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SEALSQ Joins Forces with IC’ALPS To Accelerate Secure ASICs Development

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SEALSQ Corp (NASDAQ: LAES) announced a partnership with IC'ALPS to enhance its Application Specific Integrated Circuit (ASIC) development capabilities. The collaboration aims to combine IC'ALPS' ASIC design expertise with SEALSQ's security IP portfolio and production know-how. This strategic initiative follows SEALSQ's 2024 focus on quantum-resistant chip technology and engagement with major electronics manufacturers for custom quantum-resistant secure chips based on the QS7001 architecture.

The first product from this partnership, SEALSQ's QVault TPM, is expected to have initial samples available in Q1 2025. The collaboration is designed to streamline development timelines and improve scalability, offering faster access to customized ASIC solutions for demanding industries.

SEALSQ Corp (NASDAQ: LAES) ha annunciato una partnership con IC'ALPS per migliorare le sue capacità di sviluppo di circuiti integrati specifici per applicazione (ASIC). La collaborazione mira a combinare l'expertise di IC'ALPS nel design degli ASIC con il portfolio di IP di sicurezza di SEALSQ e il know-how produttivo. Questa iniziativa strategica segue il focus di SEALSQ nel 2024 sulla tecnologia dei chip resistenti ai quanti e sull'interazione con principali produttori di elettronica per chip sicuri personalizzati basati sull'architettura QS7001.

Il primo prodotto di questa partnership, il QVault TPM di SEALSQ, è previsto avere campioni iniziali disponibili nel primo trimestre del 2025. La collaborazione è concepita per snellire i tempi di sviluppo e migliorare la scalabilità, offrendo un accesso più rapido a soluzioni ASIC personalizzate per industrie esigenti.

SEALSQ Corp (NASDAQ: LAES) anunció una asociación con IC'ALPS para mejorar sus capacidades de desarrollo de circuitos integrados específicos para aplicaciones (ASIC). La colaboración tiene como objetivo combinar la experiencia en diseño de ASIC de IC'ALPS con el portafolio de propiedad intelectual de seguridad de SEALSQ y su conocimiento en producción. Esta iniciativa estratégica sigue el enfoque de SEALSQ en 2024 sobre tecnología de chips resistentes a la cuántica y la interacción con importantes fabricantes de electrónica para chips seguros personalizados basados en la arquitectura QS7001.

Se espera que el primer producto de esta asociación, el QVault TPM de SEALSQ, tenga muestras iniciales disponibles en el primer trimestre de 2025. La colaboración está diseñada para agilizar los plazos de desarrollo y mejorar la escalabilidad, ofreciendo un acceso más rápido a soluciones ASIC personalizadas para industrias exigentes.

SEALSQ Corp (NASDAQ: LAES)는 IC'ALPS와 파트너십을 체결하여 애플리케이션 특화 집적 회로(ASIC) 개발 능력을 향상시키기로 했습니다. 이 협력은 IC'ALPS의 ASIC 설계 전문성과 SEALSQ의 보안 IP 포트폴리오 및 생산 노하우를 결합하는 것을 목표로 하고 있습니다. 이 전략적 이니셔티브는 SEALSQ가 2024년에 양자 저항 칩 기술에 집중하고 QS7001 아키텍처를 기반으로 한 맞춤형 양자 저항 보안 칩을 위해 주요 전자 제조업체와 협력하는 것을 따릅니다.

이 파트너십의 첫 번째 제품인 SEALSQ의 QVault TPM은 2025년 1분기에 초기 샘플이 제공될 것으로 예상됩니다. 이 협력은 개발 일정을 단축하고 확장성을 개선하여 요구가 높은 산업을 위한 맞춤형 ASIC 솔루션에 더 빠르게 접근할 수 있도록 설계되었습니다.

