Lantronix Announces Five New System-in-Package Solutions Powered by Qualcomm for AI/ML and Video Solutions at the Edge
Lantronix Inc. (NASDAQ: LTRX) has unveiled five new System-in-Package (SiP) solutions powered by Qualcomm Technologies' chipsets, reinforcing its position in industrial and enterprise IoT innovation. These solutions bring advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge, targeting applications in robotics, industrial automation, video surveillance, and drones.
The new SiP modules are compliant with the Trade Agreements Act (TAA) and the National Defense Authorization Act (NDAA). They integrate AI capabilities from the Qualcomm AI Hub, providing a reference base of over 100 AI models and simplified model optimization. The lineup includes:
- IQ9 Series SiPs (9100IQ and 9075IQ) for industrial and robotics applications
- Open-Q 8550CS for advanced video and AI applications
- Open-Q 6490CS and 5430CS for scalable AI solutions
These SiPs offer features such as high AI performance, power efficiency, advanced connectivity, and support for complex computing tasks, positioning Lantronix at the forefront of edge AI technology.
Lantronix Inc. (NASDAQ: LTRX) ha svelato cinque nuove soluzioni System-in-Package (SiP) alimentate dai chipset di Qualcomm Technologies, rafforzando la sua posizione nell'innovazione IoT per il settore industriale e aziendale. Queste soluzioni portano capacità avanzate di Intelligenza Artificiale (AI) e Machine Learning (ML) al bordo, mirando ad applicazioni in robotica, automazione industriale, sorveglianza video e droni.
I nuovi moduli SiP sono conformi al Trade Agreements Act (TAA) e al National Defense Authorization Act (NDAA). Integrano capacità AI dal Qualcomm AI Hub, fornendo una base di riferimento di oltre 100 modelli di AI e semplificando l'ottimizzazione dei modelli. La gamma include:
- Serie IQ9 SiP (9100IQ e 9075IQ) per applicazioni industriali e di robotica
- Open-Q 8550CS per applicazioni video avanzate e AI
- Open-Q 6490CS e 5430CS per soluzioni AI scalabili
Questi SiP offrono caratteristiche come elevate prestazioni AI, efficienza energetica, connettività avanzata e supporto per compiti di calcolo complessi, posizionando Lantronix all'avanguardia della tecnologia AI edge.
Lantronix Inc. (NASDAQ: LTRX) ha presentado cinco nuevas soluciones System-in-Package (SiP) impulsadas por los chipsets de Qualcomm Technologies, consolidando su posición en la innovación IoT industrial y empresarial. Estas soluciones aportan capacidades avanzadas de Inteligencia Artificial (AI) y Aprendizaje Automático (ML) en el borde, dirigidas a aplicaciones en robótica, automatización industrial, vigilancia de video y drones.
Los nuevos módulos SiP son cumplen con el Trade Agreements Act (TAA) y el National Defense Authorization Act (NDAA). Integran capacidades de AI del Qualcomm AI Hub, proporcionando una base de referencia de más de 100 modelos de AI y optimización de modelos simplificada. La línea incluye:
- Serie IQ9 SiPs (9100IQ y 9075IQ) para aplicaciones industriales y de robótica
- Open-Q 8550CS para aplicaciones de video avanzadas y AI
- Open-Q 6490CS y 5430CS para soluciones de AI escalables
Estos SiPs ofrecen características como alto rendimiento de AI, eficiencia energética, conectividad avanzada y soporte para tareas informáticas complejas, posicionando a Lantronix a la vanguardia de la tecnología AI en el borde.
란트로닉스 주식회사 (NASDAQ: LTRX)가 퀄컴 테크놀로지의 칩셋으로 구동되는 다섯 개의 새로운 시스템 인 패키지(SiP) 솔루션을 발표하며 산업 및 기업 IoT 혁신에서의 입지를 강화했습니다. 이 솔루션은 엣지에서의 인공지능(AI) 및 기계 학습(ML) 기능을 향상시켜 로봇공학, 산업 자동화, 비디오 감시 및 드론과 같은 애플리케이션을 목표로 합니다.
