SEALSQ Corp Ordinary Shares - LAES STOCK NEWS

SEALSQ Corp (NASDAQ: LAES) announced a partnership with IC'ALPS to enhance its Application Specific Integrated Circuit (ASIC) development capabilities. The collaboration aims to combine IC'ALPS' ASIC design expertise with SEALSQ's security IP portfolio and production know-how. This strategic initiative follows SEALSQ's 2024 focus on quantum-resistant chip technology and engagement with major electronics manufacturers for custom quantum-resistant secure chips based on the QS7001 architecture.

The first product from this partnership, SEALSQ's QVault TPM, is expected to have initial samples available in Q1 2025. The collaboration is designed to streamline development timelines and improve scalability, offering faster access to customized ASIC solutions for demanding industries.

SEALSQ (NASDAQ: LAES) has launched the INeS Box, a new solution for secure digital identity provisioning in manufacturing connected devices. The product features a portable industrial computer with 128 GB SSD and FIPS 140-3 certified Hardware Security Module, offering secure storage for private keys and certificates.

The INeS Box is designed for manufacturers in industries requiring secure connectivity, such as EV charging, medical IoT, and smart home devices. It provides automated provisioning operations, flexible configurations, and cost-efficient implementation with preset certificate credits and technical support.

This launch aligns with the growing IoT Identity and Access Management market, which is projected to expand from $4.9 billion in 2021 to $47.2 billion by 2031, with a CAGR of 25.4%.

SEALSQ Corp (NASDAQ: LAES) has launched INeS PKI, a quantum-resistant Public Key Infrastructure solution for IoT security. The system features advanced encryption using CRYSTALS-Kyber and CRYSTALS-Dilithium algorithms, offering multi-layered deployment options including on-chip, cloud-based, and on-premise solutions. Key features include advanced key management services, global compliance with industry standards, high-performance infrastructure with hardware security modules, and comprehensive device identity solutions. The platform targets applications in smart cities, healthcare IoT, industrial IoT, and connected vehicles.

SEALSQ and its parent company WISeKey announced their continued integration of Artificial Intelligence into their platforms, building on the Digital Human Rights Declaration principles. The companies are enhancing their cybersecurity measures through several key initiatives: the WISeAI.IO platform which uses machine learning to strengthen PKI systems, Generative AI integration into the AIoT platform enabling autonomous learning for IoT devices, the INeS AI Security Broker combining AI and PKI technologies for certificate management, and development of AI-enhanced post-quantum semiconductors for advanced threat defense.

SEALSQ Corp (NASDAQ: LAES) has begun quality and functional testing of its quantum-resistant hardware platform, QS7001. The company is on track for 2025 production and delivery of its Quantum-Resistant Secure Chips portfolio, including the QS7001 Open Platform and QVault TPM. The QS7001 is a RISC-V-based platform with CCEAL5+ certification, supporting Kyber and Dilithium algorithms. The global TPM market is projected to reach $5.97 billion by 2030 with a 10.8% CAGR, while the ASIC market is expected to hit $35.5 billion by 2030 with an 8.2% CAGR.

SEALSQ Corp (NASDAQ: LAES) announced its advancement in post-quantum chips designed to protect critical infrastructure against quantum cyberattacks. The company's chips feature certified quantum-resistant security, specifically engineered to safeguard sectors like healthcare, energy, finance, and agriculture from future quantum decryption threats. SEALSQ is collaborating with major electronics manufacturers to develop customized quantum-resistant chips, positioning itself as a key player in securing digital and robotic ecosystems during the transition to automation.

SEALSQ Corp (NASDAQ: LAES) provided an update on addressing its non-compliance with Nasdaq's minimum bid price requirement. The company has until January 28, 2025 to regain compliance, requiring its shares to trade at $1.00 or above for at least 10 consecutive business days. SEALSQ aims to achieve compliance through its semiconductor segment activities. If unsuccessful, the company plans to request an additional 180-day extension, confirming it currently meets all necessary criteria for such an extension. The company may consider a reverse stock split if needed to maintain Nasdaq listing.

SEALSQ (NASDAQ: LAES) announced strengthening its strategic collaboration with parent company WISeKey to integrate cutting-edge technologies across three verticals: semiconductors, satellite connectivity, and blockchain. The partnership combines SEALSQ's post-quantum cryptographic chips with WISeKey's cybersecurity and IoT solutions. Key developments include advanced semiconductor solutions for IoT sensors, WISeSat's low-earth orbit nanosatellite connectivity, and the SEALCOIN platform for blockchain-enabled M2M transactions. The SEALCOIN Beta release is expected in Q1 2025 on the Hedera TestNet, with SEALSQ serving as a semiconductor supplier through SEALCOIN AG.

SEALSQ Corp (NASDAQ: LAES) announced its alignment with the newly adopted COP29 standards to enhance sustainability in the IoT industry. The company is integrating blockchain technology to provide transparent carbon credit tracking and management, following the establishment of new carbon crediting framework standards at the UN COP29 climate summit in Baku, Azerbaijan. SEALSQ's initiative, in collaboration with CarbonMinus, aims to address challenges in carbon markets through a digitized, fraud-resistant system that enables companies to efficiently manage CO₂ offsets and contribute to global climate goals while maintaining operational efficiency.