SEALSQ Corp (NASDAQ: LAES) a annoncé un partenariat avec IC'ALPS pour améliorer ses capacités de développement de circuits intégrés spécifiques à une application (ASIC). La collaboration vise à combiner l'expertise en conception d'ASIC d'IC'ALPS avec le portefeuille de propriété intellectuelle de sécurité de SEALSQ et son savoir-faire de production. Cette initiative stratégique fait suite à l'accent mis par SEALSQ en 2024 sur la technologie des puces résistantes aux quantiques et l'engagement auprès des principaux fabricants d'électronique pour des puces sécurisées personnalisées basées sur l'architecture QS7001.

Le premier produit issu de ce partenariat, le QVault TPM de SEALSQ, devrait avoir des échantillons initiaux disponibles au premier trimestre 2025. La collaboration est conçue pour rationaliser les délais de développement et améliorer la scalabilité, offrant un accès plus rapide à des solutions ASIC personnalisées pour des secteurs exigeants.

SEALSQ Corp (NASDAQ: LAES) gab eine Partnerschaft mit IC'ALPS bekannt, um die Entwicklungsfähigkeiten von anwendungsspezifischen integrierten Schaltungen (ASIC) zu verbessern. Die Zusammenarbeit zielt darauf ab, die ASIC-Entwicklungskompetenz von IC'ALPS mit dem Sicherheits-IP-Portfolio und dem Produktionswissen von SEALSQ zu kombinieren. Diese strategische Initiative folgt auf SEALSQs Fokus im Jahr 2024 auf quantumresistente Chip-Technologie und die Zusammenarbeit mit großen Elektronikherstellern zur Herstellung maßgeschneiderter quantumresistenter Sicherheitschips auf Basis der QS7001-Architektur.

Das erste Produkt aus dieser Partnerschaft, SEALSQs QVault TPM, wird voraussichtlich im ersten Quartal 2025 erste Muster verfügbar haben. Die Zusammenarbeit soll die Entwicklungszeiten optimieren und die Skalierbarkeit verbessern, um schneller auf maßgeschneiderte ASIC-Lösungen für anspruchsvolle Branchen zugreifen zu können.

Positive
  • Strategic partnership with IC'ALPS enhances ASIC development capabilities
  • First product (QVault TPM) samples expected in Q1 2025
  • Potential for new revenue streams through custom quantum-resistant chip development
  • Access to major electronics manufacturers for custom chip development
Negative
  • Long and complex ASIC development process may impact time-to-market
  • High development costs associated with custom chip solutions

Insights

The partnership between SEALSQ and IC'ALPS represents a strategic move in the post-quantum cryptography hardware space. The focus on developing custom quantum-resistant ASICs based on QS7001 architecture shows market foresight, as the industry prepares for quantum computing threats. The planned QVault TPM product launch in Q1 2025 demonstrates tangible progress.

However, several critical factors warrant caution. ASIC development cycles are notoriously long and expensive, with high upfront costs. For a company with a $13.4M market cap, this represents significant resource allocation risk. While the partnership may accelerate development, the timeline to revenue generation and profitability remains uncertain. The quantum-resistant chip market, while promising, is still emerging with unclear adoption rates.

The ASIC semiconductor market is experiencing strong demand growth, particularly in security applications. SEALSQ's strategic pivot to custom quantum-resistant chips could position them well in this expanding market. However, the company faces intense competition from larger, well-funded semiconductor firms already operating in this space.

The partnership with IC'ALPS helps address technical capabilities but doesn't solve the fundamental challenge of market penetration and customer acquisition. Given SEALSQ's market cap and resources, successfully commercializing these products and capturing meaningful market share will be challenging. The Q1 2025 timeline for initial samples suggests revenue impact won't be material in the near term.

Geneva, Switzerland, Dec. 10, 2024 (GLOBE NEWSWIRE) --


SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announced that it is strengthening its Application Specific Integrated Circuit (ASIC) developments in partnership with IC’ALPS to face growing demand in the segment.