새로운 SiP 모듈은 무역 협정 법(TAA) 및 국가 방위 허가 법(NDAA)을 준수합니다. 이들은 퀄컴 AI 허브에서 AI 기능을 통합하여 100개 이상의 AI 모델에 대한 참조 데이터와 모델 최적화의 간소화를 제공합니다. 라인업에는 다음이 포함됩니다:
- 산업 및 로봇 응용 프로그램을 위한 IQ9 시리즈 SiP(9100IQ 및 9075IQ)
- 고급 비디오 및 AI 응용 프로그램을 위한 Open-Q 8550CS
- 확장 가능한 AI 솔루션을 위한 Open-Q 6490CS 및 5430CS
이 SiP는 높은 AI 성능, 전력 효율성, 고급 연결성 및 복잡한 계산 작업을 지원하는 기능을 제공하여 란트로닉스를 엣지 AI 기술의 최전선에 두고 있습니다.
Lantronix Inc. (NASDAQ: LTRX) a dévoilé cinq nouvelles solutions System-in-Package (SiP) propulsées par les chipsets de Qualcomm Technologies, renforçant ainsi sa position dans l'innovation IoT industrielle et d'entreprise. Ces solutions apportent des capacités avancées d'Intelligence Artificielle (AI) et de Machine Learning (ML) à la périphérie, ciblant des applications dans la robotique, l'automatisation industrielle, la surveillance vidéo et les drones.
Les nouveaux modules SiP sont conformes au Trade Agreements Act (TAA) et au National Defense Authorization Act (NDAA). Ils intègrent des capacités d'AI provenant du Qualcomm AI Hub, fournissant une base de référence de plus de 100 modèles d'AI et une optimisation de modèle simplifiée. La gamme comprend :
- Séries IQ9 SiPs (9100IQ et 9075IQ) pour des applications industrielles et robotiques
- Open-Q 8550CS pour des applications avancées de vidéo et d'AI
- Open-Q 6490CS et 5430CS pour des solutions d'AI évolutives
Ces SiPs offrent des caractéristiques telles qu'une haute performance AI, une efficacité énergétique, une connectivité avancée et un soutien pour des tâches de calcul complexes, positionnant Lantronix à l'avant-garde de la technologie AI edge.
Lantronix Inc. (NASDAQ: LTRX) hat fünf neue System-in-Package (SiP) Lösungen vorgestellt, die von den Chipsets von Qualcomm Technologies betrieben werden und somit seine Position in der Industrievernetzung und unternehmerischen IoT-Innovation stärken. Diese Lösungen bringen fortschrittliche künstliche Intelligenz (AI) und maschinelles Lernen (ML) an den Edge und richten sich an Anwendungen in Robotik, industrieller Automatisierung, Videoüberwachung und Drohnen.
Die neuen SiP-Module sind konform mit dem Trade Agreements Act (TAA) und dem National Defense Authorization Act (NDAA). Sie integrieren AI-Funktionen des Qualcomm AI Hub und bieten eine Referenzbasis von über 100 AI-Modellen sowie eine vereinfachte Modelloptimierung. Die Produktreihe umfasst:
- IQ9 Serien SiPs (9100IQ und 9075IQ) für industrielle und robotische Anwendungen
- Open-Q 8550CS für fortschrittliche Video- und AI-Anwendungen
- Open-Q 6490CS und 5430CS für skalierbare AI-Lösungen
Diese SiPs bieten Merkmale wie hohe AI-Leistung, Energieeffizienz, fortschrittliche Konnektivität und Unterstützung für komplexe Rechenaufgaben, wodurch Lantronix an der Spitze der Edge-AI-Technologie positioniert wird.
- Launch of five new System-in-Package (SiP) solutions powered by Qualcomm Technologies' chipsets
- Advanced AI and ML capabilities for edge applications in robotics, industrial automation, video surveillance, and drones
- Compliance with Trade Agreements Act (TAA) and National Defense Authorization Act (NDAA)
- Integration of AI capabilities from Qualcomm AI Hub with over 100 AI models
- High AI performance ranging from 3.5 to 100 INT-8 TOPS across different SiP families
- Enhanced connectivity features including Wi-Fi 7, Bluetooth 5, and high-speed Ethernet support
- None.
Insights
Lantronix's introduction of five new System-in-Package (SiP) solutions marks a significant advancement in edge AI capabilities for industrial and enterprise applications. The collaboration with Qualcomm Technologies brings high-performance AI processing to compact, power-efficient modules, enabling sophisticated applications in robotics, automation and video processing.
