Lightwave Logic, Inc. (NASDAQ: LWLG), a technology platform company leveraging its proprietary electro-optic polymers to transmit data at higher speeds with less power, today announced the issuance of a U.S. patent, the application of which was announced in June 2022, on a new invention that will enable simplified foundry-level packaging of polymer modulators using chip-scale techniques which can be applied at wafer level, critical for high-volume manufacturing applications.
This patent issuance – entitled "Hybrid electro-optic polymer modulator with atomic layer deposition (ALD) sealant layer" with patent number US 11,506,918 B2 – allows Lightwave Logic's proprietary polymers to be sealed to moisture and atmospheric gases in a very low temperature and quasi-hermetic environment through the use of a chip-scale packaging approach that can be applied in parallel at wafer level (i.e. in volume) and that eliminates the need for a separate hermetic enclosure or "gold box." Chip-scale packaging is a technique that has been gathering momentum in the silicon electronics industry for the past decade to reduce device chip packaging costs and increase device performance – enabling high-volume front and back-end manufacturing as well as extremely small sizes in miniaturization.
Over the past two years, Lightwave Logic has developed its atomic layer deposition techniques to not only seal its polymers in a quasi-hermetic environment, but to improve both the stability and reliability of polymer devices, without any adverse effects to poling. The sealant process will enable lower cost system implementation in a high-volume foundry environment. Specifically, Lightwave Logic's electro-optic polymer modulators will be sealed with low-temperature conformal atomic layer deposition dielectric layers that are supported on a silicon substrate with passive silicon photonics waveguides.
Dr. Michael Lebby, Chief Executive Officer of Lightwave Logic, commented: "With the issuance of this exciting new patent and our recent acquisition of low temperature ALD processes, we continue to innovate our miniaturized packaging techniques using ALD to align with and surpass customer expectations. Both this patent as well as our recent low temperature ALD processes address the accelerating trend in photonics towards chip scale packaging, similar to what has been used in the silicon electronics industry. Further, the potential future impact of this invention on our foundry partners and associated back-end process development kits (PDKs) has the potential to be a critical feature of our next-generation polymer platform. The timing of this invention coincides well with our work with silicon foundries."
About Lightwave Logic, Inc.
Lightwave Logic, Inc. (NASDAQ: LWLG) is developing a platform leveraging its proprietary engineered electro-optic (EO) polymers to transmit data at higher speeds with less power. The company's high-activity and high-stability organic polymers allow Lightwave Logic to create next-generation photonic EO devices, which convert data from electrical signals into optical signals, for applications in data communications and telecommunications markets. For more information, please visit the company's website at lightwavelogic.com.
Safe Harbor Statement
The information posted in this release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify these statements by use of the words "may," "will," "should," "plans," "explores," "expects," "anticipates," "continue," "estimate," "project," "intend," and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, lack of available funding; general economic and business conditions; competition from third parties; intellectual property rights of third parties; regulatory constraints; changes in technology and methods of marketing; delays in completing various engineering and manufacturing programs; changes in customer order patterns; changes in product mix; success in technological advances and delivering technological innovations; shortages in components; production delays due to performance quality issues with outsourced components; those events and factors described by us in Item 1.A "Risk Factors" in our most recent Form 10-K and 10-Q; other risks to which our company is subject; other factors beyond the company's control.
Investor Relations Contact:
Lucas A. Zimmerman
MZ Group - MZ North America
949-259-4987
LWLG@mzgroup.us
www.mzgroup.us
View original content to download multimedia:https://www.prnewswire.com/news-releases/lightwave-logic-announces-issuance-of-us-patent-for-breakthrough-chip-scale-packaging-technique-to-enable-foundry-level-packaging-of-polymer-modulators-301699831.html
SOURCE Lightwave Logic, Inc.
