KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
KLA has unveiled a comprehensive portfolio of process control and process-enabling solutions for IC substrate (ICS) manufacturing. The new offerings aim to drive chip performance through panel-based interconnect innovation. Key highlights include:
1. Extended capabilities of the Corus™ direct imaging platform
2. Introduction of the Serena™ direct imaging platform for advanced IC substrate lithography
3. New Lumina™ inspection and metrology systems for IC substrates and panel-based interposers
These solutions are designed to help manufacturers achieve higher yield, accelerate delivery cycles, and improve profitability in advanced packaging applications. The portfolio also includes proven KLA process control solutions and Frontline software for engineering, CAM, and production data analytics.
KLA ha presentato un portafoglio completo di soluzioni per il controllo dei processi e per abilitarli nella produzione di substrati IC (ICS). Le nuove offerte mirano a migliorare le prestazioni dei chip attraverso l'innovazione dell'interconnessione basata su pannelli. I punti salienti includono:
1. Capacità estese della piattaforma di imaging diretto Corus™
2. Introduzione della piattaforma di imaging diretto Serena™ per la litografia avanzata dei substrati IC
3. Nuovi sistemi di ispezione e metrologia Lumina™ per substrati IC e interposers basati su pannelli
Queste soluzioni sono progettate per aiutare i produttori a ottenere un rendimento più elevato, accelerare i cicli di consegna e migliorare la redditività nelle applicazioni di packaging avanzato. Il portafoglio include anche soluzioni di controllo dei processi KLA collaudate e software Frontline per ingegneria, CAM e analisi dei dati di produzione.
KLA ha presentado un portfolio completo de soluciones para el control de procesos y para facilitar la fabricación de sustratos IC (ICS). Las nuevas ofertas buscan impulsar el rendimiento de los chips a través de la innovación en interconexiones basadas en paneles. Los aspectos más destacados incluyen:
1. Capacidades ampliadas de la plataforma de imagen directa Corus™
2. Introducción de la plataforma de imagen directa Serena™ para la litografía avanzada de sustratos IC
3. Nuevos sistemas de inspección y metrología Lumina™ para sustratos IC y interposers basados en paneles
Estas soluciones están diseñadas para ayudar a los fabricantes a lograr un mayor rendimiento, acelerar los ciclos de entrega y mejorar la rentabilidad en aplicaciones de packaging avanzado. El portafolio también incluye soluciones de control de procesos KLA probadas y software Frontline para ingeniería, CAM y análisis de datos de producción.
KLA는 IC 기판(ICS) 제조를 위한 포괄적인 프로세스 제어 및 프로세스 지원 솔루션 포트폴리오를 공개했습니다. 새로운 제품들은 패널 기반의 상호 연결 혁신을 통해 칩 성능을 향상시키는 것을 목표로 하고 있습니다. 주요 하이라이트는 다음과 같습니다:
1. Corus™ 직접 이미징 플랫폼의 확장된 기능
2. 고급 IC 기판 리소그래피를 위한 Serena™ 직접 이미징 플랫폼 소개
3. IC 기판과 패널 기반 인터포저를 위한 새로운 Lumina™ 검사 및 측정 시스템
이 솔루션들은 제조업체들이 더 높은 수율을 달성하고, 납기 사이클을 가속화하며, 첨단 포장 애플리케이션에서 수익성을 개선하도록 설계되었습니다. 포트폴리오는 또한 검증된 KLA 프로세스 제어 솔루션과 엔지니어링, CAM, 생산 데이터 분석을 위한 Frontline 소프트웨어를 포함합니다.
KLA a dévoilé un portefeuille complet de solutions de contrôle de processus et de solutions facilitant le processus pour la fabrication de substrats IC (ICS). Les nouvelles offres visent à améliorer les performances des puces grâce à l'innovation de l'interconnexion basée sur des panneaux. Les faits saillants comprennent :
1. Capacités étendues de la plateforme d'imagerie directe Corus™
2. Introduction de la plateforme d'imagerie directe Serena™ pour la lithographie avancée des substrats IC
3. Nouveaux systèmes d'inspection et de métrologie Lumina™ pour les substrats IC et les interposeurs basés sur des panneaux
Ces solutions sont conçues pour aider les fabricants à atteindre un rendement plus élevé, à accélérer les cycles de livraison et à améliorer la rentabilité des applications d'emballage avancé. Le portefeuille comprend également des solutions de contrôle de processus KLA éprouvées et des logiciels Frontline pour l'ingénierie, le CAM et l'analyse des données de production.
KLA hat ein umfassendes Portfolio an Prozesskontroll- und prozessunterstützenden Lösungen für die Herstellung von IC-Substraten (ICS) vorgestellt. Die neuen Angebote zielen darauf ab, die Chip-Leistung durch panelbasierte Verbindungsinnovationen voranzutreiben. Die wichtigsten Highlights sind:
1. Erweiterte Funktionen der Corus™-Direktabtastplattform
2. Einführung der Serena™-Direktabtastplattform für fortschrittliche IC-Substrat-Lithografie
3. Neue Lumina™-Inspektions- und Messtechniksysteme für IC-Substrate und panelbasierte Interposer
Diese Lösungen sind darauf ausgelegt, Herstellern zu helfen, höhere Ausbeuten zu erzielen, Lieferzyklen zu beschleunigen und die Rentabilität in fortschrittlichen Verpackungsanwendungen zu verbessern. Das Portfolio umfasst auch bewährte KLA-Prozesskontrolllösungen und Frontline-Software für Engineering, CAM und Produktionsdatenanalysen.