In 2024, SEALSQ embarked on a strategic initiative to capitalize on its innovative quantum-resistant chip technology. The Company engaged with major electronics manufacturers to explore the development of custom quantum-resistant secure chips based on the QS7001 architecture, tailored to meet specific customer requirements. This move into the post-quantum ASIC segment marked a pivotal advancement in SEALSQ's commercial and industrial strategy, unlocking access to potentially substantial new business opportunities and revenue streams.

Designing ASICs is a long and complex process due to the intricate requirements of customization, rigorous validation, and precision manufacturing required to meet specific application demands. SEALSQ, in collaboration with IC'ALPS, is poised to redefine this process by leveraging IC'ALPS' cutting-edge ASIC design expertise together with SEALSQ's rich security IP portfolio and production know-how. Together, the teams will streamline development timelines and enhance scalability, offering clients accelerated access to high-performance, tailored ASIC solutions for even the most demanding industries. A prime example of this synergy is SEALSQ’s own QVault TPM, the first product born from this collaboration, with initial samples expected as early as Q1 2025.

“This collaboration was a true partnership, with each team bringing its own expertise and approach,” said Lucille Engels, COO of IC'ALPS. “Drawing on our experience, we adapted our methods to meet SEALSQ’s rigorous security standards. This partnership underlines our commitment to supporting our customers in the development of their products.”

“The collaboration between IC’ALPS and SEALSQ exemplifies the dynamic and innovative spirit of the French semiconductor ecosystem,” added Jean Pierre Enguent, CTO of SEALSQ, “This partnership showcases how mid-sized high-tech companies can unite their expertise to fast-track the development of cutting-edge products that not only meet market demands, but rival the capabilities of larger corporations. By combining agility with innovation, we are setting a benchmark for excellence in the competitive global semiconductor industry”.

About Post-Quantum Microcontrollers
Post-quantum microcontrollers are being developed to integrate post-quantum cryptographic algorithms and security features. Key activities include research, integration of algorithms, adding hardware-based security features, standardization, deployment in various applications, and raising awareness about their importance. These microcontrollers aim to secure digital systems against potential threats posed by quantum computing technology.

About ASICs
ASICs are specialized integrated circuits designed to perform specific functions or tasks within a particular application domain. They offer advantages such as higher performance, lower power consumption, and reduced size and cost compared to alternative solutions like field-programmable gate arrays (FPGAs) or general-purpose microcontrollers.

Overall, the ASIC market is characterized by steady growth, driven by technological advancements and increasing demand for customized solutions across various industries.

  • Market Size: The global application-specific integrated circuit (ASIC) market is expected to grow from $21.53 billion in 2024 to approximately $36.80 billion by 2032, with a Compound Annual Growth Rate (CAGR) of 6.9% during the forecast period (Source: Fortune Business Insights, 2024).
  • Application Areas: ASICs are widely used in telecommunications, automotive, consumer electronics, industrial automation, and healthcare sectors.
  • Technology Trends: Advancements in process nodes and packaging technologies are enabling higher integration, improved performance, reduced power consumption, driving innovations in AI, IoT, and 5G applications.
  • Emerging Markets: Growing demand for low-power ASICs is evident in IoT and sensor applications, as well as in automotive sectors, including Advanced Driver-Assistance Systems (ADAS), autonomous vehicles, and electric vehicles (EVs).
  • Security Concerns: To mitigate cybersecurity threats, especially in IoT and cloud computing, ASIC vendors are integrating robust hardware-based security features, such as encryption and authentication.

