Interlink Electronics, Inc. - LINK STOCK NEWS

Interlink Electronics (NASDAQ: LINK) has announced its participation at CES 2025, scheduled for January 7-10, 2025, in Las Vegas. The company will exhibit its sensor and printed electronics solutions, including new product releases, at the Venetian Expo, Hall A, Global Pavilions Area (Booth #50718). Interlink will be part of the Organic Electronics Association (OE-A) Pavilion, focusing on flexible and printed electronics. Last year's CES attracted over 115,000 attendees, including 40,000+ international visitors and 4,700+ media members.

Interlink Electronics (Nasdaq: LINK) announces its participation at the Printed Electronics Forum during electronica 2024 in Munich, Germany. Vice President Declan Flannery will present on printed piezoelectric sensing solutions for automotive applications on November 14, 2024. The presentation will focus on thin, lightweight, flexible printed polymer sensors that function as dynamic strain gauges, vibration sensors, and solid-state switches. These sensors can be integrated with machine learning and AI for automotive industry applications. The company specializes in sensor and printed electronics solutions across various sectors including HMI devices, IoT solutions, medical devices, automotive, and environmental monitoring.

Interlink Electronics (Nasdaq: LINK) has announced key personnel changes to strengthen its leadership team. Lars Timmer joins as Senior Business Development Manager in Europe, bringing 27 years of experience in business development and engineering, particularly in HMI, Automation, and Life Sciences. The company also promoted Declan Flannery to Vice President of Strategic Alliances after 18 years with the company, and Dr. Sreeni Rao to Vice President of Product Management, leveraging his 36 years of industry experience in MEMS and environmental sensors.

Interlink Electronics (Nasdaq: LINK) announces its participation at Electronica 2024, the world's leading electronics industry trade fair, scheduled for November 12-15, 2024, in Munich, Germany. The event, which serves as a major innovation platform for the electronics industry, is expected to attract approximately 70,000 visitors globally. The company will showcase at Hall 3, Booth 520, during the event which covers various sectors from automation to smart energy. The exhibition runs Tuesday through Thursday from 9am-6pm and Friday from 9am-3pm at the Trade Fair Center Messe Munchen.

Interlink Electronics (NASDAQ: LINK) reported Q3 2024 financial results with revenue of $2.7 million, down 13% year-over-year. The decline was attributed to lower shipments of force-sensor products and printed electronics at Calman Technology subsidiary, partially offset by higher gas-sensor product sales. Gross margin decreased to 41.4% from 47.4% in the prior year quarter. The company reported a net loss of $523,000 compared to a loss of $125,000 in Q3 2023. Cash and cash equivalents stood at $3.8 million at quarter-end. Management remains optimistic about growth prospects for 2025-2026, planning sales team expansion and focusing on new customer acquisition.

Interlink Electronics, Inc. (Nasdaq: LINK) has announced its participation in the H.C. Wainwright 26th Annual Global Investment Conference, scheduled for September 9-11, 2024. The event will be held both in-person at the Lotte New York Palace Hotel in New York City and virtually, featuring over 550 company presentations. Steven Bronson, CEO of Interlink, will provide an overview of the company's business during a presentation on September 10, 2024, at 12:30pm EDT. The presentation will be available on-demand starting September 9 at 7:00 A.M. (ET). Institutional investors interested in attending can register through the provided link.

Interlink Electronics, Inc. (Nasdaq: LINK), a leading provider of sensors and printed electronic solutions, is set to present at the 2024 Annual Gateway Conference in San Francisco. The company's management team will deliver a presentation on September 4th at 12:00pm PT, which will be webcast live and available for replay. This event offers Interlink an opportunity to showcase its expertise in Human-Machine Interface devices and Internet-of-Things solutions.

In addition to the presentation, Interlink executives will be available for one-on-one meetings throughout the conference, providing investors with direct access to company leadership. Interested parties can request an invitation or schedule a meeting by emailing conference@gateway-grp.com. This participation underscores Interlink's commitment to investor relations and market visibility.

Interlink Electronics (Nasdaq: LINK) announced a 28% drop in Q2 2024 revenue to $2.9 million, largely due to lower shipments of traditional force-sensor and gas-sensor products. Revenue for the first half of 2024 decreased 18% to $6.0 million compared to H1 2023. Gross margin fell to 45.0% from 50.9% in Q2 2023, influenced by product mix changes. Net income/loss shifted to a loss of $307,000 compared to a net income of $381,000 in Q2 2023. Adjusted EBITDA dropped to ($80,000) from $579,000 in Q2 2023. Cost reduction initiatives aim for annual savings over $500,000 through workforce right-sizing and supplier changes. The company is expanding its operations, launching a new R&D center in Silicon Valley and planning a European sales office. Despite a slowdown in demand, the CEO emphasized ongoing strategic growth initiatives.

Interlink Electronics (NASDAQ: LINK) has announced the launch of new electrochemical gas sensors aimed at Outdoor Air Quality (OAQ) monitoring. These sensors, targeting key gases such as Nitrogen Dioxide, Carbon Monoxide, Sulphur Dioxide, and Ozone, will be showcased at the Sensors Converge Conference in Santa Clara on June 25-26. Designed to address air quality issues caused by wildfires, these sensors are noted for their ultra-low power operation, small size, and easy deployability. CEO Steven N. Bronson highlighted that this development is part of an SBIR R&D award from the US NOAA agency and aligns with the company’s commitment to environmental safety.