- Introduction of a comprehensive portfolio for IC substrate manufacturing
- Extended capabilities of Corus™ direct imaging platform
- Launch of Serena™ direct imaging platform for advanced IC substrate lithography
- Introduction of Lumina™ inspection and metrology systems
- Potential for higher yield, faster delivery cycles, and improved profitability for customers
- None.
Insights
KLA's new portfolio for IC substrate manufacturing represents a significant advancement in advanced semiconductor packaging technology. The introduction of the Serena™ direct imaging platform and the extension of the Corus™ platform address critical needs in lithography for high-density interconnects. This move positions KLA at the forefront of the industry's shift towards more complex packaging solutions.
The Lumina™ inspection and metrology system is particularly noteworthy, as it integrates AI-based review and classification. This automation can significantly reduce human error and increase efficiency in defect detection. The system's compatibility with KLA's copper shaping solutions creates a more streamlined manufacturing process.
By offering a comprehensive suite of tools spanning direct imaging, inspection, metrology and software solutions, KLA is enabling manufacturers to tackle the challenges of decreasing feature sizes and increasing package dimensions. This integrated approach could lead to faster time-to-market and improved yields for advanced IC substrates, which is important in high-performance computing applications.
KLA's strategic expansion into advanced IC substrate solutions is likely to strengthen its market position and potentially drive revenue growth. The semiconductor packaging market is projected to grow significantly, driven by demand for high-performance computing, AI and 5G technologies. By offering a comprehensive portfolio, KLA can capture a larger share of this expanding market.
The company's focus on AI-integrated solutions and automation aligns with industry trends towards smart manufacturing, which could lead to increased adoption of KLA's products. The ability to improve yield and reduce production cycles for customers is a strong value proposition that could justify premium pricing for KLA's solutions.
Investors should note that while this portfolio expansion represents a growth opportunity, it may also require significant R&D investment. The impact on KLA's financials will depend on market adoption rates and the company's ability to maintain its technological edge in a competitive landscape. Overall, this move reinforces KLA's position as a key enabler in the semiconductor ecosystem, which could positively impact long-term shareholder value.
- New portfolio drives chip performance with panel-based interconnect innovation
- KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging platform to support mainstream and advanced IC substrate lithography requirements
- New Lumina™ inspection and metrology systems further equip IC substrate (including glass core) and panel-based interposer makers to efficiently build advanced products with high quality and yield
Advanced packaging continues to adopt heterogeneous integration methods to bring together multiple semiconductor components for performance, power and cost benefits. To meet evolving interconnect requirements, innovation is accelerating for panel-based intermediate packaging levels like IC substrates and interposers. These technologies are used to efficiently connect chips and printed circuit boards (PCBs). As package dimensions increase, feature sizes decrease and novel materials such as glass are introduced, manufacturers can leverage KLA's solution portfolio to achieve higher yield, accelerate delivery cycles and improve overall profitability.
KLA's comprehensive portfolio of direct imaging (DI), defect inspection, shaping, metrology, chemistry process control and intelligent software solutions optimizes the advanced packaging manufacturing workflow.
KLA's portfolio includes multiple direct imaging solutions supporting a range of customer lithography requirements. Market adoption of the Corus™ direct imaging platform demonstrates its proven capability at providing a highly flexible and efficient imaging solution. To meet evolving needs for applications like IC substrates and next-gen high-density interconnect (HDI), the capability is being extended with next-generation optics and lasers to optimize dynamic imaging and layer-to-layer accuracy at speed, even for varying panel topographies.
For advanced IC substrate applications, direct imaging represents a new category beyond steppers for lithography. KLA is introducing the new Serena™ direct imaging platform for quality, finer line patterning of large-sized, high layer count organic substrates for increased accuracy and yield with the efficiency of a flexible digital solution.
Lumina™, KLA's new inspection and metrology system for advanced IC substrates (including glass core) and panel-based interposers, enables high-sensitivity detection and scanning metrology at optimized cost of ownership. The system delivers monitoring paired with AI-based review and classification for an actionable defect Pareto chart without the need for operator input, as well as a seamless integration with KLA's copper shaping solutions.
The portfolio is strengthened with proven KLA process control solutions featuring the Orbotech Ultra PerFix™, EcoNet™, Zeta™-6xx, ICOS™ T890, Quali-Fill® Libra® and QualiLab® Elite product lines. KLA's Frontline software solutions span engineering, computer-aided manufacturing (CAM) and production data analytics to centralize and apply intelligence throughout IC substrate manufacturing, building on KLA's longtime leadership in yield management.
"With today's portfolio news, KLA is affirming our leadership in semiconductor ecosystem innovation," said Oreste Donzella, executive vice president and chief strategy officer, KLA Corporation. "IC substrates and other panel-level packaging technologies are essential to advancing connectivity within tomorrow's high-performance chips, and KLA is collaboratively engaged with customers in solving complex production challenges to maximize their yield and business success."
For more information about KLA's comprehensive portfolio of IC substrate solutions, join us at the upcoming TPCA tradeshow.
About KLA
KLA Corporation ("KLA") develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging and printed circuit boards. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Investors and others should note that KLA announces material financial information including SEC filings, press releases, public earnings calls and conference webcasts using an investor relations website (ir.kla.com). Additional information may be found at: www.kla.com.
Forward-Looking Statements
Statements in this press release other than historical facts, such as statements regarding the expected performance of the IC substrate product portfolio are forward-looking statements, and are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations and involve risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including delays in the adoption of new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unanticipated technology challenges or limitations that affect the implementation, performance or use of KLA's products, and other risk factors included in KLA's annual report on Form 10-K for the year ended June 30, 2024 and other filings by KLA with the Securities and Exchange Commission (including, without limitation, the risk factors described therein). KLA assumes no obligation to, and do not currently intend to, update these forward-looking statements.
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SOURCE KLA Corporation
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