About IC’Alps
IC’Alps is your one-stop-shop ASIC partner. Based in France (HQ in Grenoble, two design centers in Grenoble and Toulouse), the company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. Its 100+ engineers’ areas of expertise include analogic, digital and mixed-signal circuits (sensor/MEMS interfaces, ultra-low power consumption, power management, high-resolution converters, high voltage, signal processing, ARM and RISC-V based multiprocessors architectures, hardware accelerators) on technologies from 0.18 µm down to 3 nm, and from multiple foundries (TSMC, Global Foundries, Tower Semiconductor, X-FAB, STMicroelectronics, etc.). The company is active worldwide in medical, industrial, automotive, IoT, IA, mil-aero and digital identity & security sectors. IC’Alps is ISO 9001:2015, ISO 13485:2016, EN 9100:2018, Common Criteria certified, IATF16949-ready, member of TSMC Design Center Alliance (DCA), ams Osram Preferred Partner and X-FAB’s partner network.
More information on www.icalps.com and follow us on https://www.linkedin.com/company/ic-alps

About SEALSQ:
SEALSQ focuses on selling integrated solutions based on Semiconductors, PKI and Provisioning services, while developing Post-Quantum technology hardware and software products. Our solutions can be used in a variety of applications, from Multi-Factor Authentication tokens, Smart Energy, Smart Home Appliances, Medical and Healthcare and IT Network Infrastructure, to Automotive, Industrial Automation and Control Systems.

Post-Quantum Cryptography (PQC) refers to cryptographic methods that are secure against an attack by a quantum computer. As quantum computers become more powerful, they may be able to break many of the cryptographic methods that are currently used to protect sensitive information, such as RSA and Elliptic Curve Cryptography (ECC). PQC aims to develop new cryptographic methods that are secure against quantum attacks. For more information, please visit www.sealsq.com.

Forward-Looking Statements
This communication expressly or implicitly contains certain forward-looking statements concerning SEALSQ Corp and its businesses. Forward-looking statements include statements regarding our business strategy, financial performance, results of operations, market data, events or developments that we expect or anticipates will occur in the future, as well as any other statements which are not historical facts. Although we believe that the expectations reflected in such forward-looking statements are reasonable, no assurance can be given that such expectations will prove to have been correct. These statements involve known and unknown risks and are based upon a number of assumptions and estimates which are inherently subject to significant uncertainties and contingencies, many of which are beyond our control. Actual results may differ materially from those expressed or implied by such forward-looking statements. Important factors that, in our view, could cause actual results to differ materially from those discussed in the forward-looking statements include SEALSQ’s ability to implement its growth strategies; SEALSQ’s ability to successfully launch post-quantum semiconductor technology; SEALSQ’s ability to capture a share of the quantum semiconductor market; the growth of the quantum computing market; SEALSQ’s ability to expand its U.S. operations; SEALSQ’s ability to enhance its production facilities in the U.S. and France; SEALSQ’s ability to make additional investments towards the development of a new generation of quantum-ready semiconductors; the success of SEALCOIN; SEALSQ’s ability to continue beneficial transactions with material parties, including a limited number of significant customers; market demand and semiconductor industry conditions; the growth of the quantum computing market; and the risks discussed in SEALSQ’s filings with the SEC. Risks and uncertainties are further described in reports filed by SEALSQ with the SEC.

SEALSQ Corp is providing this communication as of this date and does not undertake to update any forward-looking statements contained herein as a result of new information, future events or otherwise.

Press and Investor Contacts

SEALSQ Corp.
Carlos Moreira
Chairman & CEO
Tel: +41 22 594 3000
info@sealsq.com
SEALSQ Investor Relations (US)
The Equity Group Inc.
Lena Cati
Tel: +1 212 836-9611 / lcati@equityny.com
Katie Murphy
Tel: +212 836-9612 / kmurphy@equityny.com

FAQ

When will SEALSQ (LAES) release the first samples of QVault TPM?

SEALSQ expects to release the initial samples of QVault TPM in Q1 2025.

What is the purpose of SEALSQ's (LAES) partnership with IC'ALPS?

The partnership aims to accelerate ASIC development by combining IC'ALPS' design expertise with SEALSQ's security IP portfolio and production know-how.

What technology is SEALSQ (LAES) developing with major electronics manufacturers?

SEALSQ is developing custom quantum-resistant secure chips based on the QS7001 architecture.

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