Key technological highlights include:
- AI performance ranging from 3.5 to 100 INT-8 TOPS, allowing for complex edge AI tasks
- Support for up to 16 concurrent cameras in some models, enhancing perception capabilities
- Advanced connectivity options including Wi-Fi 7 and 10G Ethernet
- Robust safety features, including functional safety up to SIL-3 level
- Wide operating temperature range of -40°C to 115°C, suitable for harsh environments
These features position Lantronix as a strong competitor in the rapidly growing edge AI market, potentially increasing their market share in industrial IoT solutions.
Lantronix's new SiP solutions are poised to capitalize on the burgeoning edge AI market, which is projected to grow significantly. This move aligns with the increasing demand for AI-driven applications in industrial and enterprise sectors. Key market implications include:
- Potential for increased market share in the industrial IoT and edge computing segments
- Enhanced competitive positioning against other players in the embedded systems market
- Opportunity to expand into new verticals such as smart cities and advanced robotics
- Strengthened strategic partnership with Qualcomm, a leader in mobile and IoT processors
The compliance with TAA and NDAA could open doors to government and defense contracts, further expanding Lantronix's potential customer base. This product launch could positively impact Lantronix's revenue streams, particularly if they can leverage their existing customer relationships to drive adoption of these new, more capable solutions.
The modules are ideal for developing products for smart city and enterprise use cases, including robotics, industrial automation, video surveillance and drones
IRVINE, Calif., Oct. 09, 2024 (GLOBE NEWSWIRE) -- Lantronix Inc. (NASDAQ: LTRX), a global leader of compute and connectivity IoT solutions, today announced its powerful new System-in-Package (SiP) solutions powered by Qualcomm® Technologies’ chipsets that reinforce Lantronix’s position in industrial and enterprise IoT innovation, bringing advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the edge.
“Qualcomm Technologies and Lantronix have had strong relationships for more than 15 years,” stated Dev Singh, vice president of Business Development and head of Industrial Automation at Qualcomm Technologies Inc. “Utilizing Qualcomm Technologies’ cutting-edge processors, Lantronix enables its customers to seamlessly deploy AI solutions at the edge, bringing its expertise in embedded computing and IoT to deliver reliable, industrial-grade systems.”
With a combination of leading-edge performance and cost efficiency, Lantronix’s five new SiP families are set to accelerate the development of AI-driven applications in industrial and enterprise use cases, including robotics, industrial automation, video surveillance, video collaboration and drones. The new SiP modules are compliant with the Trade Agreements Act (TAA) and the National Defense Authorization Act (NDAA).
“With the addition of these five new SiP solutions, we continue our strategic collaboration with Qualcomm Technologies that has enabled Lantronix to build a proven track record of successfully delivering integrated, collaborative solutions that are driving forward IoT and AI/ML technologies to meet the evolving needs of today’s advanced-edge applications,” said Mathi Gurusamy, chief strategy officer for Lantronix.
Lantronix enables the creation of superior, high-performance AI-driven applications by integrating AI capabilities from the Qualcomm® AI Hub. The Qualcomm AI Hub provides a reference base of more than 100 AI models and a simplified model optimization process to efficiently utilize AI capabilities (3.5 to 100 INT-8 TOPS) in these SiP families.
IQ9 Series SiPs for Industrial and Robotics Applications
Lantronix’s pin-compatible 9100IQ and 9075IQ SiPs, powered by the Qualcomm® IQ-9100 and IQ-9075 processors, provide scalable, power-efficient and robust computing to autonomous devices and next-generation Industry 4.0 designs using advanced AI. The new IQ9 Series can enable:
- Robust safety functions in autonomous mobile robots (AMR) or platforms with functional safety (FuSa) up to level SIL-3 level (IQ-9100-based SiPs only)
- Device robustness with fault tolerance Error Correction Code (ECC) memory support and system cost savings by leveraging an integrated, dedicated safety island (IQ-9100) or real-time subsystem (IQ-9075) with four dedicated independent processing cores supporting real-time operating systems for system error monitoring and other critical functions.
- Robot perception, navigation and versatility improvement through a powerful Qualcomm® Adreno™ 663 GPU and support for up to 16 concurrent cameras.
- Interactive industrial edge AI systems utilizing up to 100 TOPS by integrating Large Language Model (LLM) support at the edge. The IQ9 Series Hexagon tensor processor can achieve a generation rate of 12 tokens per second when running the Llama 2 13B parameter mode.
- Fanless systems to enhance operating temperature with the SiP family supporting a -40°C to 115°C junction temperature range.
Learn more about Lantronix’s 9100IQ and 9075IQ SiP families here.
Lantronix’s Open-Q 8550CS for Advanced Video and AI Applications
Building on the success of its existing Open-Q SiP portfolio, Lantronix’s Open-Q 8550CS family, powered by Qualcomm® Technologies’ QSC8550 processor, delivers high AI performance, power efficiency and advanced Wi-Fi® 7 and Bluetooth® 5 connectivity, making it ideal for long-term, high-demand edge computing applications. Benefits include the abilities to:
- Enhance video conferencing meeting experiences, automated guided vehicle pathing, smart camera image quality and edge AI box scalability with the family’s octal-core computing capabilities and 48 AI TOPS tensor performance.
- Perform complex 3D rendering and computer vision tasks with a powerful Adreno 740 GPU supporting ray tracing, Open GL ES, Vulkan and Open CL profiles and 4K240/8K60 video decoding and 4K120/8K30 encoding.
- Connect edge AI boxes leveraging high-speed 2.5G and 10G Ethernet ports.
Learn more about Lantronix’s Open-Q 8550CS SiP family here.
Lantronix’s Open-Q 6490CS and 5430CS for Scalable AI Solutions
Lantronix’s pin-compatible Open-Q 6490CS and Open-Q 5430CS families, powered by Qualcomm® Technologies’ QCS6490 and QCS5430 processors, allow customers to scale their product lines with minimal development effort while benefiting from low-power AI performance, Wi-Fi 6E and BLE 5+ connectivity as well as flexible peripheral expansion. Features include:
- Real-time machine learning on 6th-generation AI engine, delivering 3.5 to 13 AI TOPS and complemented with up to octal-core CPU and Adreno 640 class GPU.
- Advanced multimedia and AI powered camera support through up to three concurrent ISPs supporting up to 192MP cameras, 4K30 encoding and 4K60 decoding, sufficient to handle up to 8 camera streams simultaneously for video-intensive applications.
- Percepxion™ device management for over-the-air (OTA) upgrades for performance, security and software feature improvements.
Learn more about Lantronix’s Open-Q 6490CS here and 5430CS families here.
About Lantronix
Lantronix Inc. is a global leader of compute and connectivity IoT solutions that target high-growth industries including Smart Cities, Automotive and Enterprise. Lantronix’s products and services empower companies to succeed in the growing IoT markets by delivering customizable solutions that address each layer of the IoT Stack. Lantronix’s leading-edge solutions include Intelligent Substations infrastructure, Infotainment systems and Video Surveillance, supplemented with advanced Out-of-Band Management (OOB) for Cloud and Edge Computing.
For more information, visit the Lantronix website.
“Safe Harbor” Statement under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements within the meaning of federal securities laws, including, without limitation, statements related to our Open-Q SIP solutions for Qualcomm developers. These forward-looking statements are based on our current expectations and are subject to substantial risks and uncertainties that could cause our actual results, future business, financial condition, or performance to differ materially from our historical results or those expressed or implied in any forward-looking statement contained in this news release. The potential risks and uncertainties include, but are not limited to, such factors as the effects of negative or worsening regional and worldwide economic conditions or market instability on our business, including effects on purchasing decisions by our customers; our ability to mitigate any disruption in our and our suppliers’ and vendors’ supply chains due to the COVID-19 pandemic or other outbreaks, wars and recent tensions in Europe, Asia and the Middle East, or other factors; future responses to and effects of public health crises; cybersecurity risks; changes in applicable U.S. and foreign government laws, regulations, and tariffs; our ability to successfully implement our acquisitions strategy or integrate acquired companies; difficulties and costs of protecting patents and other proprietary rights; the level of our indebtedness, our ability to service our indebtedness and the restrictions in our debt agreements; and any additional factors included in our Annual Report on Form 10-K for the fiscal year ended June 30, 2024, filed with the Securities and Exchange Commission (the “SEC”) on Sept. 9, 2024; as well as in our other public filings with the SEC. Additional risk factors may be identified from time to time in our future filings. The forward-looking statements included in this release speak only as of the date hereof, and we do not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
© 2024 Lantronix, Inc. All rights reserved. Lantronix is a registered trademark. Other trademarks and trade names are those of their respective owners.
Qualcomm-branded products are products of Qualcomm Technologies Inc. and/or its subsidiaries. Qualcomm and Adreno are trademarks or registered trademarks of Qualcomm Incorporated.
Lantronix Media Contact:
Gail Kathryn Miller
Corporate Marketing &
Communications Manager
media@lantronix.com
949-212-0960
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